公开(公告)号：US09340361B2

公开(公告)日：2016-05-17

申请号：US13724234

申请日：2012-12-21

申请人： Haruki Nakajima ,  Hiroyuki Kikuchi ,  Tsuyoshi Yamashita

发明人： Haruki Nakajima ,  Hiroyuki Kikuchi ,  Tsuyoshi Yamashita

IPC分类号： G01R31/20 ,  B65G17/12 ,  G01R31/28

CPC分类号： B65G17/12 ,  B65G35/06 ,  G01R31/2893

摘要： There is provided an electronic device transfer apparatus which has an excellent capacity of transferring DUTs between trays.An electronic device transfer apparatus, which transfers DUTs between trays, includes a device conveying unit. The device conveying unit includes a plurality of shuttles which hold the DUTs, an endless first guide rail which guides the shuttles, and first to third feeders which move the shuttles on the first guide rail. The shuttles are movable on the first guide rail over the entire circumference of the rail.

摘要翻译： 提供了一种电子设备传送设备，其具有在托盘之间传送DUT的优异容量。 在托盘之间传送DUT的电子设备传送设备包括设备传送单元。 设备传送单元包括多个保持DUT的梭子，引导梭子的环形第一导轨以及在第一导轨上移动梭子的第一至第三馈送器。 梭子可以在轨道的整个圆周上的第一导轨上移动。

公开(公告)号：US08829739B2

公开(公告)日：2014-09-09

申请号：US13553954

申请日：2012-07-20

申请人： Takuya Okubo ,  Tsuyoshi Yamashita

发明人： Takuya Okubo ,  Tsuyoshi Yamashita

IPC分类号： H01H9/54 ,  H01H33/59 ,  H01H47/00 ,  H01H85/46 ,  H01H3/26 ,  H01H3/28

CPC分类号： H02M1/36 ,  B60L2210/40 ,  Y02T10/7241 ,  Y10T307/944

摘要： A power converter capable of activating a control circuit therein without increasing a length of a wiring for conveying an external activation signal. In the power converter, a converter circuit isolates a first voltage of a first power supply, converts the first voltage into a second voltage, and outputs the second voltage to a second power supply. A first power supply connecting circuit connects the first power supply to the converter circuit in response to the activation signal. An activation circuit determines whether or not the activation signal has been received by the first power supply connecting circuit on the basis of a voltage between input terminals of the converter circuit and activates the control circuit when it is determined that the activation signal has been received by the first power supply connecting circuit.

摘要翻译： 一种功率转换器，其能够在不增加用于传送外部激活信号的布线的长度的情况下激活其中的控制电路。 在功率转换器中，转换器电路隔离第一电源的第一电压，将第一电压转换成第二电压，并将第二电压输出到第二电源。 第一电源连接电路响应于激活信号将第一电源连接到转换器电路。 激活电路基于转换器电路的输入端子之间的电压来确定第一电源连接电路是否已经接收到激活信号，并且当确定已经接收到激活信号被激活时激活控制电路 第一个电源连接电路。

公开(公告)号：US08164355B2

公开(公告)日：2012-04-24

申请号：US12527976

申请日：2008-01-18

申请人： Tsuyoshi Yamashita

发明人： Tsuyoshi Yamashita

IPC分类号： G01R31/20

CPC分类号： G01R31/2891

摘要： An electronic component pressing device includes a first pressing member for pressing a predetermined first region of the electronic component to be tested; a second pressing member for pressing a predetermined second region other than the first region of the electronic component to be tested; a gimbal mechanism for adhering the first pressing member to the first region when the first pressing member presses the first region of the electronic component to be tested; first pressing load applying means for applying a pressing load on the gimbal mechanism; and second pressing load applying means for applying a pressing load on the second pressing member.

摘要翻译： 电子部件按压装置包括：第一按压部件，用于按压待测试的电子部件的预定的第一区域; 第二按压构件，用于按压除了待测试的电子部件的第一区域之外的预定的第二区域; 当所述第一按压构件按压所述待测电子部件的所述第一区域时，将所述第一按压构件粘合到所述第一区域的万向接头机构; 第一按压负荷施加装置，用于在万向节机构上施加按压负荷; 以及用于对第二按压部件施加按压负荷的第二按压负荷施加机构。

公开(公告)号：US20110122206A1

公开(公告)日：2011-05-26

申请号：US12623843

申请日：2009-11-23

申请人： David Pidwerbecki ,  Tsuyoshi Yamashita

发明人： David Pidwerbecki ,  Tsuyoshi Yamashita

IPC分类号： B41J2/045

CPC分类号： B41J2/14233 ,  B41J2/1433

摘要： A side shooting ink ejection device may comprise a front surface, side shooting nozzles having ejection orifices for ejecting fluid, and piezoelectric actuators for moving the fluid through vibration for ejecting the fluid out of the nozzle. The side shooting nozzles may be arranged to eject fluid in a side direction of the piezoelectric actuator. The front surface may comprise recessed portions. The side shooting nozzles may open into the recessed portions so that the ejection orifices are countersunk with respect to the front surface.

