公开(公告)号：US20200009830A1

公开(公告)日：2020-01-09

申请号：US16571302

申请日：2019-09-16

Applicant: HENKEL AG & CO. KGAA ,  HENKEL IP & HOLDING GMBH

Inventor： Yusuke Horiguchi ,  Jie Bai ,  Tadashi Takano

IPC: B32B7/06 ,  B32B27/08 ,  B32B27/18 ,  B32B27/30 ,  C09J7/38 ,  C09J7/50

Abstract: Provided herein are multilayer articles comprising at least one underfill film layer. In certain aspects, there are also provided methods for improving the worklife stability of such articles. In certain aspects, there are also provided methods for improving the storage stability of such articles. In certain aspects, there are also provided methods for making such articles. In certain aspects, there are also provided stabilized articles produced by the methods described herein.

公开(公告)号：US10242923B2

公开(公告)日：2019-03-26

申请号：US15945772

申请日：2018-04-05

Applicant: HENKEL IP & HOLDING GMBH ,  HENKEL AG & CO. KGAA

Inventor： Jie Bai ,  Qiaohong Huang ,  Hong Jiang ,  Youko Murata ,  Yusuke Horiguchi ,  YounSang Kim ,  Tadashi Takano

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/29 ,  C08G59/18 ,  C08K5/09 ,  C08L33/04 ,  C08L63/00 ,  C09D4/06 ,  C08F283/10 ,  H01L21/56 ,  C09D163/00 ,  C08K3/36 ,  C08L33/06 ,  C08L79/08 ,  C08L33/08 ,  C08L39/04 ,  G01N25/48

Abstract: Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.

公开(公告)号：US20180126698A1

公开(公告)日：2018-05-10

申请号：US15873087

申请日：2018-01-17

Applicant: Henkel IP & Holding GmbH ,  Henkel AG & Co. KGaA

Inventor： Jie Bai ,  Yusuke Horiguchi ,  Hung Chau ,  Tadashi Takano

IPC: B32B7/06 ,  B32B7/12 ,  B32B27/36 ,  B32B27/08 ,  B32B27/20 ,  C09J7/40 ,  C09J7/38 ,  C09J7/50

CPC classification number: B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/281 ,  B32B27/283 ,  B32B27/304 ,  B32B27/308 ,  B32B27/322 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2274/00 ,  B32B2307/714 ,  B32B2307/748 ,  B32B2457/00 ,  B32B2457/14 ,  C09J7/385 ,  C09J7/401 ,  C09J7/50 ,  C09J2433/00 ,  C09J2433/003 ,  C09J2467/005 ,  H01L51/003 ,  H01L51/0097 ,  Y02E10/549

Abstract: Provided herein are stabilized underfill film-containing assemblies which extend the work-life of underfill films. In accordance with certain aspects of the present invention, there are also provided stabilized underfill film-containing assemblies which extend the shelf-life of underfill films. In certain aspects of the present invention, there are also provided methods for extending the work-life of underfill films. In another aspect of the present invention, there are also provided methods for extending the shelf-life of underfill films.

公开(公告)号：US11578202B2

公开(公告)日：2023-02-14

申请号：US17306869

申请日：2021-05-03

Applicant: Henkel AG & Co. KGaA

Inventor： Jie Bai

IPC: C08L63/00 ,  C08K3/36 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  C08L71/02 ,  H01L21/77 ,  C08L53/00 ,  C08L61/06 ,  C08L79/04 ,  C08G73/02 ,  C08L79/02 ,  C08G73/06 ,  C08L79/08

Abstract: Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.

