摘要:
An observation system, usable with a projection optical system for optically projecting a first object upon a second object by use of a light of a first wavelength, for observing the second object by way of the projection optical system and by use of a light of a second wavelength different from the first wavelength. The observation system includes an observation optical system having a lens element and a parallel-surface plate which is inclined with respect to an optical axis of the observation optical system, wherein the observation optical system is arranged to form an image of the second object on a predetermined image surface and wherein the parallel-surface plate is arranged to substantially correct coma caused by the projection optical system.
摘要:
A projection exposure apparatus for projecting a pattern formed on a first object such as a reticle upon a second object such as a semiconductor wafer by use of a projection lens system, is disclosed. In the apparatus, a light of a predetermined wavelength is used for the pattern projection, and a light having a different wavelength is used to align the first and second objects by way of the projection lens system. A dichroic mirror film is disposed inclinedly between the first object and the projection lens system so as to reflect one of the light of the predetermined wavelength and the light of the different wavelength, and also to transmit the other. By this dichroic mirror film, the light used for the alignment and reflected back from the second object is extracted out of a light path between the first and second objects. After correcting effects of chromatic aberrations of the projection lens system with respect to the different wavelength, the light for the alignment is passed through the first object. By this, accurate alignment using the light of a wavelength different from that to be used for the pattern projection, is made practically attainable. Also, use of lights of different wavelengths, other than the wavelength to be used for the pattern projection, is made practically attainable. Thus, accurate and stable alignment is attainable regardless of the configuration of the mark provided on the second object.
摘要:
A mark detecting device usable in an alignment and exposure apparatus for aligning an alignment mark of a mask with an alignment mark of a wafer and for exposing a resist layer provided on the surface of the wafer to a pattern of the mask with radiation. The device including a portion for forming a photoprint of the alignment mark of the mask on the resist layer provided on the surface of the wafer, a portion for removing at least a portion of the resist layer adjacent to the alignment mark of the wafer, and a portion for detecting the alignment mark of the wafer and the photoprint of the alignment mark of the mask.
摘要:
A projection exposure apparatus for projecting a pattern of a reticle upon a wafer by use of a projection lens system, is disclosed. The apparatus is arranged so that a mark illuminating light is projected upon the wafer from between the projection lens system and the wafer and not by way of the projection lens system. The light diffracted by an edge of a wafer alignment mark is photoelectrically detected by way of the projection lens system, whereby an electrical signal corresponding to an image of the alignment mark is obtained. On the basis of the detected signal, the wafer is aligned with the reticle. This arrangement allows detection of the alignment mark without being affected by a photoresist applied to the wafer surface. Thus, the reticle-to-wafer alignment can be made accurately. Also, a novel and unique alignment method is disclosed. The disclosed method assures high-accuracy reticle-to-wafer alignment.
摘要:
An exposure method and apparatus for aligning a pattern of a mask with a pattern of a wafer is disclosed. and for transferring the pattern of the mask onto a resist layer formed on the surface of the wafer, wherein a portion of the resist layer on the wafer in the vicinity of an alignment mark formed on the wafer is exposed to light passed through a portion of the mask including an alignment mark formed on the mask, thereby to form a latent image of the alignment mark of the mask on the resist layer of the wafer, the latent image of the alignment mark of the mask formed on the resist layer of the wafer. The alignment mark formed on the wafer is detected so as to detect any positional deviation between the latent image and the alignment mark formed on the wafer. At least one of the mask and the wafer is displaced on the basis of the result of detection, and finally the resist layer of the wafer is exposed to light passed through a portion of the mask including the pattern.
摘要:
An exposure apparatus includes a reticle provided with at least one mark, and operates on a wafer provided with at least one mark. The apparatus further includes a projection optical system for optically conjugately relating the reticle to the wafer, a mark detecting apparatus for detecting the mark of the reticle and detecting the mark of the wafer through the projection optical system, an illuminator for illuminating the wafer with a sensitizing light, and a phase converting element fixed between the wafer and the reticle for varying the direction of polarization of a light coming from the mark provided on the wafer.
摘要:
An alignment apparatus including a first off-axis alignment optical system having a magnification, and a second off-axis alignment optical system having a magnification higher than that of the first off-axis alignment optical system, wherein the apparatus is operable in a global alignment mode using the second off-axis alignment optical system. In another aspect, there is provided an alignment apparatus which includes a first off-axis alignment optical system having a magnification, a second off-axis alignment optical system having a magnification higher than that of the first off-axis alignment optical system, and a TTL alignment optical system, wherein the alignment apparatus is operable in a global alignment mode using the second off-axis alignment optical system and is operable in another global alignment mode using the TTL optical alignment system.
摘要:
An exposure apparatus usable in the manufacture of semiconductor devices, for transferring a pattern of a reticle onto each of discrete areas of a semiconductor wafer in a step-and-repeat manner. The apparatus has a laser interferometer for precisely measuring the amount of displacement of the wafer and a memory for storing positional errors of the shot areas, relative to respective target positions, established at the time of completion of the stepwise movements of the wafer. In accordance with the stored positional errors and with the result of measurement by the laser interferometer, the amount of stepwise movement of the wafer is corrected, whereby the accuracy of step-feed for the wafer is improved without decreasing the throughput. In another aspect, the exposure apparatus is provided with a TTL detection system for detecting the positional error of each of the shot areas relative to a target or reference shot area established at the time of completion of stepwise movement of the wafer. If a variation component of the positional error detected by way of the TTL detecting system is not less than a predetermined level, the positioning of the wafer is effected for each of the shot areas, by use of the TTL detecting system. If the variation component is less than the predetermined level, the positioning of the wafer or each shot area is effected on the basis of the measurement by the laser interferometer.
摘要:
A device for supplying masks to be used in a chamber having a wall, comprises an opening formed in the wall of the chamber, and a rotatable shelf disposed in the opening and for carrying thereon the masks. The rotatable shelf is coupled, by way of a rotational shaft, to a portion of the wall adjacent to the opening and the rotational shelf has a mask carrying portion which is rotationally movable, about the rotational shaft, through the opening to and from the inside of the chamber and from and to the outside of the chamber.
摘要:
In a mask aligner, the actual element pattern of a mask is transferred onto a resist applied to the surface of a wafer, while the alignment pattern of the mask is not transferred onto said resist. That is, the line width of the alignment pattern of the mask is a line width which is not transferred to the wafer. If the pattern of the mask is formed so that the line width of the alignment pattern is thin as compared with that of the actual element pattern, the exposure amount in the alignment pattern portion on the resist applied to the surface of the wafer becomes excessive due to the diffraction phenomenon and thus, the alignment pattern of the mask is not transferred onto the wafer.