公开(公告)号：US5591926A

公开(公告)日：1997-01-07

申请号：US534203

申请日：1995-09-26

申请人： Hayato Inada ,  Koji Tsuji

发明人： Hayato Inada ,  Koji Tsuji

IPC分类号： C22C5/06 ,  C22C32/00 ,  H01H1/023 ,  H01H1/0233 ,  H01H1/0237 ,  H01H11/04

CPC分类号： H01H1/023 ,  C22C32/0021 ,  C22C5/06 ,  H01H1/0233 ,  H01H1/0237

摘要： A silver base electrical contact material is described which contains uniformly in a silver matrix dispersed particles of nickel, nickel oxide, and at least one additive selected from the group consisting of vanadium, manganese, chromium, thallium, titanium, cobalt, and tungsten carbide. The contact material contains 1.3 to 24.8 wt % of nickel, 0.2 to 4.7 wt % of nickel oxide, 0.05 to 3 wt % of the additive, and balance silver. A superior silver base contact material having excellent welding and wear resistances is obtained by adding the metals and the metal carbide to a silver-nickel-nickel oxide contact material.

摘要翻译： 描述了银基电接触材料，其均匀地含有银基体分散的镍，氧化镍和至少一种选自钒，锰，铬，铊，钛，钴和碳化钨的添加剂的颗粒。 接触材料含有1.3〜24.8重量％的镍，0.2〜4.7重量％的氧化镍，0.05〜3重量％的添加剂，余量为银。 通过将金属和金属碳化物添加到银 - 镍 - 镍氧化物接触材料中，获得具有优异的焊接和耐磨性的优良的银基接触材料。

公开(公告)号：US5338505A

公开(公告)日：1994-08-16

申请号：US997216

申请日：1992-12-28

申请人： Koji Tsuji ,  Yoshinbou Takegawa ,  Hayato Inada ,  Shuji Yamada

发明人： Koji Tsuji ,  Yoshinbou Takegawa ,  Hayato Inada ,  Shuji Yamada

IPC分类号： C22C1/04 ,  C22C5/06 ,  H01B1/02 ,  H01H1/023 ,  H01H1/0237 ,  H01H11/04 ,  B22F3/12

CPC分类号： H01H1/0237

摘要： A silver base electrical contact material with superior resistance to arc erosion along with improved wear and welding resistance. The contact material consists essentially of 0.5 to 39.9 wt % of nickel, 0.14 to 7.0 wt % of nickel oxides, and balance silver. The material contains not less than 0.4 wt % of nickel responsible for constituting minute nickel and nickel particles which have a particle size of not more than 1 .mu.m and are dispersed in a silver matrix for strengthening the material to give improved wear and welding resistance. The dispersed minute nickel oxide particles are included to stabilize arcing occurring at the time of opening and closing contacts in such a manner as to anchor one end of an arc substantially at any immediately available point over the entire contact surface as soon as the arcing occurs, thereby preventing the arc end from moving violently across or beyond the contact surface and therefore minimizing arc related damages or arc erosion. The contact material is made in accordance with a novel method which can disperse the minute nickel and nickel oxide particles in adequate quantities and eliminate the inclusion of undesired bulk and coarse nickel particles which would otherwise deteriorate the contact properties.

摘要翻译： 银基电接触材料，具有优异的电弧侵蚀性能，同时具有改善的耐磨性和耐焊接性。 接触材料基本上由0.5至39.9重量％的镍，0.14至7.0重量％的镍氧化物和余量的银组成。 该材料含有不少于0.4重量％的镍，其负责构成粒径不大于1μm的微小镍和镍颗粒，并分散在银基质中以加强材料以提供改善的耐磨性和耐焊接性。 包括分散的微小氧化镍颗粒以稳定在开启和闭合触点时发生的电弧，以便在发生电弧时，将弧的一端基本上固定在整个接触表面上的任何立即可用的点处， 从而防止电弧端部猛烈地横过或超过接触表面移动，从而最小化电弧相关的损坏或电弧侵蚀。 接触材料根据可以分散微量镍和氧化镍颗粒足够量的新方法制造，并且消除了包含不希望的体积和粗大的镍颗粒，否则会使接触性能变差。

