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    Epoxy resin based core filler material developing low exothermic heat
    6.
    发明授权
    Epoxy resin based core filler material developing low exothermic heat 有权
    发展低放热的环氧树脂基核心填料

    公开(公告)号：US08779032B2

    公开(公告)日：2014-07-15

    申请号：US13258665

    申请日：2010-03-26

    申请人： Sohaib Elgimiabi

    发明人： Sohaib Elgimiabi

    IPC分类号： C08G59/42 ,  C08G59/58 ,  C08L63/00

    CPC分类号： C08G59/56 ,  C08G59/3218 ,  C08G59/4215 ,  C08K3/013 ,  C08K3/22 ,  C08K3/32 ,  C08K5/1539 ,  C08K5/17 ,  C08L63/00

    摘要： The present disclosure provides curable compositions such as curable compositions including: (i) at least one epoxy resin comprising at least one aromatic or aromatic-derived moiety but not containing an aromatic amine moiety; (ii) an epoxide hardener system comprising: (a) a carboxylic acid anhydride, (b) a first amine having a melting point from about 30° C. to about 100° C. and containing at least one primary amine group; and (c) a second amine having a melting point of from about 50° C. to about 180° C. and having at least one primary amine group, wherein the first and second amines have a difference in melting points of at least 10° C.; and (iii) a filler capable of reducing the density of the curable composition. Also provided are compositions obtainable by curing the curable composition and methods of using the curable composition to fill voids in honeycomb structures.

    摘要翻译： 本公开提供可固化组合物，例如可固化组合物，其包括：（i）至少一种包含至少一种芳族或芳族衍生部分但不含芳族胺部分的环氧树脂; （ii）环氧化物硬化剂体系，其包含：（a）羧酸酐，（b）熔点为约30℃至约100℃并含有至少一个伯胺基团的第一胺; 和（c）熔点为约50℃至约180℃并具有至少一个伯胺基的第二胺，其中第一和第二胺的熔点差为至少10° C。; 和（iii）能够降低可固化组合物密度的填料。 还提供了通过固化可固化组合物获得的组合物和使用可固化组合物填充蜂窝结构中的空隙的方法。

    VIBRATION DAMPENING COMPOSITIONS
    7.
    发明申请
    VIBRATION DAMPENING COMPOSITIONS 有权
    振动阻尼组合物

    公开(公告)号：US20090212252A1

    公开(公告)日：2009-08-27

    申请号：US12334676

    申请日：2008-12-15

    申请人： Sohaib Elgimiabi

    发明人： Sohaib Elgimiabi

    IPC分类号： E04B1/74 ,  C08L63/00

    CPC分类号： C08G59/226 ,  C08G59/184 ,  C08L63/00 ,  C08L2205/20 ,  C08L2666/12 ,  C08L2666/54 ,  C08L2666/72 ,  C09D163/00 ,  F16F7/12 ,  F16F2224/0233 ,  F16F2224/0241 ,  F16F2224/025 ,  C08L2666/20

    摘要： A curable precursor composition for preparing a vibration dampening composition having a density of less than 0.9 g/cm3 said precursor composition comprising (i) one or more rigid epoxy resin (ii) one or more flexible epoxy resin, (iii) a first set of hollow microspheres, (iv) a second set of hollow microspheres wherein the microspheres of the first set are different in composition from the microspheres of the second set and, a curing agent capable of cross-linking the rigid and flexible epoxy resins. Also provided are vibration dampening compositions obtainable from the precursor compositions and methods of preparing such vibration dampening compositions.

    摘要翻译： 一种用于制备密度小于0.9g / cm 3的减振组合物的可固化前体组合物，所述前体组合物包含（i）一种或多种刚性环氧树脂（ii）一种或多种柔性环氧树脂，（iii）第一组 中空微球体，（iv）第二组中空微球，其中第一组的微球体的组成与第二组的微球体不同，以及能够交联刚性和柔性环氧树脂的固化剂。 还提供了可从前体组合物获得的减振组合物和制备这种减震组合物的方法。

    Metal panel assembly and method for making same
    8.
    发明授权
    Metal panel assembly and method for making same 有权
    金属面板组装及其制作方法

    公开(公告)号：US09452462B2

    公开(公告)日：2016-09-27

    申请号：US14122289

    申请日：2012-04-17

    申请人： Sohaib Elgimiabi

    发明人： Sohaib Elgimiabi

    IPC分类号： B21D39/02 ,  B62D27/02 ,  C09J5/06 ,  C09J163/00 ,  B60J5/04 ,  F16B11/00

    CPC分类号： B21D39/021 ,  B21D39/028 ,  B60J5/0469 ,  B62D27/02 ,  B62D27/026 ,  C09J5/06 ,  C09J163/00 ,  C09J2400/163 ,  C09J2463/00 ,  F16B11/006 ,  Y10T29/49906 ,  Y10T428/192