摘要翻译： 侧面喷墨装置可以包括前表面，具有用于喷射流体的喷射孔的侧面喷射喷嘴和用于通过振动移动流体的压电致动器，以将流体喷出喷嘴。 侧面喷嘴可以布置成在压电致动器的侧面方向上喷射流体。 前表面可以包括凹入部分。 侧面喷嘴可以打开到凹部中，使得喷射孔相对于前表面被沉没。

公开(公告)号：US07697310B2

公开(公告)日：2010-04-13

申请号：US11699076

申请日：2007-01-29

申请人： Kimikazu Nakamura ,  Tsuyoshi Yamashita

发明人： Kimikazu Nakamura ,  Tsuyoshi Yamashita

IPC分类号： H02M3/335

CPC分类号： H02M3/33592 ,  Y02B70/1475

摘要： The control apparatus for controlling a voltage transforming apparatus having a transformer, power switching elements disposed in a primary side, and synchronous-rectifying switching elements disposed in a secondary side includes a judging circuit making a judgment as to whether or not an output current of the voltage transforming apparatus is smaller than a specified current on the basis of a primary-side current of the transformer and an inhibition circuit inhibiting the synchronous-rectifying switching elements from performing their synchronous-rectifying control operation when the judging circuit judges that the output current is smaller than the specified current. The judging circuit makes the judgment with compensating for a variation of a relationship between the primary side-current and the output current due to variation of duty ratio of the power switching elements, and variation of at least one of the DC output voltage and the DC input voltage of the voltage transforming apparatus.

摘要翻译： 用于控制具有变压器的电压变换装置的控制装置，设置在初级侧的功率开关元件和设置在次级侧的同步整流开关元件包括判断电路，判断是否输出电流 电压变换装置基于变压器的初级侧电流小于规定电流，抑制电路在判定电路判定为输出电流为止时，禁止同步整流用开关元件进行同步整流控制动作 小于指定电流。 判断电路通过补偿由于功率开关元件的占空比的变化引起的一次侧电流与输出电流之间的关系的变化以及直流输出电压和直流的至少一个的变化的判断 电压变换装置的输入电压。

公开(公告)号：US20100019791A1

公开(公告)日：2010-01-28

申请号：US12527976

申请日：2008-01-18

申请人： Tsuyoshi Yamashita

发明人： Tsuyoshi Yamashita

IPC分类号： G01R31/02

CPC分类号： G01R31/2891

摘要： An electronic component pressing device includes a first pressing member for pressing a predetermined first region of the electronic component to be tested; a second pressing member for pressing a predetermined second region other than the first region of the electronic component to be tested; a gimbal mechanism for adhering the first pressing member to the first region when the first pressing member presses the first region of the electronic component to be tested; first pressing load applying means for applying a pressing load on the gimbal mechanism; and second pressing load applying means for applying a pressing load on the second pressing member.

摘要翻译： 电子部件按压装置包括：第一按压部件，用于按压待测试的电子部件的预定的第一区域; 第二按压构件，用于按压除了待测试的电子部件的第一区域之外的预定的第二区域; 当所述第一按压构件按压所述待测电子部件的所述第一区域时，将所述第一按压构件粘合到所述第一区域的万向接头机构; 第一按压负荷施加装置，用于在万向节机构上施加按压负荷; 以及用于对第二按压部件施加按压负荷的第二按压负荷施加机构。

公开(公告)号：US20090290388A1

公开(公告)日：2009-11-26

申请号：US12458882

申请日：2009-07-27

申请人： Koji Kawasaki ,  Keiji Shigeoka ,  Tsuyoshi Yamashita

发明人： Koji Kawasaki ,  Keiji Shigeoka ,  Tsuyoshi Yamashita

IPC分类号： H02M3/335 ,  H01F27/28

CPC分类号： H02M3/33592 ,  H02M3/33569 ,  Y02B70/1475 ,  Y10S323/908

摘要： In a DC to DC converter, first and second primary windings are magnetically coupled to a first secondary winding. Third and fourth primary windings are magnetically coupled to a second secondary winding. The first and second primary windings are magnetically coupled to the first secondary winding. The third and fourth primary windings are magnetically coupled to the second secondary winding. The first and third primary windings are coupled in series to form a first coil member. The second and fourth primary windings are coupled in series to form a second coil member. One end of the first coil member is coupled to the first positive power line. A first switching element is coupled between the first negative power line and the other end of the first coil member. A first capacitor is coupled between the first negative terminal and one end of the second coil member.