公开(公告)号：US20180226313A1

公开(公告)日：2018-08-09

申请号：US15945772

申请日：2018-04-05

Applicant: HENKEL IP & HOLDING GMBH ,  HENKEL AG & CO. KGAA

Inventor： Jie Bai ,  Qiaohong Huang ,  Hong Jiang ,  Youko Murata ,  Yusuke Horiguchi ,  YounSang Kim ,  Tadashi Takano

IPC: H01L23/29 ,  H01L21/56 ,  C08L63/00 ,  C08L33/08 ,  C08L39/04

CPC classification number: H01L23/293 ,  C08F283/10 ,  C08G59/18 ,  C08K3/36 ,  C08K5/09 ,  C08L33/04 ,  C08L33/06 ,  C08L33/08 ,  C08L39/04 ,  C08L63/00 ,  C08L79/085 ,  C08L2203/20 ,  C09D4/06 ,  C09D163/00 ,  G01N25/4866 ,  H01L21/563 ,  C08F291/10 ,  C08F220/52 ,  C08F220/10

Abstract: Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.

公开(公告)号：US20240174854A1

公开(公告)日：2024-05-30

申请号：US18418268

申请日：2024-01-20

Applicant: Henkel AG & Co. KGaA

Inventor： Jie Bai ,  James Sungwook Jang ,  Kyu Chang Shim ,  Qizhuo Zhuo

IPC: C08L63/00 ,  B29C39/00 ,  B29C39/38 ,  B29K63/00 ,  B29K105/16 ,  C08J5/18

CPC classification number: C08L63/00 ,  C08J5/18 ,  B29C39/003 ,  B29C39/38 ,  B29K2063/00 ,  B29K2105/16 ,  B29K2995/0012 ,  B29K2995/0077 ,  C08J2363/00

Abstract: The disclosure relates to compositions for forming films and the use of said films in three-dimension through-silicon-via (3D TSV) packages. In certain aspects, the disclosure relates to compositions comprising one or more resins, one or more imidazoles with latent thermal activity, one or more inorganic fillers, and one or more additives, to B-stage films prepared from the disclosed compositions, and to cured films obtained after cure of the disclosed compositions.

公开(公告)号：US11203181B2

公开(公告)日：2021-12-21

申请号：US15873087

申请日：2018-01-17

Applicant: Henkel IP & Holding GmbH ,  Henkel AG & Co. KGaA

Inventor： Jie Bai ,  Yusuke Horiguchi ,  Hung Chau ,  Tadashi Takano

IPC: B32B7/12 ,  B32B7/06 ,  B32B27/08 ,  B32B27/20 ,  B32B27/36 ,  H01L51/00 ,  B32B27/42 ,  B32B27/38 ,  B32B27/28 ,  B32B27/32 ,  B32B27/30 ,  B32B27/18 ,  C09J7/38 ,  C09J7/50 ,  C09J7/40

Abstract: Provided herein are stabilized underfill film-containing assemblies which extend the work-life of underfill films. In accordance with certain aspects of the present invention, there are also provided stabilized underfill film-containing assemblies which extend the shelf-life of underfill films. In certain aspects of the present invention, there are also provided methods for extending the work-life of underfill films. In another aspect of the present invention, there are also provided methods for extending the shelf-life of underfill films.

公开(公告)号：US20240209166A1

公开(公告)日：2024-06-27

申请号：US18416190

申请日：2024-01-18

Applicant: Henkel AG & Co. KGaA

Inventor： Jie Bai ,  Qizhuo Zhuo ,  James Sungwook Jang ,  Kyu Chang Shim

IPC: C08J5/18 ,  C08J3/24 ,  C08K5/3445 ,  H01L23/29

CPC classification number: C08J5/18 ,  C08J3/24 ,  C08K5/3445 ,  H01L23/295 ,  C08J2363/10

Abstract: The disclosure relates to compositions for forming films and the use of said films in three-dimension through-silicon-via (3D TSV) packages. In certain aspects, the disclosure relates to compositions comprising one or more resins, one or more imidazoles with latent thermal activity, one or more inorganic fillers, and one or more additives, to B-stage films prepared from the disclosed compositions, and to cured films obtained after cure of the disclosed compositions.