公开(公告)号：US08190086B2

公开(公告)日：2012-05-29

申请号：US12065068

申请日：2006-08-04

申请人： Hideki Sasaki ,  Muneo Fukaishi ,  Toru Taura

发明人： Hideki Sasaki ,  Muneo Fukaishi ,  Toru Taura

IPC分类号： H04B5/00

CPC分类号： H04B5/02 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/00014

摘要： An interface circuit, which uses electromagnetic induction to perform a signal transmission, comprises a transmission coil and a transmission circuit that provides a signal to the transmission coil, thereby causing the transmission coil to output a triangular or roughly triangular magnetic field signal.

摘要翻译： 使用电磁感应来进行信号传输的接口电路包括发送线圈和向发送线圈提供信号的发送电路，从而使发送线圈输出三角形或大致三角形的磁场信号。

公开(公告)号：US20090233546A1

公开(公告)日：2009-09-17

申请号：US12065068

申请日：2006-08-04

申请人： Hideki Sasaki ,  Muneo Fukaishi ,  Toru Taura

发明人： Hideki Sasaki ,  Muneo Fukaishi ,  Toru Taura

IPC分类号： H04B5/00

CPC分类号： H04B5/02 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/00014

摘要： An interface circuit, which uses electromagnetic induction to perform a signal transmission, comprises a transmission coil and a transmission circuit that provides a signal to the transmission coil, thereby causing the transmission coil to output a triangular or roughly triangular magnetic field signal.

摘要翻译： 使用电磁感应来进行信号传输的接口电路包括发送线圈和向发送线圈提供信号的发送电路，从而使发送线圈输出三角形或大致三角形的磁场信号。

公开(公告)号：US20100097159A1

公开(公告)日：2010-04-22

申请号：US12529443

申请日：2008-02-29

申请人： Eiji Hankui ,  Toshihide Kuriyama ,  Hideki Sasaki ,  Muneo Fukaishi

发明人： Eiji Hankui ,  Toshihide Kuriyama ,  Hideki Sasaki ,  Muneo Fukaishi

IPC分类号： H01P1/10 ,  H01P1/04

CPC分类号： H01L27/0688 ,  H01L23/48 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2924/0002 ,  H01L2924/00

摘要： There are provided a semiconductor device and a semiconductor chip, in which the interconnection is made to be highly reliable by stacking three or more layers of chips without contact therebetween. A semiconductor chip of the present invention comprises a first signal transmission circuit, a silicon substrate on which a first changeover switch is formed, and an interconnection layer on which a first capacitive-coupling upper electrode is formed, wherein a first capacitive-coupling lower electrode is additionally formed on the rear surface of the silicon substrate through a first via hole that penetrates the silicon substrate and, whereas the first capacitive-coupling upper electrode is directly connected to the first signal transmission circuit, the first capacitive-coupling lower electrode is connected to the first signal transmission circuit through the first via hole and through the first changeover switch.

摘要翻译： 提供了一种半导体器件和半导体芯片，其中通过堆叠三层或更多层芯片而使互连成为高可靠性，其间没有接触。 本发明的半导体芯片包括第一信号传输电路，其上形成有第一转换开关的硅衬底和形成有第一电容耦合上电极的互连层，其中第一电容耦合下电极 通过穿过硅衬底的第一通孔另外形成在硅衬底的后表面上，而第一电容耦合上电极直接连接到第一信号传输电路，第一电容耦合下电极连接 通过第一通孔和第一转换开关连接到第一信号传输电路。

公开(公告)号：US07990747B2

公开(公告)日：2011-08-02

申请号：US12529443

申请日：2008-02-29

申请人： Eiji Hankui ,  Toshihide Kuriyama ,  Hideki Sasaki ,  Muneo Fukaishi

发明人： Eiji Hankui ,  Toshihide Kuriyama ,  Hideki Sasaki ,  Muneo Fukaishi

IPC分类号： G11C5/06

CPC分类号： H01L27/0688 ,  H01L23/48 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2924/0002 ,  H01L2924/00

摘要： There are provided a semiconductor device and a semiconductor chip, in which the interconnection is made to be highly reliable by stacking three or more layers of chips without contact therebetween. A semiconductor chip of the present invention comprises a first signal transmission circuit, a silicon substrate on which a first changeover switch is formed, and an interconnection layer on which a first capacitive-coupling upper electrode is formed, wherein a first capacitive-coupling lower electrode is additionally formed on the rear surface of the silicon substrate through a first via hole that penetrates the silicon substrate and, whereas the first capacitive-coupling upper electrode is directly connected to the first signal transmission circuit, the first capacitive-coupling lower electrode is connected to the first signal transmission circuit through the first via hole and through the first changeover switch.

