公开(公告)号：US07642611B2

公开(公告)日：2010-01-05

申请号：US10598847

申请日：2005-03-29

申请人： Koji Tsuji ,  Yoshiharu Sanagawa ,  Masao Kirihara ,  Kazuo Gouda ,  Youichi Nishijima

发明人： Koji Tsuji ,  Yoshiharu Sanagawa ,  Masao Kirihara ,  Kazuo Gouda ,  Youichi Nishijima

IPC分类号： H01L27/14 ,  H01L29/82 ,  H01L29/84

CPC分类号： B81C1/0023 ,  B81B7/0048 ,  B81B7/007 ,  B81B2207/012 ,  B81B2207/096 ,  B81B2207/097 ,  G01P1/023 ,  G01P15/0802 ,  H01L2224/16225 ,  Y10T29/49002

摘要： A sensor system includes a sensor device (10) and an integrated circuit (20) for driving the device (10). The device (10) includes a sensor body (1) of a silicon-based material, an upper sealing member (2) of a silicon-based material, and a lower sealing member (3) of a silicon-based material. The upper sealing member (2) and the lower sealing member (3) are joined together to cooperatively house the body (1) therewithin in an airtight manner. The device (10) and the circuit (20) are formed as a stacked body. The body (1) is electrically connected to a wiring pattern (12) of the circuit (20) through a conductive through-path (4) penetrating the upper sealing member (4) and a mounting electrode (5) provided on an outer surface of the upper sealing member (2). The device (10) is connected to an MID substrate (30) through the circuit (20).

摘要翻译： 传感器系统包括传感器装置（10）和用于驱动装置（10）的集成电路（20）。 设备（10）包括硅基材料的传感器体（1），硅基材料的上密封构件（2）和硅基材料的下密封构件（3）。 上密封构件（2）和下密封构件（3）接合在一起，以密封的方式在其中协同地容纳主体（1）。 装置（10）和电路（20）形成为层叠体。 主体（1）通过穿过上密封构件（4）的导电通路（4）和设置在外表面上的安装电极（5）与电路（20）的布线图案（12）电连接， 的上密封构件（2）。 设备（10）通过电路（20）连接到MID基板（30）。

公开(公告)号：US20080156095A1

公开(公告)日：2008-07-03

申请号：US10598847

申请日：2005-03-29

申请人： Koji Tsuji ,  Yoshiharu Sanagawa ,  Masao Kirihara ,  Kazuo Gouda ,  Youichi Nishijima

发明人： Koji Tsuji ,  Yoshiharu Sanagawa ,  Masao Kirihara ,  Kazuo Gouda ,  Youichi Nishijima

IPC分类号： G01C19/00

CPC分类号： B81C1/0023 ,  B81B7/0048 ,  B81B7/007 ,  B81B2207/012 ,  B81B2207/096 ,  B81B2207/097 ,  G01P1/023 ,  G01P15/0802 ,  H01L2224/16225 ,  Y10T29/49002

摘要： A sensor system includes a sensor device (10) and an integrated circuit (20) for driving the device (10). The device (10) includes a sensor body (1) of a silicon-based material, an upper sealing member (2) of a silicon-based material and a lower sealing member (3) of a silicon-based material. The upper sealing member (2) and the lower sealing member (3) are joined together to cooperatively house the body (1) therewithin in an airtight manner. The device (10) and the circuit (20) are formed as a stacked body. The body (1) is electrically connected to a wiring pattern (12) of the circuit (20) through a conductive through-path (4) penetrating the upper sealing member (4) and a mounting electrode (5) provided on an outer surface of the upper sealing member (2). The device (10) is connected to an MID substrate (30) through the circuit (20).

摘要翻译： 传感器系统包括传感器装置（10）和用于驱动装置（10）的集成电路（20）。 设备（10）包括硅基材料的传感器体（1），硅基材料的上密封构件（2）和硅基材料的下密封构件（3）。 上密封构件（2）和下密封构件（3）接合在一起，以密封的方式在其中协同地容纳主体（1）。 装置（10）和电路（20）形成为层叠体。 主体（1）通过穿过上密封构件（4）的导电通路（4）和设置在外表面上的安装电极（5）与电路（20）的布线图案（12）电连接， 的上密封构件（2）。 设备（10）通过电路（20）连接到MID基板（30）。

公开(公告)号：US20120235044A1

公开(公告)日：2012-09-20

申请号：US13513426

申请日：2010-12-17

申请人： Mitsuhiko Ueda ,  Takami Okubayashi ,  Takanori Sugiyama ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Yushi Nakamura ,  Masao Kirihara

发明人： Mitsuhiko Ueda ,  Takami Okubayashi ,  Takanori Sugiyama ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Yushi Nakamura ,  Masao Kirihara

IPC分类号： G01J5/04 ,  G01J5/02

CPC分类号： G01J5/16 ,  G01J5/02 ,  G01J5/0205 ,  G01J5/0215 ,  G01J5/04 ,  G01J5/046 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0875 ,  H01L2224/48137 ,  H01L2924/3025 ,  H01L2924/00

摘要： An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.

