公开(公告)号：US20090321122A1

公开(公告)日：2009-12-31

申请号：US12295119

申请日：2007-03-23

申请人： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

发明人： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

IPC分类号： H05K1/14 ,  H05K3/10

CPC分类号： H05K1/144 ,  H01R12/7076 ,  H01R12/7082 ,  H01R13/6586 ,  H01R13/6594 ,  H05K1/0218 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49165

摘要： Relay substrate (1) connecting between at least a first circuit board and a second circuit board, including housing (10) having recess (10a) provided in the outer circumference and hole (22) provided in the inner circumference; plural connecting terminal electrodes (12a, 12c) connecting between the top and bottom surfaces of housing (10); shield electrode (11) provided in recess (10a); and ground electrode (13) provided on a part of the top and bottom surfaces of housing (10).

摘要翻译： 连接在至少第一电路板和第二电路板之间的继电器基板（1），包括设置在外周的具有凹部（10a）的壳体（10）和设置在内周的孔（22） 连接在壳体（10）的顶表面和底表面之间的多个连接端子电极（12a，12c） 设置在凹部（10a）中的屏蔽电极（11） 和设置在壳体（10）的顶表面和底表面的一部分上的接地电极（13）。

公开(公告)号：US08208270B2

公开(公告)日：2012-06-26

申请号：US12280434

申请日：2007-04-23

申请人： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

发明人： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

IPC分类号： H05K1/11

CPC分类号： H05K1/144 ,  B23K1/0016 ,  B23K2101/42 ,  H05K3/368 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2203/1572

摘要： Three-dimensional structure (40) of the present invention includes first module board (28), second module board (37), and substrate joining member (10) that unifies board (28) and board (37) into one body, thereby electrically connecting these two elements together. The unification is done by molding the outer wall of housing (12) of substrate joining member (10) with resin (29). Substrate joining member (10) used in the three-dimensional structure (40) includes multiple lead terminals (14) made of conductive material, and a frame-shaped and insulating housing (12) to which frame the lead terminals (14) are fixed vertically in a predetermined array. Housing (12) includes projections (18) on at least two outer wall faces of its frame shape.

摘要翻译： 本发明的三维结构（40）包括将板（28）和板（37）一体化成一体的第一模块板（28），第二模块板（37）和基板接合构件（10），由此电 将这两个元素连接在一起。 通过用树脂（29）将衬底接合构件（10）的壳体（12）的外壁模制成一体。 在三维结构（40）中使用的基板接合构件（10）包括由导电材料制成的多个引线端子（14）和框架形绝缘壳体（12），引线端子（14）固定到框架形绝缘壳体 垂直于预定的阵列。 壳体（12）在其框架形状的至少两个外壁面上包括突起（18）。

公开(公告)号：US08159829B2

公开(公告)日：2012-04-17

申请号：US12295119

申请日：2007-03-23

申请人： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

发明人： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

IPC分类号： H05K3/00

CPC分类号： H05K1/144 ,  H01R12/7076 ,  H01R12/7082 ,  H01R13/6586 ,  H01R13/6594 ,  H05K1/0218 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49165

摘要： Relay substrate (1) connecting between at least a first circuit board and a second circuit board, including housing (10) having recess (10a) provided in the outer circumference and hole (22) provided in the inner circumference; plural connecting terminal electrodes (12a, 12c) connecting between the top and bottom surfaces of housing (10); shield electrode (11) provided in recess (10a); and ground electrode (13) provided on a part of the top and bottom surfaces of housing (10).

摘要翻译： 连接在至少第一电路板和第二电路板之间的继电器基板（1），包括设置在外周的具有凹部（10a）的壳体（10）和设置在内周的孔（22） 连接在壳体（10）的顶表面和底表面之间的多个连接端子电极（12a，12c） 设置在凹部（10a）中的屏蔽电极（11） 和设置在壳体（10）的顶表面和底表面的一部分上的接地电极（13）。

公开(公告)号：US20090009979A1

公开(公告)日：2009-01-08

申请号：US12280434

申请日：2007-04-23

申请人： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

发明人： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

IPC分类号： H05K1/14 ,  H01R12/00

CPC分类号： H05K1/144 ,  B23K1/0016 ,  B23K2101/42 ,  H05K3/368 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2203/1572

摘要： Three-dimensional structure (40) of the present invention includes first module board (28), second module board (37), and substrate joining member (10) that unifies board (28) and board (37) into one body, thereby electrically connecting these two elements together. The unification is done by molding the outer wall of housing (12) of substrate joining member (10) with resin (29). Substrate joining member (10) used in the three-dimensional structure (40) includes multiple lead terminals (14) made of conductive material, and a frame-shaped and insulating housing (12) to which frame the lead terminals (14) are fixed vertically in a predetermined array. Housing (12) includes projections (18) on at least two outer wall faces of its frame shape.