摘要翻译： 提供了一种半导体器件和半导体芯片，其中通过堆叠三层或更多层芯片而使互连成为高可靠性，其间没有接触。 本发明的半导体芯片包括第一信号传输电路，其上形成有第一转换开关的硅衬底和形成有第一电容耦合上电极的互连层，其中第一电容耦合下电极 通过穿过硅衬底的第一通孔另外形成在硅衬底的后表面上，而第一电容耦合上电极直接连接到第一信号传输电路，第一电容耦合下电极连接 通过第一通孔和第一转换开关连接到第一信号传输电路。

公开(公告)号：US08306872B2

公开(公告)日：2012-11-06

申请号：US12461328

申请日：2009-08-07

申请人： Hideya Inoue ,  Yutaka Iwasaki ,  Hideki Sasaki

发明人： Hideya Inoue ,  Yutaka Iwasaki ,  Hideki Sasaki

IPC分类号： G06Q30/00

CPC分类号： G06F17/30256 ,  G06F17/30247 ,  G06Q30/0282 ,  G06Q30/06 ,  G06Q30/0601

摘要： In a database, product image data is accumulated. A search portion acquires product image data having the image characteristics information that is the same as or similar to the image characteristics information that indicates the characteristics of the image of input image data from the database for the input image data. A search server outputs information on another product that is different from the product corresponding to the product image data together with the product image data acquired by the search portion.

摘要翻译： 在数据库中，积累产品图像数据。 搜索部分从用于输入图像数据的数据库获取具有与指示输入图像数据的图像的特性的图像特征信息相同或类似的图像特征信息的产品图像数据。 搜索服务器输出与产品图像数据对应的产品不同于与由搜索部分获取的产品图像数据不同的产品的信息。

公开(公告)号：US08138645B2

公开(公告)日：2012-03-20

申请号：US12731375

申请日：2010-03-25

申请人： Hidefumi Abe ,  Hideki Sasaki ,  Toshiro Mayumi ,  Eishin Matsumoto

发明人： Hidefumi Abe ,  Hideki Sasaki ,  Toshiro Mayumi ,  Eishin Matsumoto

IPC分类号： H02K11/00

CPC分类号： H02K7/003 ,  H02K5/15 ,  H02K5/1732 ,  H02K5/225 ,  H02K7/116 ,  H02K7/14 ,  H02K11/33

摘要： A rotary actuator including: a housing that rotatably supports thereinside a rotor shaft of an electric motor; an eccentric shaft portion that is provided on a protruding end portion of the rotor shaft that protrudes outside the housing; an external gear that is rotatably supported on the eccentric shaft portion via a bearing; an internal gear that is fixed to an outer surface of the housing and meshes with the external gear; and a transmitting portion that is provided on the external gear, and transmits rotation force to an external output shaft.

摘要翻译： 一种旋转致动器，包括：壳体，其可旋转地支撑在电动机的转子轴的外侧; 偏心轴部，其设置在所述转子轴的突出端部突出到所述壳体外部; 通过轴承可旋转地支撑在偏心轴部上的外齿轮; 固定在壳体的外表面并与外齿轮啮合的内齿轮; 以及设置在所述外齿轮上并将旋转力传递到外部输出轴的传递部。

公开(公告)号：US20100290202A1

公开(公告)日：2010-11-18

申请号：US12662811

申请日：2010-05-04

申请人： Hideki Sasaki ,  Kenji Nishikawa ,  Muneharu Morioka

发明人： Hideki Sasaki ,  Kenji Nishikawa ,  Muneharu Morioka

IPC分类号： H05K7/06 ,  H01L23/495 ,  H01L23/28

CPC分类号： H01L23/49503 ,  H01L21/4821 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package comprises a conduction member, a semiconductor chip mounted on and electrically connected to the conduction member, and a sealing body configured to seal the conduction member and the semiconductor chip. The conduction member comprises a power supply section configured to supply a power voltage to said semiconductor chip, a ground section configured to supply a ground voltage to the semiconductor chip, and a signal section connected to a signal terminal of the semiconductor chip. The power supply section, the ground section, and the signal section are arranged so as not to overlap each other. At least a part of said ground section is exposed on an under surface of the sealing body. The power supply section comprises an exposed region of which bottom surface is exposed on the under surface, and a plurality of power hanging-pin region configured to extend to a side of the sealing body from the exposed region.

摘要翻译： 半导体封装包括导电构件，安装在导电构件上并电连接到导电构件的半导体芯片，以及密封体，其构造成密封导电构件和半导体芯片。 导通构件包括被配置为向所述半导体芯片提供电源电压的电源部分，被配置为向半导体芯片提供接地电压的接地部分和连接到半导体芯片的信号端子的信号部分。 电源部分，接地部分和信号部分被布置成不彼此重叠。 所述接地部分的至少一部分暴露在密封体的下表面上。 电源部分包括底表面暴露在下表面上的暴露区域，以及被配置为从暴露区域延伸到密封体一侧的多个电源吊销区域。

