公开(公告)号：US08291582B2

公开(公告)日：2012-10-23

申请号：US12161907

申请日：2007-01-31

申请人： Hidenobu Nishikawa ,  Daido Komyoji

发明人： Hidenobu Nishikawa ,  Daido Komyoji

IPC分类号： H01L21/44

CPC分类号： H05K3/321 ,  G06K19/07749 ,  H01L21/6835 ,  H01L23/49855 ,  H01L24/11 ,  H01L24/12 ,  H01L24/28 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/1182 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29036 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/10984 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

摘要： The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component.

摘要翻译： 本发明包括：将仅包含导电颗粒的各向异性导电树脂施加到电子部件的多个凸块; 通过各向异性导电树脂将电子部件放置在柔性布线板的主表面上方; 并将所述电子部件加压到所述布线基板，并固化施加到所述多个凸块的各向异性导电树脂，以将所述多个凸块接合到所述布线板的电极。 这可以防止电子部件的安装不良。

公开(公告)号：US20090166064A1

公开(公告)日：2009-07-02

申请号：US12161907

申请日：2007-01-31

申请人： Hidenobu Nishikawa ,  Daido Komyoji

发明人： Hidenobu Nishikawa ,  Daido Komyoji

IPC分类号： H05K1/00 ,  B32B37/00

CPC分类号： H05K3/321 ,  G06K19/07749 ,  H01L21/6835 ,  H01L23/49855 ,  H01L24/11 ,  H01L24/12 ,  H01L24/28 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/1182 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29036 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/10984 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

摘要： The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component.

摘要翻译： 本发明包括：将仅包含导电颗粒的各向异性导电树脂施加到电子部件的多个凸块; 通过各向异性导电树脂将电子部件放置在柔性布线板的主表面上方; 并将所述电子部件加压到所述布线基板，并固化施加到所述多个凸块的各向异性导电树脂，以将所述多个凸块接合到所述布线板的电极。 这可以防止电子部件的安装不良。

公开(公告)号：US08866021B2

公开(公告)日：2014-10-21

申请号：US13614630

申请日：2012-09-13

申请人： Hidenobu Nishikawa ,  Daido Komyoji

发明人： Hidenobu Nishikawa ,  Daido Komyoji

IPC分类号： H05K1/00

CPC分类号： H05K3/321 ,  G06K19/07749 ,  H01L21/6835 ,  H01L23/49855 ,  H01L24/11 ,  H01L24/12 ,  H01L24/28 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/1182 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29036 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/10984 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

摘要： The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component.

摘要翻译： 本发明包括：将仅包含导电颗粒的各向异性导电树脂施加到电子部件的多个凸块; 通过各向异性导电树脂将电子部件放置在柔性布线板的主表面上方; 并将所述电子部件加压到所述布线基板，并固化施加到所述多个凸块的各向异性导电树脂，以将所述多个凸块接合到所述布线板的电极。 这可以防止电子部件的安装不良。

公开(公告)号：US08599571B2

公开(公告)日：2013-12-03

申请号：US12279915

申请日：2007-04-18

申请人： Hidenobu Nishikawa ,  Daido Komyoji ,  Atsunobu Iwamoto ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Shigeru Kondou

发明人： Hidenobu Nishikawa ,  Daido Komyoji ,  Atsunobu Iwamoto ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Shigeru Kondou

IPC分类号： H01L23/12 ,  H01L23/02 ,  H01L23/34 ,  H05K7/00 ,  H05K7/20 ,  H05K1/11

CPC分类号： H05K1/0271 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/19105 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00

摘要： Memory card (1) includes at least semiconductor chip (3), circuit board (2) with semiconductor chip (3) mounted on main surface (21), having at least rigidity reducing portion (23) formed in main surface (21) or in a linear region of surface (22) opposite to the main surface, and cover portion (71) for covering semiconductor chip (3) on main surface (21) of circuit board (2), wherein circuit board (2) has a plurality of convex regions (201) which flex in a convex shape toward main surface (21) due to rigidity reducing portion (23).

摘要翻译： 存储卡（1）至少包括半导体芯片（3），具有安装在主表面（21）上的半导体芯片（3）的电路板（2），至少具有形成在主表面（21）中的刚性减小部分（23）或 在与所述主表面相对的表面（22）的直线区域中，以及用于覆盖电路板（2）的主表面（21）上的半导体芯片（3）的盖部分（71），其中电路板（2）具有多个 由刚性减小部分（23）向主表面（21）弯曲成凸形的凸区域（201）。

公开(公告)号：US20130010436A1

公开(公告)日：2013-01-10

申请号：US13614630

申请日：2012-09-13

申请人： Hidenobu NISHIKAWA ,  Daido Komyoji

发明人： Hidenobu NISHIKAWA ,  Daido Komyoji

IPC分类号： H05K7/06

CPC分类号： H05K3/321 ,  G06K19/07749 ,  H01L21/6835 ,  H01L23/49855 ,  H01L24/11 ,  H01L24/12 ,  H01L24/28 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/1182 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29036 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/10984 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

摘要： The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component.

公开(公告)号：US08125786B2

公开(公告)日：2012-02-28

申请号：US12160301

申请日：2007-01-26

申请人： Hidenobu Nishikawa ,  Daido Komyoji ,  Hiroyuki Yamada ,  Yutaka Nakamura ,  Shuichi Takeda ,  Yasuharu Kikuchi

发明人： Hidenobu Nishikawa ,  Daido Komyoji ,  Hiroyuki Yamada ,  Yutaka Nakamura ,  Shuichi Takeda ,  Yasuharu Kikuchi

IPC分类号： H05K1/14

CPC分类号： G06K19/077 ,  G06K19/07732 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/19105 ,  H05K1/0275 ,  H05K3/284 ,  H05K2201/10151 ,  H05K2201/10159 ,  H01L2924/00

摘要： Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board.