公开(公告)号：US5198015A

公开(公告)日：1993-03-30

申请号：US718035

申请日：1991-06-20

申请人： Koji Tsuji ,  Yoshinobu Takegawa ,  Hayato Inada ,  Shuji Yamada

发明人： Koji Tsuji ,  Yoshinobu Takegawa ,  Hayato Inada ,  Shuji Yamada

IPC分类号： C22C1/04 ,  C22C5/06 ,  H01B1/02 ,  H01H1/023 ,  H01H1/0237 ,  H01H11/04

CPC分类号： H01H1/0237

摘要： A silver base electrical contact material with superior resistance to arc erosion along with improved wear and welding resistance. The contact material consists essentially of 0.5 to 39.9 wt % of nickel, 0.14 to 7.0 wt % of nickel oxides, and balance silver. The material contains not less than, 0.4 wt % of nickel responsible for constituting minute nickel and nickel particles which have a particle size of not more than 1 .mu.m and are dispersed in a silver matrix for strengthening the material to give improved wear and welding resistance. The dispersed minute nickel oxide particles are included to stabilize arcing occurring at the time of opening and closing contacts in such a manner as to anchor one end of an arc substantially at any immediately available point over the entire contact surface as soon as the arcing occurs, thereby preventing the arc end from moving violently across or beyond the contact surface and therefore minimizing arc related damages or arc erosion. The contact material is made in accordance with a novel method which can disperse the minute nickel and nickel oxide particles in adequate quantities and eliminate the inclusion of undesired bulk and coarse nickel particles which would otherwise deteriorate the contact properties.

公开(公告)号：US20120085907A1

公开(公告)日：2012-04-12

申请号：US13262412

申请日：2010-03-31

申请人： Koji Tsuji

发明人： Koji Tsuji

IPC分类号： H01L27/146

CPC分类号： G01J5/12 ,  G01J5/02 ,  G01J5/0225 ,  G01J5/023 ,  H01L27/14649 ,  H01L27/14669 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

摘要： The infrared array sensor comprises a base with recess and a plurality of image elements on the base to cover the recess. The image element has the first infrared absorption members and the thermosensors. The thin film structural body is formed with a slit which divides the thin film structural body into the cantilevers. The cantilever has one lengthwise end which is defined as the first end, and remaining one lengthwise end which is defined as the second end. The thermosensor is disposed on the cantilever. When the temperature variation of the thermosensor is caused, the thermosensor generates the output signal corresponding to the temperature variation of the thermosensor.

摘要翻译： 红外阵列传感器包括具有凹陷的基座和在基座上的多个图像元件以覆盖凹部。 图像元件具有第一红外吸收构件和热敏元件。 薄膜结构体形成有将薄膜结构体分成悬臂的狭缝。 悬臂具有一个纵向端，其被定义为第一端，并且剩余一个纵向端被限定为第二端。 热传感器设置在悬臂上。 当引起热敏传感器的温度变化时，热敏传感器产生对应于热敏传感器的温度变化的输出信号。

公开(公告)号：US07484410B2

公开(公告)日：2009-02-03

申请号：US10598333

申请日：2005-03-14

申请人： Koji Tsuji ,  Kazuo Gouda ,  Masao Kirihara ,  Youichi Nishijima ,  Satoshi Hyodo

发明人： Koji Tsuji ,  Kazuo Gouda ,  Masao Kirihara ,  Youichi Nishijima ,  Satoshi Hyodo

IPC分类号： G01C19/56 ,  G01P9/04

CPC分类号： G01C19/5719

摘要： Disclosed is a gyro sensor, which comprises a primary base plate (1) and a support base plate (2) which are superimposed on one another. The primary base plate (1) is provided with a driven mass body (11) to be driven in such a manner as to be vibrated in a direction intersecting with a surface of the support base plate (2), and a detection mass body (12) coupled with the driven mass body (11) through a drive spring (13) and adapted to be displaceable in a plane along the support base plate (2). Two detection springs (15) extending in the arranging direction of the driven mass body (11) and the detection mass body (12) are connected, respectively, to opposite side of the detection mass body (12), and the other ends of the detection springs (15) are connected together through a coupling segment (16). A fixing segment (17) provided at a longitudinally intermediate portion of the coupling segment (16) is fixed to the support base plate (2). A member formed by integrating the driven mass body (11) and the detection mass body (12) through the drive spring (13) is supported relative to the support base plate (2) by the detection springs (15) in a cantilever manner.

