公开(公告)号：US07087512B2

公开(公告)日：2006-08-08

申请号：US10642092

申请日：2003-08-15

申请人： Harry Hedler ,  Roland Irsigler ,  Thorsten Meyer ,  Barbara Vasquez

发明人： Harry Hedler ,  Roland Irsigler ,  Thorsten Meyer ,  Barbara Vasquez

IPC分类号： H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05541 ,  H01L2224/05005 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166

摘要： A method for fabricating an integrated circuit connection region includes application of a dielectric to an integrated circuit with a connection region, application of a corrodible metalization layer to the dielectric, application of a protection device to the metalization layer, and removal of the protection device in a region around the connection region.

公开(公告)号：US06714418B2

公开(公告)日：2004-03-30

申请号：US10285924

申请日：2002-11-01

申请人： Gerd Frankowsky ,  Harry Hedler ,  Roland Irsigler ,  Thorsten Meyer ,  Barbara Vasquez

发明人： Gerd Frankowsky ,  Harry Hedler ,  Roland Irsigler ,  Thorsten Meyer ,  Barbara Vasquez

IPC分类号： H05K702

CPC分类号： H01L25/50 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15331 ,  H01L2924/00

摘要： An electronic component has a plurality of chips which are stacked one above the other and contact-connected to one another. To form this component, a first planar chip arrangement is provided with the functional chips spaced apart from one another in a grid and with a filling material in the spaces between the chips to form an insulating holding frame that fixes the chips, the frame has chip-dedicated contact-connecting elements that serve for the electrical contact-connection to another chip of another chip arrangement and each chip has dedicated electrically conductive strips. At least one additional planar chip arrangement is formed by the same method as the first planar chip arrangement and is then stacked on the first planar chip arrangement so that the two chip arrangements lie one above the other and the respective contact-connecting elements of the two chip arrangements are connected to one another for electrical chip-to-chip contact-connection. Subsequently, each of the components, which comprise a stack of chips, is separated from the assembled stack of chip arrangements.

摘要翻译： 电子部件具有多个彼此叠置并彼此接触连接的芯片。 为了形成该部件，第一平面芯片布置设置有功能芯片，其格栅彼此间隔开，并且在芯片之间的空间中具有填充材料，以形成固定芯片的绝缘保持框架，框架具有芯片 用于与另一个芯片布置的另一芯片的电接触连接的每个芯片具有专用的导电条。 通过与第一平面芯片布置相同的方法形成至少一个附加的平面芯片布置，然后将其堆叠在第一平面芯片布置上，使得两个芯片布置在另一个之上并且两个相应的触点连接元件 芯片布置彼此连接以进行电芯片到芯片的接触连接。 随后，包括一堆芯片的每个部件与组装的芯片布置堆叠分离。

公开(公告)号：US20050250304A1

公开(公告)日：2005-11-10

申请号：US10642092

申请日：2003-08-15

申请人： Harry Hedler ,  Roland Irsigler ,  Thorsten Meyer ,  Barbara Vasquez

发明人： Harry Hedler ,  Roland Irsigler ,  Thorsten Meyer ,  Barbara Vasquez

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05541 ,  H01L2224/05005 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166

摘要： A method for fabricating an integrated circuit connection region includes application of a dielectric to an integrated circuit with a connection region, application of a corrodible metalization layer to the dielectric, application of a protection device to the metalization layer, and removal of the protection device in a region around the connection region.

摘要翻译： 一种用于制造集成电路连接区域的方法包括将电介质施加到具有连接区域的集成电路，向电介质施加可腐蚀金属化层，向金属化层施加保护装置，以及将保护装置移除到 连接区域周围的区域。

公开(公告)号：US06861291B2

公开(公告)日：2005-03-01

申请号：US10135273

申请日：2002-04-30

申请人： Harry Hedler ,  Barbara Vasquez ,  Roland Irsigler

发明人： Harry Hedler ,  Barbara Vasquez ,  Roland Irsigler

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/29 ,  H01L23/49811 ,  H01L24/12 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29369 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A contact connection between a semiconductor chip and a substrate has a conductive adhesive extending between each contact of the chip and the substrate. The conductive adhesive includes a matrix component, a filler component, a hardener component and at least one decomposable component so that after curing at a curing temperature T1, the adhesive can be decomposed either by applying thermal energy at a temperature T2>T1 or by radiation so that the two contact surfaces can be separated smoothly. After separation the purposes of replacing a defective semiconductor chip, a second chip can be mechanically connected by applying the adhesive and curing it.