摘要翻译： 红外线传感器模块包括：红外线传感器装置，设置在基板上并被配置为接收红外信号; 信号处理电路装置，被配置为处理来自所述红外线传感器装置的输出; 设置在距红外线传感器装置预定距离处的金属壳体，该金属壳体包括设置有用于将红外线传感器装置上的图像与外部红外信号耦合的光学系统的光入射窗，并且容纳红外线传感器装置和 信号处理电路装置; 以及设置在所述红外线传感器装置和所述壳体之间的传感器盖和所述信号处理电路装置，所述传感器盖包括被配置为将经由所述光学系统进入的所述红外线信号引导到所述红外线传感器装置的透光部。

公开(公告)号：US08952331B2

公开(公告)日：2015-02-10

申请号：US13513426

申请日：2010-12-17

申请人： Mitsuhiko Ueda ,  Takami Okubayashi ,  Takanori Sugiyama ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Yushi Nakamura ,  Masao Kirihara

发明人： Mitsuhiko Ueda ,  Takami Okubayashi ,  Takanori Sugiyama ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Yushi Nakamura ,  Masao Kirihara

IPC分类号： G01J5/20 ,  G01J5/16 ,  G01J5/02 ,  G01J5/04 ,  G01J5/08

CPC分类号： G01J5/16 ,  G01J5/02 ,  G01J5/0205 ,  G01J5/0215 ,  G01J5/04 ,  G01J5/046 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0875 ,  H01L2224/48137 ,  H01L2924/3025 ,  H01L2924/00

摘要： An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.

摘要翻译： 红外线传感器模块包括：红外线传感器装置，设置在基板上并被配置为接收红外信号; 信号处理电路装置，被配置为处理来自所述红外线传感器装置的输出; 设置在距红外线传感器装置预定距离处的金属壳体，该金属壳体包括设置有用于将红外线传感器装置上的图像与外部红外信号耦合的光学系统的光入射窗，并且容纳红外线传感器装置和 信号处理电路装置; 以及设置在所述红外线传感器装置和所述壳体之间的传感器盖和所述信号处理电路装置，所述传感器盖包括被配置为将经由所述光学系统进入的所述红外线信号引导到所述红外线传感器装置的透光部。

公开(公告)号：US20130093037A1

公开(公告)日：2013-04-18

申请号：US13806111

申请日：2011-06-23

申请人： Masao Kirihara ,  Hiroshi Yamanaka ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Yushi Nakamura ,  Mitsuhiko Ueda

发明人： Masao Kirihara ,  Hiroshi Yamanaka ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Yushi Nakamura ,  Mitsuhiko Ueda

IPC分类号： H01L31/024

CPC分类号： H01L31/024 ,  G01J5/04 ,  G01J5/045 ,  G01J5/06 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0831 ,  G01J5/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.

摘要翻译： 红外线传感器包括：红外线传感器芯片，其中在半导体衬底的一个表面侧上排列有包括由热电堆形成的温度敏感部分的多个像素部分; 以及处理红外线传感器芯片的输出信号的IC芯片。 一种包装体，包括并排设置红外线传感器芯片和IC芯片的封装主体，以及具有透射红外线的透镜并与封装主体气密结合的封装盖。 该封装件设置有盖构件，该盖构件包括窗孔，红外线通过该孔穿过红外线传感器芯片，并使像素部之间的热接点和冷接点的温度变化量相等，由IC加热引起的温度变化 芯片。

公开(公告)号：US09478682B2

公开(公告)日：2016-10-25

申请号：US13806111

申请日：2011-06-23

申请人： Masao Kirihara ,  Hiroshi Yamanaka ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Yushi Nakamura ,  Mitsuhiko Ueda

发明人： Masao Kirihara ,  Hiroshi Yamanaka ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Yushi Nakamura ,  Mitsuhiko Ueda

IPC分类号： H01L31/0232 ,  H01L31/024 ,  G01J5/04 ,  G01J5/06 ,  G01J5/08 ,  G01J5/12

CPC分类号： H01L31/024 ,  G01J5/04 ,  G01J5/045 ,  G01J5/06 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0831 ,  G01J5/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.

