公开(公告)号：US07242065B2

公开(公告)日：2007-07-10

申请号：US11081525

申请日：2005-03-17

申请人： Ichiharu Kondo ,  Hiroaki Tanaka ,  Inao Toyoda ,  Makoto Totani

发明人： Ichiharu Kondo ,  Hiroaki Tanaka ,  Inao Toyoda ,  Makoto Totani

IPC分类号： H01L29/84 ,  G01L9/00

CPC分类号： G01L9/0054 ,  G01L19/148

摘要： A pressure sensor includes a sensor chip and a circuit chip. The sensor chip, which is configured to generate an electrical signal representative of a pressure being sensed, has a surface including a sensing area and a plurality of electrical contact pads disposed on the surface. The circuit chip includes a circuit configured to process the electrical signal and has a surface on which a plurality of electrical contact pads of the circuit chip are disposed. The circuit chip is joined to the sensor chip so that the electrical contact pads of the circuit chip are respectively electrically connected to those of the sensor chip, all the electrical contact pads of the circuit chip and the sensor chip are hermetically sealed and isolated from the fluid, and the surfaces of the circuit chip and the sensor chip face each other with the electrical contact pads of the same interposed therebetween.

摘要翻译： 压力传感器包括传感器芯片和电路芯片。 被配置为产生代表被感测的压力的电信号的传感器芯片具有包括感测区域和设置在表面上的多个电接触焊盘的表面。 电路芯片包括被配置为处理电信号并且具有设置电路芯片的多个电接触焊盘的表面的电路。 电路芯片连接到传感器芯片，使得电路芯片的电接触焊盘分别电连接到传感器芯片的电接触焊盘，电路芯片和传感器芯片的所有电接触焊盘都被密封和隔离 流体，并且电路芯片和传感器芯片的表面彼此面对，并且其间具有相同的电接触焊盘。

公开(公告)号：US07176541B2

公开(公告)日：2007-02-13

申请号：US11137404

申请日：2005-05-26

申请人： Hiroaki Tanaka ,  Inao Toyoda ,  Ichiharu Kondo ,  Makoto Totani

发明人： Hiroaki Tanaka ,  Inao Toyoda ,  Ichiharu Kondo ,  Makoto Totani

IPC分类号： H01L29/84

CPC分类号： G01L19/147 ,  G01L9/0054

摘要： A pressure sensor chip includes a diaphragm and pads. A flexible printed circuit board (FPC) includes a resin sheet having a through-hole and wiring patterns that are formed within the resin sheet and sealed. The resin sheet is press-fitted to the pressure sensor chip such that the diaphragm is bared at the through-hole. The wiring patterns are connected to the pads, and junctions between the wiring patterns and the pads are sealed with the resin sheet.

摘要翻译： 压力传感器芯片包括隔膜和垫片。 柔性印刷电路板（FPC）包括具有通孔的树脂片和形成在树脂片内并被密封的布线图案。 树脂片被压配合到压力传感器芯片，使得隔膜在通孔处露出。 布线图案连接到焊盘，并且布线图案和焊盘之间的接合部用树脂片密封。

公开(公告)号：US20050210993A1

公开(公告)日：2005-09-29

申请号：US11079475

申请日：2005-03-15

申请人： Inao Toyoda ,  Hiroaki Tanaka ,  Ichiharu Kondo ,  Makoto Totani

发明人： Inao Toyoda ,  Hiroaki Tanaka ,  Ichiharu Kondo ,  Makoto Totani

IPC分类号： B60C23/00 ,  B60C23/04 ,  G01L9/00 ,  G01L9/06 ,  G01L17/00 ,  G01L19/06 ,  G01L19/14 ,  G01L23/24

CPC分类号： B60C23/0408 ,  G01L9/0055 ,  G01L19/0069 ,  G01L19/0627 ,  G01L19/147 ,  G01L23/24

摘要： A pressure sensor mainly includes a sensor chip, a circuit chip, and a substrate. The sensor chip is configured to generate an electrical signal representative of a pressure being sensed and includes a sensing area and a plurality of contact pads. The circuit chip includes a circuit configured to process the electrical signal and a plurality of contact pads. The substrate includes a resin sheet having an opening and a plurality of conductors within the resin sheet. The substrate is joined to both the sensor chip and circuit chip so that the sensing area of the sensor chip is to be exposed to the pressure being sensed through the opening of the resin sheet, the contact pads of the sensor chip and circuit chip are electrically connected to the conductors of the substrate, and all the contact pads and conductors are hermetically embedded in the resin sheet of the substrate.