摘要翻译： 半导体芯片和基板之间的接触连接具有在芯片的每个接触件和基板之间延伸的导电粘合剂。 导电粘合剂包括基质组分，填料组分，硬化剂组分和至少一种可分解​​组分，使得在固化温度T1固化后，粘合剂可以通过在温度T2> T1或辐射下施加热能来分解 使得两个接触表面可以平滑地分离。 分离后更换有缺陷的半导体芯片的目的，可以通过施加粘合剂并固化第二芯片来机械地连接第二芯片。

公开(公告)号：US07338843B2

公开(公告)日：2008-03-04

申请号：US10477967

申请日：2002-05-13

申请人： Harry Hedler ,  Roland Irsigler ,  Barbara Vasquez

发明人： Harry Hedler ,  Roland Irsigler ,  Barbara Vasquez

IPC分类号： H01L21/326 ,  H01L21/479 ,  H01L21/44

CPC分类号： H01L22/22 ,  H01L23/525 ,  H01L23/5258 ,  H01L2924/0002 ,  Y10S438/94 ,  H01L2924/00

摘要： A method for producing an electronic component, especially a memory chip, using a laser-induced correction to equalize an integrated circuit by means of at least one laser via in a layer at least partially covering the circuit. The component comprises a rewiring of the contact pads. The inventive method comprises the following steps: each laser via is closed by means of a separate covering layer which is to be applied locally; a rewiring extending between the local covering layers is created; the local covering layers are removed; and the laser-induced correction is carried out by means of the open laser vias.

摘要翻译： 一种用于制造电子部件，特别是存储芯片的方法，其使用激光诱导校正，以至少部分地覆盖电路的层中的至少一个激光通孔来均衡集成电路。 该部件包括接线垫的重新布线。 本发明的方法包括以下步骤：通过局部施加的单独的覆盖层封闭每个激光通孔; 创建在局部覆盖层之间延伸的重新布线; 移除局部覆盖层; 并且通过开放的激光通孔进行激光诱导的校正。

公开(公告)号：US07211451B2

公开(公告)日：2007-05-01

申请号：US10298772

申请日：2002-11-18

申请人： Thorsten Meyer ,  Gerd Frankowsky ,  Harry Hedler ,  Barbara Vasquez ,  Roland Irsigler

发明人： Thorsten Meyer ,  Gerd Frankowsky ,  Harry Hedler ,  Barbara Vasquez ,  Roland Irsigler

IPC分类号： H01L21/66 ,  H01L21/00 ,  H01L23/28 ,  H01L23/498

CPC分类号： H01L21/568 ,  H01L21/67121 ,  H01L21/67132 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/3128 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/12105 ,  H01L2224/92 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2224/96 ,  H01L2224/82

摘要： A process for producing a component module comprising a module carrier and a plurality of components with which contact is made on the latter, comprising the following steps: arranging separated components on a surface-adhesive film at a predefined contact-specific spacing from one another, embedding the components in a flexible material in order to form a flexible holding frame which holds the components, pulling off the film, producing contact-making elements on the exposed side of the components, performing a functional test of the components and, if necessary, repair and/or replacement of components, and fixing and making contact with the components held in the holding frame on the module carrier.

摘要翻译： 一种用于制造组件模块的方法，所述组件模块包括模块载体和在其上形成接触的多个部件，包括以下步骤：以预定的接触特定间隔将表面粘合膜上的分离的组分布置在彼此之间， 将部件嵌入柔性材料中以形成保持部件的柔性保持框架，拉出膜，在部件的暴露侧上产生接触形成元件，执行部件的功能测试，并且如果需要， 修理和/或更换部件，以及固定和保持在模块架上的保持框架中保持的部件。

公开(公告)号：US06919232B2

公开(公告)日：2005-07-19

申请号：US10284649

申请日：2002-10-31

申请人： Harry Hedler ,  Roland Irsigler ,  Barbara Vasquez

发明人： Harry Hedler ,  Roland Irsigler ,  Barbara Vasquez

IPC分类号： H01L23/04 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/485 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3114 ,  H01L24/10 ,  H01L24/13 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00

摘要： A process for producing a semiconductor chip having contact elements protruding on one chip side within the context of wafer level packaging, the chip side provided with the contact elements being coated with a covering compound forming a protective layer, from which the protruding contact element project.