摘要翻译： 在DC-DC转换器中，第一和第二初级绕组被磁耦合到第一次级绕组。 第三和第四初级绕组被磁耦合到第二次级绕组。 第一和第二初级绕组磁耦合到第一次级绕组。 第三和第四初级绕组磁耦合到第二次级绕组。 第一和第三初级绕组串联耦合以形成第一线圈构件。 第二和第四初级绕组串联耦合以形成第二线圈构件。 第一线圈构件的一端与第一正电力线连接。 第一开关元件耦合在第一负电源线和第一线圈构件的另一端之间。 第一电容器耦合在第一负极端子和第二线圈部件的一端之间。

公开(公告)号：US07289338B2

公开(公告)日：2007-10-30

申请号：US11294427

申请日：2005-12-06

申请人： Koji Kawasaki ,  Keiji Shigeoka ,  Yuji Hayashi ,  Tsuyoshi Yamashita

发明人： Koji Kawasaki ,  Keiji Shigeoka ,  Yuji Hayashi ,  Tsuyoshi Yamashita

IPC分类号： H02M3/335

CPC分类号： H02M3/33592 ,  Y02B70/1475

摘要： In a DC to DC converter, a transformer circuit includes a primary winding and a secondary winding member composed of series-connected first to fourth secondary windings having one and the other ends. The one and the other ends of the series-connected first to fourth secondary windings are connected to a first output terminal. The first and second secondary windings are wound around a first magnetic path in opposite directions, and the third and fourth secondary windings are wound around a second magnetic path in opposite directions. A first rectifying element is connected between the second output terminal and a connection point between the first and second secondary windings. A second rectifying element is connected between the second output terminal and a connection point between the third and fourth secondary windings.

摘要翻译： 在DC-DC转换器中，变压器电路包括初级绕组和由具有一端和另一端的串联的第一至第四次级绕组构成的次级绕组构件。 串联的第一到第四次级绕组的一端和另一端连接到第一输出端。 第一和第二次级绕组缠绕在相反方向上的第一磁路上，并且第三和第四次级绕组绕相反方向的第二磁路缠绕。 第一整流元件连接在第二输出端子与第一和第二次级绕组之间的连接点之间。 第二整流元件连接在第二输出端子和第三和第四次级绕组之间的连接点之间。

公开(公告)号：US07182241B2

公开(公告)日：2007-02-27

申请号：US10215732

申请日：2002-08-09

申请人： Tsuyoshi Yamashita ,  Tongbi Jiang

发明人： Tsuyoshi Yamashita ,  Tongbi Jiang

IPC分类号： B23K1/20 ,  B23K31/02 ,  B23K35/34

CPC分类号： H01L24/10 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3618 ,  B23K2101/40 ,  H01L23/488 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2203/043 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/05599

摘要： Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a second activation temperature that is higher than the first activation temperature. This dual-flux solder may be used in manufacturing microelectronic components and microelectronic component assemblies. In one specific application, the solder may be used to manufacture a flip chip or other microelectronic component which includes self-fluxing solder balls. This can obviate the need to apply another flux composition to the solder balls prior to a subsequent component attach reflow operation.

摘要翻译： 本发明的方面提供了包括两种不同助熔剂的焊料组合物。 助熔剂之一促进在第一活化温度下焊接金属的熔化，另一种助熔剂促进金属在高于第一活化温度的第二活化温度下熔化。 这种双通量焊料可用于制造微电子部件和微电子部件组件。 在一个具体应用中，焊料可用于制造倒装芯片或其他包括自熔焊球的微电子部件。 这可以避免在随后的组件附着回流操作之前将另外的焊剂组合物应用于焊球。

公开(公告)号：US20050263888A1

公开(公告)日：2005-12-01

申请号：US11196049

申请日：2005-08-03

申请人： Tongbi Jiang ,  Tsuyoshi Yamashita

发明人： Tongbi Jiang ,  Tsuyoshi Yamashita

IPC分类号： B23K1/20 ,  B23K31/02 ,  H01L21/56 ,  H01L23/48

CPC分类号： H01L21/563 ,  B23K2101/40 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2924/00011 ,  H01L2924/01029 ,  H01L2924/01077 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/81805

摘要： A method for assembling chips onto substrates includes applying a flux-free, no-flow underfill material. In an embodiment, the method includes removing oxide from interconnects without the use of a flux and applying a flux-free, no-flow underfill. In an embodiment, the method includes removing oxide from bumps, applying no-flow underfill to a substrate, and fluxlessly connecting the bumps to pads on the substrate. In an embodiment, oxide is removed from the bumps by a plasma treatment. In an embodiment, oxide is removed from the bumps by a subjecting the bumps to an oxide reduction process. The assembly of the chips and substrate is free from flux residue and/or flux cleaning solution residue.