摘要翻译： 压力传感器主要包括传感器芯片，电路芯片和基板。 传感器芯片被配置为产生代表正在感测的压力的电信号，并且包括感测区域和多个接触焊盘。 电路芯片包括被配置为处理电信号的电路和多个接触焊盘。 基板包括在树脂片内具有开口和多个导体的树脂片。 基片连接到传感器芯片和电路芯片上，以使传感器芯片的感测区域暴露于通过树脂片的开口感测的压力，传感器芯片和电路芯片的接触垫电气 连接到基板的导体，并且所有接触焊盘和导体都气密地嵌入在基板的树脂片中。

公开(公告)号：US20050205950A1

公开(公告)日：2005-09-22

申请号：US11081525

申请日：2005-03-17

申请人： Ichiharu Kondo ,  Hiroaki Tanaka ,  Inao Toyoda ,  Makoto Totani

发明人： Ichiharu Kondo ,  Hiroaki Tanaka ,  Inao Toyoda ,  Makoto Totani

IPC分类号： G01L9/00 ,  G01L19/06 ,  H01L29/84

CPC分类号： G01L9/0054 ,  G01L19/148

摘要： A pressure sensor includes a sensor chip and a circuit chip. The sensor chip, which is configured to generate an electrical signal representative of a pressure being sensed, has a surface including a sensing area and a plurality of electrical contact pads disposed on the surface. The circuit chip includes a circuit configured to process the electrical signal and has a surface on which a plurality of electrical contact pads of the circuit chip are disposed. The circuit chip is joined to the sensor chip so that the electrical contact pads of the circuit chip are respectively electrically connected to those of the sensor chip, all the electrical contact pads of the circuit chip and the sensor chip are hermetically sealed and isolated from the fluid, and the surfaces of the circuit chip and the sensor chip face each other with the electrical contact pads of the same interposed therebetween.

摘要翻译： 压力传感器包括传感器芯片和电路芯片。 被配置为产生代表被感测的压力的电信号的传感器芯片具有包括感测区域和设置在表面上的多个电接触焊盘的表面。 电路芯片包括被配置为处理电信号并且具有设置电路芯片的多个电接触焊盘的表面的电路。 电路芯片连接到传感器芯片，使得电路芯片的电接触焊盘分别电连接到传感器芯片的电接触焊盘，电路芯片和传感器芯片的所有电接触焊盘都被密封和隔离 流体，并且电路芯片和传感器芯片的表面彼此面对，并且其间具有相同的电接触焊盘。

公开(公告)号：US07168326B2

公开(公告)日：2007-01-30

申请号：US11079475

申请日：2005-03-15

申请人： Inao Toyoda ,  Hiroaki Tanaka ,  Ichiharu Kondo ,  Makoto Totani

发明人： Inao Toyoda ,  Hiroaki Tanaka ,  Ichiharu Kondo ,  Makoto Totani

IPC分类号： F02P5/00

CPC分类号： B60C23/0408 ,  G01L9/0055 ,  G01L19/0069 ,  G01L19/0627 ,  G01L19/147 ,  G01L23/24

摘要： A pressure sensor mainly includes a sensor chip, a circuit chip, and a substrate. The sensor chip is configured to generate an electrical signal representative of a pressure being sensed and includes a sensing area and a plurality of contact pads. The circuit chip includes a circuit configured to process the electrical signal and a plurality of contact pads. The substrate includes a resin sheet having an opening and a plurality of conductors within the resin sheet. The substrate is joined to both the sensor chip and circuit chip so that the sensing area of the sensor chip is to be exposed to the pressure being sensed through the opening of the resin sheet, the contact pads of the sensor chip and circuit chip are electrically connected to the conductors of the substrate, and all the contact pads and conductors are hermetically embedded in the resin sheet of the substrate.

