公开(公告)号：US5851681A

公开(公告)日：1998-12-22

申请号：US212766

申请日：1994-03-15

申请人： Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shozi Ikeda ,  Fumio Kataoka ,  Fusaji Shoji

发明人： Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shozi Ikeda ,  Fumio Kataoka ,  Fusaji Shoji

IPC分类号： C08G73/10 ,  G11B5/17 ,  G11B5/31 ,  H01L23/498 ,  H05K1/00 ,  G11B5/40 ,  C08G69/26

CPC分类号： H01L23/49894 ,  C08G73/10 ,  G11B5/313 ,  H05K3/4676 ,  G11B5/17 ,  G11B5/3109 ,  H01L2924/0002 ,  H05K2201/0154 ,  Y10T428/1193 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

摘要： This invention relates to a wiring structure having metal wiring layers and polyimide layers. An object of this invention is to overcome problems caused by oxidation of a metal surface, such as an increase in the resistance of wiring and a reduction in insulation, by preventing a reaction between a metal of the wiring layers, such as copper, and carboxyl groups of polyamic acid which make up the polyimide layers. In the wiring structure according to the present invention, the polyimide layers have been formed by heating and curing a resin composition which comprises a polyimide precursor, an amine compound and an organic solvent.

摘要翻译： 本发明涉及具有金属布线层和聚酰亚胺层的布线结构。 本发明的目的是通过防止诸如铜的布线层的金属和羧基之间的反应来克服金属表面的氧化引起的问题，例如布线电阻的增加和绝缘的减少 组成聚酰亚胺层的聚酰胺酸组。 在根据本发明的布线结构中，通过加热和固化包含聚酰亚胺前体，胺化合物和有机溶剂的树脂组合物，形成聚酰亚胺层。

公开(公告)号：US5753372A

公开(公告)日：1998-05-19

申请号：US500157

申请日：1995-07-10

申请人： Hideo Sotokawa ,  Miharu Otani ,  Fumio Kataoka ,  Fusaji Shoji ,  Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shogi Ikeda ,  Hidetaka Shigi ,  Tetsuya Yamazaki ,  Naoki Matsushima ,  Shirou Akamatsu

发明人： Hideo Sotokawa ,  Miharu Otani ,  Fumio Kataoka ,  Fusaji Shoji ,  Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shogi Ikeda ,  Hidetaka Shigi ,  Tetsuya Yamazaki ,  Naoki Matsushima ,  Shirou Akamatsu

IPC分类号： H01L21/312 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/532 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  B32B9/04

CPC分类号： H01L21/76801 ,  H01L21/312 ,  H01L21/32056 ,  H01L21/76838 ,  H01L23/5329 ,  H01L2924/0002 ,  H05K1/0346 ,  H05K3/4647 ,  H05K3/4676 ,  Y10T428/24802 ,  Y10T428/31504 ,  Y10T428/31678 ,  Y10T428/31721

摘要： The present invention provides the wiring structure having a wiring layer and insulation layer and the method of manufacturing the same, wherein at least a part of the wiring of said wiring layer comprises copper, and said insulation layer comprises the polyimide obtained by heating the polyimide precursor composition containing the polyimide precursor having the repeating unit which can be represented by the following general formula (Chemical formula 15). ##STR1## (In this formula, R.sup.1 is at least one type of quadrivalent organic group selected from among the Chemical formulae 16, while R.sup.2 is a bivalent organic group containing aromatic ring).

摘要翻译： 本发明提供具有布线层和绝缘层的布线结构及其制造方法，其中所述布线层的布线的至少一部分包括铜，并且所述绝缘层包括通过加热聚酰亚胺前体获得的聚酰亚胺 含有具有可以由以下通式表示的重复单元的聚酰亚胺前体的组合物（化学式15）。 （化学式15）（化学式16） 选自化学式16中的四价有机基团的类型，而R2是含有芳香环的二价有机基团）。

公开(公告)号：US5388328A

公开(公告)日：1995-02-14

申请号：US187546

申请日：1994-01-28

申请人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

发明人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

IPC分类号： H01L21/48 ,  H01L27/01 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46