摘要翻译： 公开了一种陀螺传感器，其包括彼此重叠的主基板（1）和支撑基板（2）。 主基板（1）设置有驱动质量体（11），其被驱动以便在与支撑基板（2）的表面相交的方向上振动，并且检测质量体（ 12），其通过驱动弹簧（13）与被驱动质量体（11）联接并且适于沿着支撑基板（2）在平面中移位。 沿被驱动质量体（11）和检测质量体（12）的排列方向延伸的两个检测弹簧（15）分别连接到检测质量体（12）的相对侧，另一端 检测弹簧（15）通过联接段（16）连接在一起。 设置在联接段（16）的纵向中间部分的固定段（17）固定到支撑基板（2）上。 通过驱动弹簧（13）将被驱动质量体（11）和检测质量体（12）集成形成的部件通过检测弹簧（15）以悬臂方式相对于支撑基板（2）支撑。

公开(公告)号：US07232964B2

公开(公告)日：2007-06-19

申请号：US11404875

申请日：2006-04-17

申请人： Koji Tsuji ,  Mikio Yamashita

发明人： Koji Tsuji ,  Mikio Yamashita

IPC分类号： G01G21/00

CPC分类号： G01G21/18 ,  G01G21/23 ,  Y10S177/09

摘要： In a load transfer mechanism which transfers load to a load cell that constitutes a Roberval mechanism, a load transfer member has at least an area right above a load cell mounting section in the top surface thereof as a concave surface area formed to be lower than the remaining area of the top surface thereof so that it does not contact a cover member. Thus, if the barycentric position of the load of an object to be weighed placed on the cover member, regardless of whether the load is concentrated load or divided load, the load transfer mechanism can reduce the difference of the influence of deflection of the load transfer member or moment imposed on the load, transfer given load to the load cell through the load transfer member and decrease a span error produced by the load position of an object to be weighed.

摘要翻译： 在将负载传递到构成罗伯机构的负载传感器的负载传递机构中，负载传递部件至少具有在其顶面的负载传感器安装部的正上方的区域，该面积形成为低于 其顶面的剩余面积使得其不与盖构件接触。 因此，如果被加载物体的负载的重心位置放置在盖构件上，而不管负载是集中负载还是分压，负载传递机构可以减小负载传递的偏转影响的差异 施加在负载上的构件或力矩，通过负载传递构件将给定负载传递到测力传感器，并减小由待称重物体的载荷位置产生的跨度误差。

公开(公告)号：US5022932A

公开(公告)日：1991-06-11

申请号：US468210

申请日：1990-01-22

申请人： Shuji Yamada ,  Koji Tsuji ,  Yoshinobu Takegawa ,  Akira Tanimura ,  Akira Menju ,  Nobuyoshi Yano

发明人： Shuji Yamada ,  Koji Tsuji ,  Yoshinobu Takegawa ,  Akira Tanimura ,  Akira Menju ,  Nobuyoshi Yano

IPC分类号： C22C5/06 ,  H01B1/02

CPC分类号： C22C5/06 ,  H01B1/02 ,  H01B1/026 ,  Y10T428/12486 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896

摘要： An electrically conductive composite material is formed by dispersing in a matrix metal the other metal which is not solid soluble with the matrix metal. The other metal is finely divided to an extent of not excessively lowering the conductivity and is mixed in the matrix metal in a particle amount with which respective particles keep a mutual distance effective to strengthen the composite material, whereby the material is sufficiently improved in the mechanical strength and wear resistance and remarkably reduced in the high temperature deformation. Such conductive composite material can be obtained through a melt atomization.

公开(公告)号：US20140220668A1

公开(公告)日：2014-08-07

申请号：US14240036

申请日：2012-08-21

申请人： Hiroaki Tachibana ,  Koji Tsuji ,  Takashi Saijo ,  Eiichi Tamiya ,  Masato Saito

发明人： Hiroaki Tachibana ,  Koji Tsuji ,  Takashi Saijo ,  Eiichi Tamiya ,  Masato Saito

IPC分类号： B01L7/00 ,  C12Q1/68

CPC分类号： B01L7/52 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00828 ,  B01J2219/00831 ,  B01J2219/00853 ,  B01J2219/00869 ,  B01J2219/00873 ,  B01J2219/00912 ,  B01J2219/00957 ,  B01J2219/00961 ,  B01L3/502707 ,  B01L7/525 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0883 ,  B01L2300/0887 ,  B01L2300/0893 ,  B01L2300/1827 ,  C12M23/16 ,  C12Q1/6844 ,  G01N27/44708 ,  G01N27/44791

摘要： To provide a microfluidic device which does not apply a meandering reaction channel and thus can be reduced in size, the microfluidic device comprising a reaction channel is characterized in that a plurality of thermal cycle regions which respectively comprise at least two thermal regions with different temperatures are repeatedly provided and the reaction channel passes through the plurality of thermal cycle regions.