    摘要： In accordance with the present invention there is provided a method of making a metal part assembly, the method comprising: —providing a first metal part and a second metal part wherein at least one of the first and second metal part comprises a metal panel; —providing an adhesive sheet having a first portion near a first end of the adhesive sheet and a second portion near a second end opposite to the first end of the adhesive sheet, the adhesive sheet comprising a thermosettable composition that comprises a mixture of a first and second epoxy compound and an epoxy curing agent, wherein the first epoxy compound has a weight average molecular weight of at least 1000 g/mol and has an amount of epoxy groups of between 5 and 10 mole % and the second epoxy compound has a weight average molecular weight of not more than 400 g/mol and wherein the weight ratio of first to second epoxy compound is between 0.8 and 4; —adhering said first and second metal part together such that the adhesive sheet is provided between said first and second metal part thereby forming a metal joint; and heating the metal joint so as to cause thermosetting of the thermosettable composition of the adhesive sheet.

    摘要翻译： 根据本发明，提供一种制造金属部件组件的方法，该方法包括： - 提供第一金属部件和第二金属部件，其中第一和第二金属部件中的至少一个包括金属板; - 提供具有靠近所述粘合片的第一端附近的第一部分和在与所述粘合片的第一端相对的第二端附近的第二部分的粘合片，所述粘合片包括可热固化组合物，其包含第一和第二部分的混合物 第二环氧化合物和环氧固化剂，其中所述第一环氧化合物的重均分子量为至少1000g / mol，并且环氧基团的量为5至10mol％，并且所述第二环氧化合物具有重均分子量 分子量不超过400g / mol，其中第一和第二环氧化合物的重量比在0.8和4之间; - 将所述第一和第二金属部分粘合在一起，使得所述粘合片设置在所述第一和第二金属部分之间，从而形成金属接头; 并加热金属接头以使粘合片的可热固组合物的热固化。

    EPOXY RESIN BASED CORE FILLER MATERIAL DEVELOPING LOW EXOTHERMIC HEAT
    10.
    发明申请
    EPOXY RESIN BASED CORE FILLER MATERIAL DEVELOPING LOW EXOTHERMIC HEAT 有权
    基于环氧树脂的核心填充材料开发低热发热

    公开(公告)号：US20120022185A1

    公开(公告)日：2012-01-26

    申请号：US13258665

    申请日：2010-03-26

    申请人： Sohaib Elgimiabi

    发明人： Sohaib Elgimiabi

    IPC分类号： C08L63/00 ,  C08K13/04 ,  B29C35/00 ,  C08K3/32

    CPC分类号： C08G59/56 ,  C08G59/3218 ,  C08G59/4215 ,  C08K3/013 ,  C08K3/22 ,  C08K3/32 ,  C08K5/1539 ,  C08K5/17 ,  C08L63/00

    摘要： Curable compositions comprising (i) at least one epoxy resin comprising at least one aromatic moiety or a moiety derivable by hydrogenating an aromatic moiety and wherein the epoxy resin does not contain an aromatic amine moiety, (ii) an epoxide hardener system comprising (a) a carboxylic acid anhydride, (b) a first amine having a melting point from about 30° C. to about 100° C. and containing at least one primary amine group; and (c) a second amine having a melting point of from about 50° C. to about 180° C. and having at least one primary amine group, wherein the first and second amines are selected such that they have a difference in melting points of at least 10° C. and wherein the first and second amines are contained in minor amounts by weight as compared to the carboxylic acid anhydride; (iii) a filler capable of reducing the density of the curable composition and, optionally, (iv) a fire-retardant system that includes a mixture of: (a) at least one compound selected from the group comprising alkaline earth metal hydroxides and aluminium group hydroxides, and (b) at least one phosphorous-containing material, furthermore, cured compositions obtainable by curing the above curable composition, the use of the curable composition for filling of voids in honeycomb structures and processes for filing voids in honeycomb structures.

    摘要翻译： 可固化组合物，其包含（i）至少一种环氧树脂，其包含至少一个芳族部分或可通过氢化芳族部分得到的部分，并且其中所述环氧树脂不含芳族胺部分，（ii）环氧化物硬化剂体系，其包含（a） 羧酸酐，（b）熔点为约30℃至约100℃且含有至少一个伯胺基团的第一胺; 和（c）熔点为约50℃至约180℃的第二胺，并具有至少一个伯胺基，其中选择第一和第二胺使得它们具有熔点差 至少10℃，并且其中与羧酸酐相比，第一和第二胺的含量小于重量; （iii）能够降低可固化组合物的密度的填料，和任选地（iv）包含以下混合物的阻燃体系：（a）至少一种选自碱土金属氢氧化物和铝的化合物 组合氢氧化物，和（b）至少一种含磷材料，此外，通过固化上述可固化组合物可获得的固化组合物，使用用于填充蜂窝结构中的空隙的可固化组合物和在蜂窝结构中填充空隙的方法。