CPC分类号： H01L21/4857 ,  H05K3/4647 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K2203/0733 ,  H05K2203/0769 ,  H05K3/108 ,  H05K3/243 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

摘要： A process for the fabrication of an interconnected multilayer board involves the steps of forming a metallic under-conductive layer on a base substrate, forming a windowed resist layer on the metallic under-conductive layer, filling windows of the resist layer with a conductor by plating thereby forming a conductor layer, forming another windowed resist layer on the conductor layer and filling windows of this resist layer with a conductor by plating, thereby forming a via-hole layer and to provide a two-level structure of the conductor layer and the via-hole layer. Thereafter, the resist layers and portions of the metallic under-conductor layer other than those in contact with a lower face of the conductor constituting the conductor layer are dissolved to form a two-level skeleton structure of conductor lines and spaces within the skeleton structure are filled with a varnish in a solventless form and the varnish is cured.

摘要翻译： 制造相互连接的多层板的方法包括以下步骤：在基底基板上形成金属导电层，在金属下导电层上形成窗口化抗蚀剂层，用导体用电镀填充抗蚀剂层的窗口 从而形成导体层，在导体层上形成另一个窗口化的抗蚀剂层，并通过电镀用导体填充该抗蚀剂层的窗口，从而形成通孔层，并提供导体层和通孔的两层结构 井层。 此后，除了与形成导体层的导体的下表面接触的金属下导体层的抗蚀剂层和部分被溶解以形成骨架结构内的导体线和空间的两级骨架结构 填充无溶剂形式的清漆，并且清漆被固化。

公开(公告)号：US5300735A

公开(公告)日：1994-04-05

申请号：US37543

申请日：1993-03-22

申请人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

发明人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

IPC分类号： H01L21/48 ,  H01L27/01 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46 ,  H05K1/00

CPC分类号： H01L21/4857 ,  H05K3/4647 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K2203/0733 ,  H05K2203/0769 ,  H05K3/108 ,  H05K3/243 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

摘要： Described herein are interconnected mutilayer boards and their fabrication processes. Multilayer conductor lines of a skeleton structure are formed by conducting multilayer metallization while including all resist layers and metallic under-conductive layers and then removing the resist layers and metallic under-conductive layers at once. Spaces between the multilayer conductor lines of the skeleton structure are then filled with a solventless varnish so that insulating layers are formed. Modules making use of such interconnected multilayer boards and computers having such modules are also described.

摘要翻译： 这里描述了互连的多层板及其制造工艺。 骨架结构的多层导体线通过导电多层金属化而形成，同时包括所有的抗蚀剂层和金属的低导电层，然后立即去除抗蚀剂层和金属的不良导电层。 然后用无溶剂清漆填充骨架结构的多层导体线之间的空隙，从而形成绝缘层。 还描述了使用这种互连的多层板的模块和具有这种模块的计算机。

公开(公告)号：US4748228A

公开(公告)日：1988-05-31

申请号：US863241

申请日：1986-05-14

申请人： Fusaji Shoji ,  Haruhiko Matsuyama ,  Akio Fujiwara ,  Fumio Kataoka ,  Teruji Aizawa

发明人： Fusaji Shoji ,  Haruhiko Matsuyama ,  Akio Fujiwara ,  Fumio Kataoka ,  Teruji Aizawa

IPC分类号： C08G73/00 ,  C08G73/10 ,  C08G77/00

CPC分类号： C08G73/1017

摘要： An organic silicon-terminated polyimide precursor having a very stable solution viscosity is produced by polycondensing 100 parts by weight of a mixture composed of 90 to 99.5% by mole of an organic diamine represented by the following general formula (I) and 10 to 0.5% by weight by mole of an organic silyl represented by the following general formula (II): ##STR1## wherein R.sup.1 and R.sup.2 are divalent organic groups; R.sup.3 and R.sup.4 are monovalent organic groups; m is 0, 1, 2, or 3, with an organic tetracarboxylic acid dianhydride represented by the following general formula (III) in a molar amount corresponding to the 100 parts by weight of the mixture of the organic diamine and the organic silyl represented by the said general formulae (I) and (II), respectively, in an organic polar solvent at 0.degree. to 40.degree. C., thereby obtaining a solution of organic silicon-terminated polyimide precursor, and heating the solution at 50.degree. to 80.degree. C.: ##STR2## wherein R.sup.5 is a tetravelent organic group. The polyimide having good adhesion and mechanical characteristics is obtained by further heating the precursor solution at 100.degree. to 450.degree. C.