摘要翻译： 本发明的三维结构（40）包括将板（28）和板（37）一体化成一体的第一模块板（28），第二模块板（37）和基板接合构件（10），由此电 将这两个元素连接在一起。 通过用树脂（29）将衬底接合构件（10）的壳体（12）的外壁模制成一体。 在三维结构（40）中使用的基板接合构件（10）包括由导电材料制成的多个引线端子（14）和框架形绝缘壳体（12），引线端子（14）固定到框架形绝缘壳体 垂直于预定阵列。 壳体（12）在其框架形状的至少两个外壁面上包括突起（18）。

公开(公告)号：US07845954B2

公开(公告)日：2010-12-07

申请号：US11995339

申请日：2006-04-17

申请人： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

发明人： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

IPC分类号： H01R12/00

CPC分类号： H01R12/00 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1627 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/145 ,  H05K3/28 ,  H05K3/284 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09018 ,  H05K2201/09845 ,  H05K2201/09909 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49117 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.

摘要翻译： 安装有电子部件（16）和第二电路板（2）的第一电路板（1）通过互连板（3）垂直连接，其中焊盘电极（5）的端子部分（6） 在互连板（3）上的埋设在互连板（3）的端接材料（9）中。 因此，可以抑制或缓冲由于高密度安装，热冲击或落下冲击而在上下电路板和焊盘电极之间作用的剥离应力或剪切应力的剥离或破裂的机会，从而导致高可靠性。

公开(公告)号：US20090215287A1

公开(公告)日：2009-08-27

申请号：US11918121

申请日：2006-07-06

申请人： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

发明人： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

IPC分类号： H01R12/14

CPC分类号： H05K3/368 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2201/2018

摘要： A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

摘要翻译： 衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。 基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。

公开(公告)号：US20080139013A1

公开(公告)日：2008-06-12

申请号：US11995339

申请日：2006-04-17

申请人： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

发明人： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

IPC分类号： H01R12/00 ,  H01R43/00

CPC分类号： H01R12/00 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1627 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/145 ,  H05K3/28 ,  H05K3/284 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09018 ,  H05K2201/09845 ,  H05K2201/09909 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49117 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.

摘要翻译： 安装有电子部件（16）和第二电路板（2）的第一电路板（1）通过互连板（3）垂直连接，其中焊盘电极（5）的端子部分（6） 在互连板（3）上的埋设在互连板（3）的端接材料（9）中。 因此，可以抑制或缓冲由于高密度安装，热冲击或落下冲击而在上下电路板和焊盘电极之间作用的剥离应力或剪切应力的剥离或破裂的机会，从而导致高可靠性。

公开(公告)号：US20090268423A1

公开(公告)日：2009-10-29

申请号：US12302429

申请日：2007-06-19

申请人： Daisuke Sakurai ,  Masato Mori ,  Yoshihiko Yagi

发明人： Daisuke Sakurai ,  Masato Mori ,  Yoshihiko Yagi

IPC分类号： H05K1/11

CPC分类号： H05K1/141 ,  H01L23/13 ,  H01L23/5385 ,  H01L23/552 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K1/144 ,  H05K1/181 ,  H05K3/305 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/042 ,  H05K2201/09145 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/2018 ,  H05K2203/1572

摘要： Interconnect substrate (1) that connects at least the first circuit board and the second circuit board. Interconnect substrate (1) includes housing (1) and connecting terminal electrodes for connecting the top and bottom faces of housing (10). Housing (10) has protrusion (11) on its outer periphery and opening (13) in its inner periphery.

摘要翻译： 至少连接第一电路板和第二电路板的互连基板（1）。 互连基板（1）包括用于连接壳体（10）的顶面和底面的壳体（1）和连接端子电极。 壳体10在其外周上具有突起（11），在其内周具有开口（13）。

公开(公告)号：US07762819B2

公开(公告)日：2010-07-27

申请号：US11918121

申请日：2006-07-06

申请人： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

发明人： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

IPC分类号： H01R12/00

CPC分类号： H05K3/368 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2201/2018

摘要： A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

摘要翻译： 衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。 基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。

公开(公告)号：US08018731B2

公开(公告)日：2011-09-13

申请号：US12302429

申请日：2007-06-19

申请人： Daisuke Sakurai ,  Masato Mori ,  Yoshihiko Yagi

发明人： Daisuke Sakurai ,  Masato Mori ,  Yoshihiko Yagi

IPC分类号： H05K7/10 ,  H05K7/12

CPC分类号： H05K1/141 ,  H01L23/13 ,  H01L23/5385 ,  H01L23/552 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K1/144 ,  H05K1/181 ,  H05K3/305 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/042 ,  H05K2201/09145 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/2018 ,  H05K2203/1572

摘要： Interconnect substrate (1) that connects at least the first circuit board and the second circuit board. Interconnect substrate (1) includes housing (1) and connecting terminal electrodes for connecting the top and bottom faces of housing (10). Housing (10) has protrusion (11) on its outer periphery and opening (13) in its inner periphery.

摘要翻译： 至少连接第一电路板和第二电路板的互连基板（1）。 互连基板（1）包括用于连接壳体（10）的顶面和底面的壳体（1）和连接端子电极。 壳体10在其外周上具有突起（11），在其内周具有开口（13）。