摘要翻译： 压力传感器主要包括传感器芯片，电路芯片和基板。 传感器芯片被配置为产生代表正在感测的压力的电信号，并且包括感测区域和多个接触焊盘。 电路芯片包括被配置为处理电信号的电路和多个接触焊盘。 基板包括在树脂片内具有开口和多个导体的树脂片。 基片连接到传感器芯片和电路芯片上，以使传感器芯片的感测区域暴露于通过树脂片的开口感测的压力，传感器芯片和电路芯片的接触垫电气 连接到基板的导体，并且所有接触焊盘和导体都气密地嵌入在基板的树脂片中。

公开(公告)号：US20050269654A1

公开(公告)日：2005-12-08

申请号：US11137404

申请日：2005-05-26

申请人： Hiroaki Tanaka ,  Inao Toyoda ,  Ichiharu Kondo ,  Makoto Totani

发明人： Hiroaki Tanaka ,  Inao Toyoda ,  Ichiharu Kondo ,  Makoto Totani

IPC分类号： G01L9/00 ,  G01L9/04 ,  G01L9/06 ,  G01L19/06 ,  H01L29/84

CPC分类号： G01L19/147 ,  G01L9/0054

摘要： A pressure sensor chip includes a diaphragm and pads. A flexible printed circuit board (FPC) includes a resin sheet having a through-hole and wiring patterns that are formed within the resin sheet and sealed. The resin sheet is press-fitted to the pressure sensor chip such that the diaphragm is bared at the through-hole. The wiring patterns are connected to the pads, and junctions between the wiring patterns and the pads are sealed with the resin sheet.

摘要翻译： 压力传感器芯片包括隔膜和垫片。 柔性印刷电路板（FPC）包括具有通孔的树脂片和形成在树脂片内并被密封的布线图案。 树脂片被压配合到压力传感器芯片，使得隔膜在通孔处露出。 布线图案连接到焊盘，并且布线图案和焊盘之间的接合部用树脂片密封。

公开(公告)号：US20050034526A1

公开(公告)日：2005-02-17

申请号：US10950561

申请日：2004-09-28

申请人： Keiji Shinyama ,  Yositugu Abe ,  Hiroaki Tanaka ,  Inao Toyoda ,  Yoshifumi Watanabe ,  Ichiharu Kondo

发明人： Keiji Shinyama ,  Yositugu Abe ,  Hiroaki Tanaka ,  Inao Toyoda ,  Yoshifumi Watanabe ,  Ichiharu Kondo

IPC分类号： C23C18/16 ,  C23C18/34 ,  C23C18/42 ,  G01F1/34 ,  G01F1/692 ,  G01F15/00 ,  G01L9/00 ,  H01L23/485 ,  H01L21/66

CPC分类号： G01L19/147 ,  B81B7/0012 ,  B81B2207/07 ,  G01F1/34 ,  G01F1/692 ,  G01F15/006 ,  G01L19/0645 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05558 ,  H01L2224/05644 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48475 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48744 ,  H01L2224/48799 ,  H01L2224/48844 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/8592 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： A method of plating a semiconductor wafer while maintaining a uniform thickness of the plated film, preventing the precipitation on the back surface of the wafer and preventing the contamination in the subsequent steps. In directly forming connection terminals on the aluminum electrodes on the semiconductor wafer, the non-electrolytic plating is effected in a state where the back surface of the wafer is covered with an insulator. The insulator is preferably a glass substrate which is a part constituting the product. A semiconductor type sensor exhibits improved corrosion resistance against a corrosive medium. The semiconductor type sensor has, in a semiconductor substrate, a structural portion for detecting the physical quantity or the chemical component of a corrosive medium and an electric quantity conversion element, and has pads which are the output terminals for sending the detected electric signals to an external unit, wherein the pads are protected by a precious metal.

摘要翻译： 同时保持电镀膜厚度均匀的方法来镀覆半导体晶片，防止晶片的背面沉淀，防止后续步骤的污染。 在半导体晶片上的铝电极上直接形成连接端子时，非电解电镀是在晶片的背面被绝缘体覆盖的状态下进行的。 绝缘体优选为构成产品的部分的玻璃基板。 半导体型传感器对腐蚀性介质表现出改善的耐腐蚀性。 半导体型传感器在半导体基板中具有用于检测腐蚀介质的物理量或化学成分的结构部分和电量转换元件，并且具有作为输出端子的焊盘，用于将检测到的电信号发送到 外部单元，其中垫被贵金属保护。

公开(公告)号：US06973836B2

公开(公告)日：2005-12-13

申请号：US10785980

申请日：2004-02-26

申请人： Takashi Katsumata ,  Inao Toyoda ,  Hiroaki Tanaka

发明人： Takashi Katsumata ,  Inao Toyoda ,  Hiroaki Tanaka

IPC分类号： G01L9/04 ,  B81B3/00 ,  G01L1/22 ,  G01L9/00 ,  G01L19/04 ,  H01L29/84

CPC分类号： G01L1/2281 ,  G01L9/0054 ,  G01L9/065

摘要： A semiconductor pressure sensor includes a semiconductor substrate having a diaphragm for receiving pressure and a bridge circuit for detecting a distortion of the diaphragm corresponding to the pressure. The bridge circuit includes a pair of first gauge resistors and a pair of second gauge resistors. The first gauge resistors are disposed on a center of the diaphragm, and the second gauge resistors are disposed on a periphery of the diaphragm. Each first gauge resistor has a first resistance, which is larger than a second resistance of each second gauge resistor. The TNO property of the sensor is improved, so that the sensor has high detection accuracy.