摘要翻译： 为了提供不应用曲折反应通道并因此可以减小尺寸的微流体装置，包括反应通道的微流体装置的特征在于分别包括至少两个具有不同温度的热区域的多个热循环区域是 反复提供并且反应通道穿过多个热循环区域。

公开(公告)号：US20110175145A1

公开(公告)日：2011-07-21

申请号：US12998204

申请日：2009-09-24

申请人： Koji Tsuji ,  Yosuke Hagihara ,  Naoki Ushiyama

发明人： Koji Tsuji ,  Yosuke Hagihara ,  Naoki Ushiyama

IPC分类号： H01L29/66 ,  H01L31/028

CPC分类号： H01L27/14649 ,  G01J5/02 ,  G01J5/0225 ,  G01J5/06 ,  G01J5/08 ,  G01J5/0846 ,  G01J5/12 ,  G01J5/20 ,  H01L27/14669 ,  H01L27/14692 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/13091 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

摘要： The infrared sensor (1) includes a base (10), and an infrared detection element (3) formed over a surface of the base (10). The infrared detection element (3) includes an infrared absorption member (33) in the form of a thin film configured to absorb infrared, a temperature detection member (30) configured to measure a temperature difference between the infrared absorption member (33) and the base (10), and a safeguard film (39). The infrared element (3) is spaced from the surface of the base (10) for thermal insulation. The temperature detection member (30) includes a p-type polysilicon layer (35) formed over the infrared absorption member (33) and the base (10), an n-type polysilicon layer (34) formed over the infrared absorption member (33) and the base (10) without contact with the p-type polysilicon layer (35), and a connection layer (36) configured to electrically connect the p-type polysilicon layer (35) to the n-type polysilicon layer (34). The safeguard film (39) is a polysilicon layer formed on an infrared incident surface defined as an opposite surface of the infrared absorption member (33) from the base (10) to cover the infrared incident surface.

摘要翻译： 红外传感器（1）包括基座（10）和形成在基座（10）的表面上的红外线检测元件（3）。 红外线检测元件（3）包括被构造成吸收红外线的薄膜形式的红外线吸收部件（33），配置为测量红外线吸收部件（33）与红外线吸收部件 基座（10）和保护膜（39）。 红外元件（3）与基座（10）的表面间隔开以进行绝热。 温度检测部件（30）包括在红外线吸收部件（33）和基体（10）上形成的p型多晶硅层（35），在红外线吸收部件（33）的上方形成有n型多晶硅层 ）和不与p型多晶硅层（35）接触的基极（10），以及被配置为将p型多晶硅层（35）电连接到n型多晶硅层（34）的连接层（36） 。 保护膜（39）是形成在红外线入射面上的多晶硅层，该红外线入射面被限定为与基部（10）相对的红外线吸收部件（33）的与红外线入射面相反的面。

公开(公告)号：US07642611B2

公开(公告)日：2010-01-05

申请号：US10598847

申请日：2005-03-29

申请人： Koji Tsuji ,  Yoshiharu Sanagawa ,  Masao Kirihara ,  Kazuo Gouda ,  Youichi Nishijima

发明人： Koji Tsuji ,  Yoshiharu Sanagawa ,  Masao Kirihara ,  Kazuo Gouda ,  Youichi Nishijima

IPC分类号： H01L27/14 ,  H01L29/82 ,  H01L29/84

CPC分类号： B81C1/0023 ,  B81B7/0048 ,  B81B7/007 ,  B81B2207/012 ,  B81B2207/096 ,  B81B2207/097 ,  G01P1/023 ,  G01P15/0802 ,  H01L2224/16225 ,  Y10T29/49002

摘要： A sensor system includes a sensor device (10) and an integrated circuit (20) for driving the device (10). The device (10) includes a sensor body (1) of a silicon-based material, an upper sealing member (2) of a silicon-based material, and a lower sealing member (3) of a silicon-based material. The upper sealing member (2) and the lower sealing member (3) are joined together to cooperatively house the body (1) therewithin in an airtight manner. The device (10) and the circuit (20) are formed as a stacked body. The body (1) is electrically connected to a wiring pattern (12) of the circuit (20) through a conductive through-path (4) penetrating the upper sealing member (4) and a mounting electrode (5) provided on an outer surface of the upper sealing member (2). The device (10) is connected to an MID substrate (30) through the circuit (20).

摘要翻译： 传感器系统包括传感器装置（10）和用于驱动装置（10）的集成电路（20）。 设备（10）包括硅基材料的传感器体（1），硅基材料的上密封构件（2）和硅基材料的下密封构件（3）。 上密封构件（2）和下密封构件（3）接合在一起，以密封的方式在其中协同地容纳主体（1）。 装置（10）和电路（20）形成为层叠体。 主体（1）通过穿过上密封构件（4）的导电通路（4）和设置在外表面上的安装电极（5）与电路（20）的布线图案（12）电连接， 的上密封构件（2）。 设备（10）通过电路（20）连接到MID基板（30）。