摘要翻译： 红外线传感器包括：红外线传感器芯片，其中在半导体衬底的一个表面侧上排列有包括由热电堆形成的温度敏感部分的多个像素部分; 以及处理红外线传感器芯片的输出信号的IC芯片。 一种包装体，包括并排设置红外线传感器芯片和IC芯片的封装主体，以及具有透射红外线的透镜并与封装主体气密结合的封装盖。 该封装件设置有盖构件，该盖构件包括窗孔，红外线通过该孔穿过红外线传感器芯片，并使像素部之间的热接点和冷接点的温度变化量相等，由IC加热引起的温度变化 芯片。

公开(公告)号：US20120133042A1

公开(公告)日：2012-05-31

申请号：US13320998

申请日：2009-05-21

申请人： Shintarou Hayashi ,  Mitsuhiko Ueda ,  Yoshiharu Sanagawa ,  Takamasa Sakai

发明人： Shintarou Hayashi ,  Mitsuhiko Ueda ,  Yoshiharu Sanagawa ,  Takamasa Sakai

IPC分类号： H01L23/488 ,  H01L23/48 ,  H01L23/495

CPC分类号： G01P15/123 ,  B81B7/0048 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0842 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13191 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13561 ,  H01L2224/1357 ,  H01L2224/13691 ,  H01L2224/14155 ,  H01L2224/14165 ,  H01L2224/14179 ,  H01L2224/16145 ,  H01L2224/1703 ,  H01L2224/29191 ,  H01L2224/321 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81862 ,  H01L2224/83 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/0715 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A mounting structure of chip comprises a substrate having a base, a chip on the upper surface of the base, and adhesive agents which bonds the base and the first chip. The adhesive agent is applied to the upper surface of the base. The chip has a rectangular shape to have a width and a length, and is bonded at its lower surface to the base. The adhesive agents comprises the first adhesive agent, the second adhesive agent, and the third adhesive agent which are disposed on the three spots of the upper surface of the base, respectively. The three spots on the base are located on vertexes of a triangle. The first chip is bonded to the base by only the first adhesive agent, the second adhesive agent, and the third adhesive agent.

摘要翻译： 芯片的安装结构包括具有底座，底座上表面上的芯片以及粘接基座和第一芯片的粘接剂的基片。 粘合剂施加到基底的上表面。 芯片具有宽度和长度的矩形形状，并且在其下表面与基底结合。 粘合剂包括分别设置在基底的上表面的三个点上的第一粘合剂，第二粘合剂和第三粘合剂。 基座上的三个点位于三角形的顶点。 第一芯片仅通过第一粘合剂，第二粘合剂和第三粘合剂结合到基底上。

公开(公告)号：US06713844B2

公开(公告)日：2004-03-30

申请号：US10026639

申请日：2001-12-27

申请人： Jun Tatsuta ,  Masao Kubo ,  Shinobu Kida ,  Shigenari Takami ,  Ikko Kuzuhara ,  Kyoji Tanaka ,  Yoshiharu Sanagawa

发明人： Jun Tatsuta ,  Masao Kubo ,  Shinobu Kida ,  Shigenari Takami ,  Ikko Kuzuhara ,  Kyoji Tanaka ,  Yoshiharu Sanagawa

IPC分类号： H01L2348

CPC分类号： H01L23/49833 ,  H01L21/563 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/29 ,  H01L25/105 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13019 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/83192 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor-chip mounting substrate with a high degree of reliability of an electrical connection between a substrate and a semiconductor chip such as IC chips is provided. The substrate has at least one projection thereon, which is integrally molded with the substrate. A conductive layer is formed on the projection to obtain a first bump. The semiconductor chip has a terminal projecting as a second bump on its surface. The semiconductor chip is mounted on the substrate such that the first bump contacts the second bump. A required contact pressure between the first bump and the second bump is held by use of a pressure holding means.

摘要翻译： 提供了具有高可靠性的基板和诸如IC芯片的半导体芯片之间的电连接的半导体芯片安装基板。 衬底上具有至少一个突起，其与衬底整体模制。 在突起上形成导电层以获得第一凸块。 半导体芯片具有在其表面上作为第二凸起突出的端子。 半导体芯片安装在基板上，使得第一凸块接触第二凸块。 通过使用压力保持装置保持第一凸起和第二凸起之间的所需接触压力。