摘要翻译： 一种制造半导体芯片的方法，所述半导体芯片具有在晶片级封装的上下文中在一个芯片侧突出的接触元件，所述芯片侧设置有形成保护层的覆盖化合物，所述覆盖化合物突出接触元件突出。

公开(公告)号：US20050048676A1

公开(公告)日：2005-03-03

申请号：US10477967

申请日：2002-05-13

申请人： Harry Hedler ,  Roland Irsigler ,  Barbara Vasquez

发明人： Harry Hedler ,  Roland Irsigler ,  Barbara Vasquez

IPC分类号： H01L21/66 ,  H01L23/525 ,  H01L21/00 ,  H01L21/326 ,  H01L21/44 ,  H01L21/82

CPC分类号： H01L22/22 ,  H01L23/525 ,  H01L23/5258 ,  H01L2924/0002 ,  Y10S438/94 ,  H01L2924/00

摘要： A method for producing an electronic component, especially a memory chip, using a laser-induced correction to equalize an integrated circuit by means of at least one laser via in a layer at least partially covering the circuit. The component comprises a rewiring of the contact pads. The inventive method comprises the following steps: each laser via is closed by means of a separate covering layer which is to be applied locally; a rewiring extending between the local covering layers is created; the local covering layers are removed; and the laser-induced correction is carried out by means of the open laser vias.

摘要翻译： 一种用于制造电子部件，特别是存储芯片的方法，其使用激光诱导校正，以至少部分地覆盖电路的层中的至少一个激光通孔来均衡集成电路。 该部件包括接线垫的重新布线。 本发明的方法包括以下步骤：通过局部施加的单独的覆盖层封闭每个激光通孔; 创建在局部覆盖层之间延伸的重新布线; 移除局部覆盖层; 并且通过开放的激光通孔进行激光诱导的校正。

公开(公告)号：US20060244109A1

公开(公告)日：2006-11-02

申请号：US11383341

申请日：2006-05-15

申请人： Harry Hedler ,  Roland Irsigler ,  Thorsten Meyer ,  Barbara Vasquez

发明人： Harry Hedler ,  Roland Irsigler ,  Thorsten Meyer ,  Barbara Vasquez

IPC分类号： H01L23/495

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05541 ,  H01L2224/05005 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166

摘要： A method for fabricating an integrated circuit connection region includes application of a dielectric to an integrated circuit with a connection region, application of a corrodible metalization layer to the dielectric, application of a protection device to the metalization layer, and removal of the protection device in a region around the connection region.

摘要翻译： 一种用于制造集成电路连接区域的方法包括将电介质施加到具有连接区域的集成电路，向电介质施加可腐蚀金属化层，向金属化层施加保护装置，以及将保护装置移除到 连接区域周围的区域。

公开(公告)号：US06845554B2

公开(公告)日：2005-01-25

申请号：US10298837

申请日：2002-11-18

申请人： Gerd Frankowsky ,  Harry Hedler ,  Roland Irsigler ,  Thorsten Meyer ,  Barbara Vasquez

发明人： Gerd Frankowsky ,  Harry Hedler ,  Roland Irsigler ,  Thorsten Meyer ,  Barbara Vasquez

IPC分类号： H01L21/00 ,  H01L21/60 ,  H01L21/78 ,  H05K3/30

CPC分类号： H01L24/96 ,  H01L21/67144 ,  H01L21/78 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49135 ,  Y10T29/49155 ,  Y10T29/53178

摘要： The invention creates a method for connection of circuit units (101a-10n) which are arranged on a wafer (100), in which the wafer (100) is fitted to a first film (102a), the wafer (100) is sawn such that the circuit units (101a-101n) which are arranged on the wafer (100) are separated, the functional circuit units (101d) are picked up by means of a handling device (101) and are placed down on a second film (102b) by means of the handling device (103), so as to produce a separation distance which can be predetermined between connection contacts of the circuit units (101d).

摘要翻译： 本发明创造了一种用于连接电路单元（101a-10n）的方法，它们布置在晶片（100）上，其中晶片（100）装配到第一薄膜（102a）上，晶片（100）被锯切 布置在晶片（100）上的电路单元（101a-101n）被分离，功能电路单元（101d）通过处理装置（101）拾取并放置在第二薄膜（102b）上 ），以便产生可以在电路单元（101d）的连接触点之间预定的间隔距离。