摘要:
In one method of compensating for the distortion of front-to-backside alignment optics, a displacement vector between the estimated position of a substrate mark and the actual position of a substrate mark is calculated. An optical correction array is also calculated by moving a reference substrate by a fixed amount and comparing how far an image of a point on the back side of a reference substrate moves to how far a corresponding point on the front side of the substrate moves. The displacement vector and optical correction array may then be used to accurately calculate the position of further substrates.
摘要:
According to a first aspect of the invention, there is provided a lithographic method of providing an alignment mark on a layer provided on a substrate, the method including providing the alignment mark on an area of the layer which is oriented within a certain range of angles with respect to a surface of the substrate on which the layer is provided.
摘要:
An optical element is placed in the alignment beam during alignment. The optical element serves to focus the alignment beam onto the substrate alignment mark when it is at a different focal length from the front surface of the substrate.
摘要:
To calibrate a front-to-backside alignment system a transparent calibration substrate with reference markers on opposite sides is used. A plane plate is inserted to displace the focal position of the alignment system from the top to bottom surface of the calibration substrate.
摘要:
To align between layers having a large Z separation, an alignment system which illuminates reference markers with normally incident radiation is used. The alignment system has an illumination system that is telecentric on the substrate side.
摘要:
According to a first aspect of the invention, there is provided a lithographic method of providing an alignment mark on a layer provided on a substrate, the method including providing the alignment mark on an area of the layer which is oriented within a certain range of angles with respect to a surface of the substrate on which the layer is provided.
摘要:
A lithographic projection apparatus is provided with an optical system built into the wafer table for producing an image of a wafer mark that is provided on the back side of the wafer. The image is located at the plane of the front side of the wafer and can be viewed by an alignment system from the front side of the wafer. Simultaneous alignment between marks on the back and front of the wafer and a mask can be performed using a pre-existing alignment system.
摘要:
The invention is directed to enabling substrate identification by comparing the measured distance between two features on an unidentified substrate with one or more stored distances. The one or more stored distances are the distances intended during the design of one or more substrates. The unidentified substrate is identified by a stored distance that corresponds to the measured distance. The two features are selected from a plurality of features that may be placed on a back side or a front side of a substrate. An optical system is provided for reading the features from the back side or a front side of the substrate.
摘要:
A method of pre-aligning a substrate in a lithographic apparatus is described. The substrate has at least one alignment mark provided on a side of the substrate. The method includes determining a relationship between a position of the at least one alignment mark, at least part of an edge of the substrate, and a center of the substrate. A substrate support is provided to support a substrate, the substrate support having at least one optical view window at a predetermined location to view a part of the side of the substrate. The substrate is placed on the substrate support on the basis of the relationship to position the at least one alignment mark in the at least one optical view window.
摘要:
A lithographic apparatus has a plurality of patterning arrays (e.g., 2, 4, etc.), which are spaced apart in an object plane. A combined, overlapped image of the patterning arrays is projected onto the substrate. Because the image is formed from radiation produced from spaced apart patterning arrays, the image arrives from different angles and has a higher effective numerical aperture (NA).