摘要翻译： 通过将100重量份由以下通式（I）表示的有机二胺和90至99.5摩尔％的由下列通式（I）表示的混合物和10至0.5重量％的混合物进行缩聚来制备具有非常稳定的溶液粘度的有机硅封端的聚酰亚胺前体， （II）表示的有机甲硅烷基：其中R 1和R 2是二价有机基团;其中R 1和R 2是二价有机基团; R3和R4是一价有机基团; m为0,1,2或3，与由以下通式（III）表示的有机四羧酸二酐的摩尔量相当于有机二胺和有机甲硅烷基的混合物的100重量份，由 所述通式（I）和（II）分别在有机极性溶剂中在0至40℃下进行，从而获得有机硅封端的聚酰亚胺前体溶液，并在50℃至80℃下加热该溶液 （III）其中R5是四价有机基团。 通过在100〜450℃下进一步加热前体溶液得到具有良好粘附性和机械特性的聚酰亚胺

公开(公告)号：US5280102A

公开(公告)日：1994-01-18

申请号：US500503

申请日：1990-03-28

申请人： Haruhiko Matsuyama ,  Fusaji Shoji ,  Atsushi Honda ,  Teruki Aizawa

发明人： Haruhiko Matsuyama ,  Fusaji Shoji ,  Atsushi Honda ,  Teruki Aizawa

IPC分类号： C09J179/08 ,  H01B3/30 ,  C08G73/10 ,  C08G8/02 ,  C08G69/26

CPC分类号： H01B3/306 ,  C09J179/08 ,  Y10T428/31721

摘要： Heat-resistant bonding materials are composed of a polyimide precursor end-capped at molecule ends thereof and/or an imide compound formed from the polyimide precursor. They may also contain fine particles of at least one material selected from metals, metal oxides, metal carbides and metal nitrides.

摘要翻译： 耐热接合材料由在其分子末端封端的聚酰亚胺前体和/或由聚酰亚胺前体形成的酰亚胺化合物组成。 它们还可以含有选自金属，金属氧化物，金属碳化物和金属氮化物中的至少一种材料的细颗粒。

公开(公告)号：US4824731A

公开(公告)日：1989-04-25

申请号：US149560

申请日：1988-01-28

申请人： Haruhiko Matsuyama ,  Fusaji Shoji ,  Shunichiro Kuwatsuka ,  Kenji Sugimoto

发明人： Haruhiko Matsuyama ,  Fusaji Shoji ,  Shunichiro Kuwatsuka ,  Kenji Sugimoto

IPC分类号： C08G73/10 ,  G11B5/31 ,  H01B3/30 ,  G11B5/40

CPC分类号： C08G73/1042 ,  C08G73/1007 ,  G11B5/3163 ,  H01B3/306 ,  Y10S428/90 ,  Y10T428/1193 ,  Y10T428/31721

摘要： A thin film magnetic head of which the insulation layer is made of a polyimide resin obtained by heat-curing a polyimide precursor represented by the following general formula (I) or (II) or a mixture thereof not only has excellent characteristics with respect to the insulation layer, i.e. satisfactory flatness, high glass transition temperature and excellent adhesiveness but also is free from film defects, i.e., exhibits high reliability: ##STR1## wherein R is, e.g., ##STR2## Ar.sup.1 is, e.g., ##STR3## Ar.sup.2 is, e.g. ##STR4## n is an integer of 1 to 100, and m is an integer of 10 to 500.

