摘要:
A photosensitive polyimide resin precursor composition capable of providing a polyimide resin that is not substantially colored, is transparent and has heat resistance, an optical polyimide resin obtained from the composition, and an optical waveguide using the polyimide resin. The photosensitive polyimide resin precursor composition contains (a) 100 parts by weight of a polyamic acid obtained from a tetracarboxylic acid dianhydride and a diamine, (b) 0.01 parts by weight or more and less than 5 parts by weight of a 1,4-dihydropyridine derivative, (c) 5–50 parts by weight of a glycol (ether). The optical polyimide resin is obtained by irradiating the photosensitive resin precursor composition with UV light, followed by exposure, heating, development, and then heating. The optical waveguide comprises a core layer comprising the optical polyimide resin, and a cladding layer thereof.
摘要:
The present invention provides a resin composition for a wiring circuit board; a substrate for a wiring circuit board in which a base insulating layer has been formed from the resin composition for a wiring circuit board; and a wiring circuit board having insulating layers including a cover insulating layer formed from the resin composition for a wiring circuit board. The resin composition for a wiring circuit board, the substrate for a wiring circuit board, and the wiring circuit board can prevent warpage and curling, increase adhesion between the insulating layer and the conductor layer, and enhance the durability and reliability of the wiring circuit board. The resin composition for a wiring circuit board contains a polyimide resin precursor, and a polyhydric phenol compound.
摘要:
A method for manufacturing wired circuit board that enables a wired circuit board of high quality to be manufactured without changing in dimension of the wired circuit board substantially. In this method, the wired circuit board is wound in layers in the winding process in such a manner that after an uncured thermosetting resin layer is formed on the wired circuit board in the resin layer forming process, a right-side spacer and a left-side spacer are disposed on the already wound wired circuit board at both widthwise ends thereof and also an upper spacer is disposed on the right-side spacer and the left-side spacer so as to cover a widthwise area of the wired circuit board, so that the right-side spacer, the left-side spacer and the upper spacer are positioned between the layers of the wired circuit board when wound. Thereafter, the wired circuit board wound in the rolled state is heated as it is, to cure the uncured thermosetting resin layer in the curing process.
摘要:
A photosensitive resin composition which is excellent in both sensitivity and resolution, can be rapidly developed with an aqueous alkali solution alone, further has excellent adhesion to substrates, and can give through imidization a light-colored polyimide resin film; and a circuit board having an insulating layer obtained from the photosensitive resin composition. The photosensitive resin composition comprises a poly(amic acid) resin, a 1,4-dihydropyridine derivative and a polyethylene glycol, and may optionally further contain a polyhydric phenol compound. This photosensitive resin composition can be developed at a high rate with a developing solution consisting only of an aqueous alkali solution. As a result, a satisfactory negative-pattern film which is a light-colored film can be formed with high sensitivity, high resolution, and a reduced film loss while preventing film coloration.
摘要:
A negative-working photoresist composition comprising 1,4-dihydropyridine derivative as a photosensitive material and a polyamic acid, a heat-resisting photoresist composition comprising a photosensitive polyamic acid which is excellent in sensitivity and resolution and can be easily developed with an aqueous alkali solution is provided. The negative-working photoresist composition contains a polyamic acid and a 1,4-dihydropyridine derivative represented by following formula (I): ##STR1## wherein Ar represents an aromatic group having a nitro group at the ortho-position; R.sup.1 represents an alkylene group having from 1 to 5 carbon atoms; and R.sup.2, R.sup.3, R.sup.4, and R.sup.5 each represents a hydrogen atom or an alkyl group having from 1 to 4 carbon atoms.
摘要:
A negative photosensitive material is provided which has a lower linear expansion coefficient and a lower hygroscopic expansion coefficient and is excellent in gradational patternability and PI etchability in patterning. The negative photosensitive material comprises: (A) a polyimide precursor having a structural unit represented by the following general formula (1) and a structural unit represented by the following general formula (2), the structural unit represented by the general formula (2) being present in the polyimide precursor in a proportion of less than 30 mol % based on the overall amount of the polyimide precursor; and (B) at least one of a pyridine derivative represented by the following general formula (3) and a pyridine derivative represented by the following general formula (4): wherein R1, R2, R3, R4 and R5, which may be the same or different, are each a C1 to C4 alkyl group, and Ar is an aryl group having a nitro group at its ortho position, wherein R1, R2, R4 and R5, which may be the same or different, are each a C1 to C4 alkyl group, and Ar is an aryl group having a nitro group at its ortho position.
摘要:
An image processing device comprises a region dividing unit which divides a captured image obtained by a camera unit into a plurality of regions, and an image compressing unit which compresses each of region images obtained by the division by the region dividing unit while changing the compression rate according to the distance from a predetermined point in the captured image to each of the region images and the distance from the camera unit to a target included in each of the regions. For example, the image compressing unit compresses the region image having a larger angle from the optical axis at a larger compression rate, thereby achieving compression in which the amount of data in low-quality regions is greatly reduced and the quality of high-quality regions is maintained.
摘要:
A panoramic image display device divides a panoramic expansion image into at least two panoramic images and displays the panoramic images. The panoramic expansion image display device including: a clipping reference position setting unit that sets a clipping reference position for the panoramic expansion image; an object detection unit that detects an object as a display target from the panoramic expansion image; a clipping position determination unit that determines a clipping position of the panoramic image according to a relationship between a detected object position and the clipping reference position; and a display image generation unit that displays the panoramic image clipped from the panoramic expansion image at the clipping position.
摘要:
Specified types of words are extracted from a plurality of radiology reports archived in an archive configured to archive a plurality of radiology reports. The words extracted from a single radiology report are stored in combination. In response to an input operation using an operating part of inputting the specified types of words, combinations including the specified types of words as one part are searched. A list of the specified types of words included as the other part in the searched combinations is generated. In response to an input operation using the operating part of selecting any word from the word list, a list of radiology reports including the inputted word and the selected word is generated. In response to an input operation using the operating part of selecting any report from the radiology report list, the selected radiology report is outputted from the archive to a display.
摘要:
A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.
摘要翻译:提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者,清洁片包括维氏硬度不低于10MPa的清洁层。