摘要翻译： 存储卡包括电路板，安装在电路板的主面上的部件，至少覆盖电路板的主面和部件的壳体，以及保持在设置在壳体上的粗糙区域中的苦味剂或暴露部分 电路板。

公开(公告)号：US20100084762A1

公开(公告)日：2010-04-08

申请号：US12279915

申请日：2007-04-18

申请人： Hidenobu Nishikawa ,  Daido Komyoji ,  Atsunobu Iwamoto ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Shigeru Kondou

发明人： Hidenobu Nishikawa ,  Daido Komyoji ,  Atsunobu Iwamoto ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Shigeru Kondou

IPC分类号： H01L23/52 ,  G06K19/077

CPC分类号： H05K1/0271 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/19105 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00

摘要： Memory card (1) includes at least semiconductor chip (3), circuit board (2) with semiconductor chip (3) mounted on main surface (21), having at least rigidity reducing portion (23) formed in main surface (21) or in a linear region of surface (22) opposite to the main surface, and cover portion (71) for covering semiconductor chip (3) on main surface (21) of circuit board (2), wherein circuit board (2) has a plurality of convex regions (201) which flex in a convex shape toward main surface (21) due to rigidity reducing portion (23).

摘要翻译： 存储卡（1）至少包括半导体芯片（3），具有安装在主表面（21）上的半导体芯片（3）的电路板（2），至少具有形成在主表面（21）中的刚性减小部分（23）或 在与所述主表面相对的表面（22）的直线区域中，以及用于覆盖电路板（2）的主表面（21）上的半导体芯片（3）的盖部分（71），其中电路板（2）具有多个 由刚性减小部分（23）向主表面（21）弯曲成凸形的凸区域（201）。

公开(公告)号：US20090009976A1

公开(公告)日：2009-01-08

申请号：US12160301

申请日：2007-01-26

申请人： Hidenobu Nishikawa ,  Daido Komyoji ,  Hiroyuki Yamada ,  Yutaka Nakamura ,  Shuichi Takeda ,  Yasuharu Kikuchi

发明人： Hidenobu Nishikawa ,  Daido Komyoji ,  Hiroyuki Yamada ,  Yutaka Nakamura ,  Shuichi Takeda ,  Yasuharu Kikuchi

IPC分类号： H05K1/14

CPC分类号： G06K19/077 ,  G06K19/07732 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/19105 ,  H05K1/0275 ,  H05K3/284 ,  H05K2201/10151 ,  H05K2201/10159 ,  H01L2924/00

摘要： Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board.

摘要翻译： 存储卡包括电路板，安装在电路板的主面上的部件，至少覆盖电路板的主面和部件的壳体，以及保持在设置在壳体上的粗糙区域中的苦味剂或暴露部分 电路板。

公开(公告)号：US20090321122A1

公开(公告)日：2009-12-31

申请号：US12295119

申请日：2007-03-23

申请人： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

发明人： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

IPC分类号： H05K1/14 ,  H05K3/10

CPC分类号： H05K1/144 ,  H01R12/7076 ,  H01R12/7082 ,  H01R13/6586 ,  H01R13/6594 ,  H05K1/0218 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49165

摘要： Relay substrate (1) connecting between at least a first circuit board and a second circuit board, including housing (10) having recess (10a) provided in the outer circumference and hole (22) provided in the inner circumference; plural connecting terminal electrodes (12a, 12c) connecting between the top and bottom surfaces of housing (10); shield electrode (11) provided in recess (10a); and ground electrode (13) provided on a part of the top and bottom surfaces of housing (10).

摘要翻译： 连接在至少第一电路板和第二电路板之间的继电器基板（1），包括设置在外周的具有凹部（10a）的壳体（10）和设置在内周的孔（22） 连接在壳体（10）的顶表面和底表面之间的多个连接端子电极（12a，12c） 设置在凹部（10a）中的屏蔽电极（11） 和设置在壳体（10）的顶表面和底表面的一部分上的接地电极（13）。

公开(公告)号：US07357288B2

公开(公告)日：2008-04-15

申请号：US10891524

申请日：2004-07-15

申请人： Naoto Hosotani ,  Kazuki Fukada ,  Keiichi Iwata ,  Daido Komyoji

发明人： Naoto Hosotani ,  Kazuki Fukada ,  Keiichi Iwata ,  Daido Komyoji

IPC分类号： B23K1/00

CPC分类号： B23K3/087 ,  B23K2101/40 ,  H01L24/75 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12042 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/1121 ,  H05K2203/1581 ,  H05K2203/304 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53261 ,  H01L2924/00014 ,  H01L2924/00

摘要： When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection portion, is connected to the board with interposition of connection material between the electrode of the board and the connection portion, a cooling member is brought into contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and a quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, thereby performing fusing of the connection material while preventing occurrence of thermal damage to the weak heat-resistant portion.

摘要翻译： 当具有要连接到板的电极的连接部分和具有比用于将板的电极与连接件连接的连接材料的熔点低的耐热性能的弱耐热部分的部件 通过在板的电极和连接部之间插入连接材料而连接到板，冷却部件与弱耐热部或其附近接触，同时通过加热连接材料来加热板 与放置构件接触，并且通过被传导到冷却构件而减少通过板传导到弱耐热部分的热量，从而进行连接材料的熔合，同时防止对弱热的热损伤的发生 抵抗部分。