摘要翻译： 一种薄膜磁头，其绝缘层由通过热固化由以下通式（I）或（II）表示的聚酰亚胺前体或其混合物获得的聚酰亚胺树脂制成，不仅具有优异的相对于 绝缘层，即令人满意的平坦度，高玻璃化转变温度和优异的粘合性，但也没有膜缺陷，即表现出高可靠性：其中R是例如< 图像> Ar1是，例如， Ar2是例如 n为1〜100的整数，m为10〜500的整数。

公开(公告)号：US4772505A

公开(公告)日：1988-09-20

申请号：US897368

申请日：1986-08-18

申请人： Haruhiko Matsuyama ,  Fusaji Shoji ,  Hiroshi Umezaki ,  Masatoshi Takeshita ,  Naoki Koyama ,  Ryo Suzuki

发明人： Haruhiko Matsuyama ,  Fusaji Shoji ,  Hiroshi Umezaki ,  Masatoshi Takeshita ,  Naoki Koyama ,  Ryo Suzuki

IPC分类号： C08G73/10 ,  G11B7/2542 ,  G11B7/257 ,  H01F10/30 ,  H01F41/32 ,  G11C11/02

CPC分类号： G11B7/2542 ,  C08G73/1064 ,  C08G73/1067 ,  C08G73/1071 ,  G11B7/252 ,  H01F10/30 ,  H01F41/32 ,  G11B2007/2571 ,  G11B2007/25715 ,  Y10S428/90 ,  Y10T428/24917 ,  Y10T428/24975 ,  Y10T428/265 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T428/31765

摘要： The inclination angle, in the conductor pattern end portion of a magnetic bubble memory element having a bubble diameter of up to 1.2 .mu.m, can be remarkably reduced by employing a polymer resin, having fluidity in a curing process, as the insulation film under the conductor pattern, so that the transfer margin is greatly improved.

摘要翻译： 通过使用在固化过程中具有流动性的聚合物树脂作为泡沫直径为1.2μm的气泡存储元件的导体图案端部中的绝缘膜，倾斜角度可以显着地降低 导体图案，使转印幅度大大提高。

公开(公告)号：US4686147A

公开(公告)日：1987-08-11

申请号：US829824

申请日：1986-02-18

申请人： Haruhiko Matsuyama ,  Fusaji Shoji ,  Shunichiro Kuwazuka

发明人： Haruhiko Matsuyama ,  Fusaji Shoji ,  Shunichiro Kuwazuka

IPC分类号： G11B5/127 ,  G11B5/31 ,  G11B5/40

CPC分类号： G11B5/31 ,  G11B5/127 ,  Y10S428/90 ,  Y10T428/1193 ,  Y10T428/31663 ,  Y10T428/31721

摘要： A highly reliable magnetic head which exhibits excellent magnetic characteristics and is free from film defects can be produced by using a silicone-containing polyimide resin as a material for insulation layers to thereby form homogeneous and flat insulation layers. Such a polyimide resin is suitable for other multi-layered stereo-wiring structures.

摘要翻译： 通过使用含有聚硅氧烷的聚酰亚胺树脂作为绝缘层的材料，可以制造表现出优异的磁特性并且没有膜缺陷的高度可靠的磁头，从而形成均匀且平坦的绝缘层。 这种聚酰亚胺树脂适用于其他多层立体线路结构。

公开(公告)号：US5208656A

公开(公告)日：1993-05-04

申请号：US674605

申请日：1991-03-25

申请人： Haruhiko Matsuyama ,  Mitsuo Yoshimoto ,  Jun Tanaka ,  Fusaji Shoji ,  Hitoshi Yokono ,  Takashi Inoue ,  Tetsuya Yamazaki ,  Minoru Tanaka ,  Hidetaka Shigi

发明人： Haruhiko Matsuyama ,  Mitsuo Yoshimoto ,  Jun Tanaka ,  Fusaji Shoji ,  Hitoshi Yokono ,  Takashi Inoue ,  Tetsuya Yamazaki ,  Minoru Tanaka ,  Hidetaka Shigi

IPC分类号： H05K3/46 ,  H01L21/60 ,  H01L23/498

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701

摘要： A multilayer wiring substrate having high reliability can be produced in good productivity by subjecting metal wiring layers to stabilization treatment on the surface with a metal such as Cr, Mo or the like or an aqueous solution of water glass so as to prevent generation of hillocks or whiskers and to improve chemical resistance.

摘要翻译： 通过使金属布线层通过金属如Cr，Mo等在表面上进行稳定化处理或水玻璃水溶液，可以以良好的生产率制造具有高可靠性的多层布线基板，以防止产生小丘或 晶须并改善耐化学性。