摘要翻译： 半导体压力传感器包括具有用于接收压力的膜片的半导体衬底和用于检测对应于该压力的膜片的变形的桥接电路。 桥接电路包括一对第一规格电阻器和一对第二规格电阻器。 第一规格电阻器设置在隔膜的中心，并且第二电阻器设置在隔膜的周边上。 每个第一量规电阻器具有大于每个第二规格电阻器的第二电阻的第一电阻。 传感器的TNO性能得到改善，传感器检测精度高。

公开(公告)号：US20050166682A1

公开(公告)日：2005-08-04

申请号：US11019286

申请日：2004-12-23

申请人： Hiroaki Tanaka ,  Inao Toyoda ,  Yasutoshi Suzuki

发明人： Hiroaki Tanaka ,  Inao Toyoda ,  Yasutoshi Suzuki

IPC分类号： G01L1/16 ,  G01L1/18 ,  G01L9/00 ,  G01L9/04 ,  G01L9/06 ,  G01L9/08 ,  G01L19/04 ,  G01L23/18 ,  G01L23/22

CPC分类号： G01L1/18 ,  G01L9/0042 ,  G01L9/0058 ,  G01L23/18 ,  G01L23/22

摘要： A pressure sensor includes: a casing; a sensor chip with a gauge resistor; a boss disposed on the gauge resistor; a metallic diaphragm capable of distorting in accordance with a pressure; and a load transmission member disposed between the metallic diaphragm and the boss. The casing accommodates the sensor chip, the boss and the load transmission member. The casing is covered with the metallic diaphragm. The pressure applied to the diaphragm is detected such that the load corresponding to the pressure is applied to the gauge resistor through the metallic diaphragm, the load transmission member and the boss so that the pressure is measured on the basis of a resistance change of the gauge resistor. The gauge resistor is larger than the boss.

摘要翻译： 压力传感器包括：壳体; 具有量规电阻器的传感器芯片; 设在量规电阻上的一个老板; 能够根据压力变形的金属隔膜; 以及设置在所述金属膜和所述凸台之间的载荷传递部件。 壳体容纳传感器芯片，凸台和负载传递构件。 外壳被金属隔膜覆盖。 检测施加到隔膜的压力，使得通过金属隔膜，负载传递构件和凸台将对应于压力的负载施加到量规电阻器，使得基于量规的电阻变化来测量压力 电阻。 量规电阻大于凸台。

公开(公告)号：US06422088B1

公开(公告)日：2002-07-23

申请号：US09666085

申请日：2000-09-21

申请人： Nobukazu Oba ,  Yoshifumi Murakami ,  Yukihiko Tanizawa ,  Hiroaki Tanaka ,  Seiichiro Ishio ,  Inao Toyoda ,  Yasutoshi Suzuki

发明人： Nobukazu Oba ,  Yoshifumi Murakami ,  Yukihiko Tanizawa ,  Hiroaki Tanaka ,  Seiichiro Ishio ,  Inao Toyoda ,  Yasutoshi Suzuki

IPC分类号： G01L900

CPC分类号： G01L27/007 ,  G01D3/08 ,  G01L9/0054 ,  G01L9/02 ,  G01R17/10

摘要： A reference voltage generating circuit is constituted by resistors RE and RF each having a resistance not influenced by an application of pressure. The reference voltage generating circuit is connected between one and the other ends of a bridge circuit. A failure judgement of the bridge circuit is performed based on a comparison of a voltage difference VBC between two midpoints B and C of the bridge circuit and voltage differences VCE and VBE between a reference voltage level of the reference voltage generating circuit and the voltage levels of two midpoints B and C.

摘要翻译： 参考电压发生电路由电阻器RE和RF构成，每个电阻器不受施加压力的影响。 参考电压产生电路连接在桥接电路的一端和另一端之间。 基于桥电路的两个中点B和C之间的电压差VBC与参考电压产生电路的参考电压电平之间的电压差VCE和VBE的比较，执行桥电路的故障判断， 两个中点B和C.