摘要:
A method for manufacturing a ferroelectric capacitor includes steps of: (a) forming a first crystalline barrier layer; (b) forming a second crystalline barrier layer composed of nitride by nitriding the first crystalline barrier layer; (c) forming a first electrode above the second crystalline barrier layer; (d) forming a ferroelectric film on the first electrode; and (e) forming a second electrode on the ferroelectric film.
摘要:
A semiconductor device fabrication method includes the steps of forming a conductive plug in an insulating film so as to be connected to an element on a semiconductor substrate; forming a titanium aluminum nitride (TiAlN) oxygen barrier film over the conductive plug; forming a titanium (Ti) seed film over the oxygen barrier film; and forming a lower electrode film of a ferroelectric capacitor over the titanium seed film.
摘要:
A wet smelting plant for nickel oxide ore is provided in which, even when a serious trouble occurs in a processing facility, the preparation period of time of the processing facility required for discontinuing and restarting the operation can be minimized. The wet smelting plant for nickel oxide ore (20) comprises two or more series of the processing facilities, each processing facility including a step operating facility, a utility feed facility (8a), (8b), a hydrogen sulfide feed facility (10a), (10b), a flocculant feed facility (14a), (14b), and a neutralizer feed facility (12a), (12b) and is featured in that connecting installations are further provided for connecting between the utility feed facilities (8a) and (8b), between the hydrogen sulfide feed facilities (10a) and (10b), between the flocculant feed facilities (14a) and (14b), and between the neutralizer feed facilities (12a) and (12b) in order to make the delivery of utility supplies, hydrogen sulfide, flocculant, and neutralizer for mutual substitution.
摘要:
A chemical heat accumulator includes a receptacle, a first reaction vessel, and a second reaction vessel. The first reaction vessel is hermetically connected to the receptacle and supplied with water from the receptacle. The first reaction vessel contains a chemical compound that causes a hydration reaction with the water from the receptacle to generate water vapor by a heat of reaction, and causes a dehydration reaction by receiving heat. The second reaction vessel is hermetically connected to the first reaction vessel and supplied with the water vapor from the first reaction vessel. The second reaction vessel contains a chemical heat storage material that generates heat by causing a hydration reaction with the water vapor from the first reaction vessel and stores heat through a dehydration reaction caused by receiving heat. The chemical heat storage material is thermally in contact with an object to be heated.
摘要:
A control device 7 obtains a reformed carbon quantity C supplied to a reform reaction flow channel 21 from a supplied fuel quantity Qf and also obtains a reformed water quantity S supplied to the reform reaction flow channel 21 from a generated power quantity W. Further, it obtains a oxygen consumed quantity consumed through power generation in a fuel cell 3 from the generated power quantity W, a supplied oxygen quantity to be supplied to a cathode flow channel 33 from a supplied cathode gas quantity Qc, and a reformed oxygen quantity O to be supplied to the reform reaction flow channel 21 based on a difference between the supplied oxygen quantity and the consumed oxygen quantity. By correcting a reformed carbon quantity C (delivery of a fuel pump 51) in accordance with the reformed oxygen quantity O, each of O/C and S/C is kept in a target value range.
摘要:
A method for manufacturing a ferroelectric memory device includes: forming a conductive base layer above a substrate; and laminating above the base layer a first electrode, a ferroelectric layer and a second electrode, wherein, prior to the step of forming the base layer, the method includes forming an active element in the substrate, forming an interlayer dielectric film on the substrate, and forming a contact plug in the interlayer dielectric film, and wherein the step of forming the base layer includes: forming a first conductive layer composed of a conductive material having a self-orienting property on the interlayer dielectric film including the contact plug; planarizing the first conductive layer by a chemical mechanical polishing method thereby forming a planarized first conductive layer that covers the interlayer dielectric film including the contact plug; applying an ammonia plasma process to a surface of the planarized first conductive layer; forming a titanium layer on the planarized first conductive layer treated with the ammonia plasma process; and heat-treating the titanium layer in a nitrogen atmosphere thereby changing the titanium layer to a titanium nitride layer which forms a second conductive layer.
摘要:
In a hydrogen generation device according to the invention, PSR reformers have a heat capacity smaller than that of the other PSR reformers. Therefore, the temperature of the catalyst reaches to a reforming-start temperature more quickly in the PSR reformers than in the other PSR reformers. When the hydrogen generation device is started and the reforming reaction is carried out, the mixture of gasoline vapor and water vapor is selectively and preferentially supplied to the PSR reformers so that the reforming reaction is carried out in the PSR reformers.
摘要:
A method for manufacturing a ferroelectric memory device includes: forming a conductive base layer above a substrate; and laminating above the base layer a first electrode, a ferroelectric layer and a second electrode, wherein, prior to the step of forming the base layer, the method includes forming an active element in the substrate, forming an interlayer dielectric film on the substrate, and forming a contact plug in the interlayer dielectric film, and wherein the step of forming the base layer includes: forming a first conductive layer composed of a conductive material having a self-orienting property on the interlayer dielectric film including the contact plug; planarizing the first conductive layer by a chemical mechanical polishing method thereby forming a planarized first conductive layer that covers the interlayer dielectric film including the contact plug; applying an ammonia plasma process to a surface of the planarized first conductive layer; forming a titanium layer on the planarized first conductive layer treated with the ammonia plasma process; and heat-treating the titanium layer in a nitrogen atmosphere thereby changing the titanium layer to a titanium nitride layer which forms a second conductive layer.
摘要:
The present invention provides a hydrogen-generating apparatus comprising two catalytic reactors cyclically operating reforming and regeneration (combustion) mode, in which the reduction in reforming efficiency associated with an increase in switching frequency to the regeneration reaction can be suppressed, and generation of hydrogen by reforming can stably be performed. In the reforming reaction, a cathode offgas discharged from a hydrogen-separation-membrane fuel cell 30 having a hydrogen-permeating film is supplied to PSR reformers 10 and 20, in which the reforming reaction and the regeneration reaction are performed alternately.
摘要:
A method for manufacturing a ferroelectric memory includes: (a) forming first and second contact sections on a first dielectric layer formed above a base substrate; (b) forming a laminated body having a lower electrode, a ferroelectric layer and an upper electrode successively laminated; (c) forming a conductive hard mask above the laminated body and etching an area of the laminated body exposed through the hard mask, to thereby form a ferroelectric capacitor above the first contact section; (d) forming above the first dielectric layer a second dielectric layer that covers the hard mask, the ferroelectric capacitor and the second contact section; (e) forming a contact hole in the second dielectric layer which exposes the second contact section; (f) providing a conductive layer in an area including the contact hole for forming a third contact section; and (g) polishing the conductive layer and the second dielectric layer until the hard mask above the ferroelectric capacitor is exposed.