公开(公告)号：US07430125B2

公开(公告)日：2008-09-30

申请号：US11778108

申请日：2007-07-16

申请人： Hideki Sasaki ,  Toshihide Kuriyama

发明人： Hideki Sasaki ,  Toshihide Kuriyama

IPC分类号： H05K1/00

CPC分类号： H05K1/141 ,  G06F1/182 ,  H05K1/023 ,  H05K3/368 ,  H05K2201/10022 ,  H05K2201/10189 ,  H05K2201/10689

摘要： A second ground plane (18); has one end opposite to a connector (14), which end is connected to a first ground plane (17) by resistor connection element (41). Accordingly, it is possible to lower Q of resonance of the ground structure by the resistor connection element (41) and to prevent generation of an intense electromagnetic field attributed to an electromagnetic field of a data processing circuit. Especially when the resistor connection element (41) has a resistance value identical to a characteristic impedance of the ground structure, the ground structure is terminated in a matched way and it is possible to assure prevention of generation of an electromagnetic field attributed to resonance.

摘要翻译： 第二接地平面（18）; 具有与连接器（14）相对的一端，该端部通过电阻器连接元件（41）连接到第一接地平面（17）。 因此，可以通过电阻器连接元件（41）降低接地结构的谐振Q，并且防止由数据处理电路的电磁场引起的强电磁场的产生。 特别是当电阻器连接元件（41）具有与接地结构的特性阻抗相同的电阻值时，以匹配的方式终止接地结构，并且可以确保防止由谐振引起的电磁场的产生。

公开(公告)号：US07172284B1

公开(公告)日：2007-02-06

申请号：US10558566

申请日：2004-04-28

申请人： Hideki Sasaki

发明人： Hideki Sasaki

IPC分类号： G02C3/00

CPC分类号： G02C3/02 ,  A42B1/247 ,  G02C7/12 ,  G02C9/02 ,  G02C9/04

摘要： Clip sunglass lenses where a flip-up retention angle of a glass lens (4) is adjustable in a stepped manner and is reliably positioned at optimum positions. Clip sunglass lenses have a clip (1), an insertion member (2), a level-adjusting member (3), and a level-adjusting member (5). The clip (1) has a holding mouth (11) and a socket mouth (12) inside which notches are formed at required intervals in the insertion/removal direction. The insertion member (2) has a plug portion formed at one end and fork-shaped clasping brackets (22). The level-adjusting member (3) has connection shafts (31) with stepped notches formed at required intervals in their surfaces and has a plate surface in which cutout grooves (32) are formed. The level-adjusting buckle (5) is fixed at the central portion of the sideway-long polarized glass lens (4) and has latch projections latched to a cutout groove (32).

摘要翻译： 夹式太阳镜透镜，其中玻璃透镜（4）的翻转保持角度可以阶梯式调节并可靠地定位在最佳位置。 夹子太阳镜透镜具有夹子（1），插入构件（2），水平调节构件（3）和水平调节构件（5）。 夹具（1）具有保持口（11）和插座口（12），插入口（12）在插入/取出方向上以所需的间隔形成有凹口。 插入构件（2）具有在一端形成的插塞部分和叉形夹紧支架（22）。 水平调节构件（3）具有在其表面上以所需间隔形成有阶梯形凹口的连接轴（31），并且具有形成有切口凹槽（32）的板表面。 水平调节带扣（5）固定在侧面偏光玻璃透镜（4）的中央部分，并具有锁定在切口凹槽（32）上的闩锁突起。

公开(公告)号：US20060070604A1

公开(公告)日：2006-04-06

申请号：US11240328

申请日：2005-09-30

申请人： Hideki Sasaki

发明人： Hideki Sasaki

IPC分类号： F02D9/08

CPC分类号： F02D9/1065 ,  F16H1/32 ,  Y10T74/19642

摘要： When a rotational shaft of a gear speed reducer is rotated, a small-diameter gear of a first gear is held in mesh with first internal teeth of a fixed gear and a large-diameter gear of the first gear is held in mesh with second internal teeth of a second gear. The first gear and the second gear comprise cycloidal gears, respectively, and transmit rotational drive power to the second gear. The rotational drive power is output from an output shaft of the second gear. The gear speed reducer has a default mechanism for holding the output shaft at a predetermined angular position when an electric signal applied to an actuator is interrupted, and a self-lock function for preventing drive power applied from the output shaft from being transmitted to the actuator.

摘要翻译： 当齿轮减速器的旋转轴旋转时，第一齿轮的小直径齿轮与固定齿轮的第一内齿保持啮合，并且第一齿轮的大直径齿轮与第二内部 二档齿。 第一齿轮和第二齿轮分别包括摆线齿轮，并将旋转驱动力传递到第二齿轮。 旋转驱动力从第二档的输出轴输出。 齿轮减速器具有用于当施加到致动器的电信号被中断时将输出轴保持在预定角度位置的默认机构，并且用于防止从输出轴施加的驱动力被传递到致动器的自锁功能 。