公开(公告)号：US07037637B2

公开(公告)日：2006-05-02

申请号：US10424772

申请日：2003-04-29

申请人： Kazunori Mune ,  Amane Mochizuki ,  Shunichi Hayashi ,  Hirofumi Fujii ,  Takahiro Fukuoka ,  Ryusuke Naitou

发明人： Kazunori Mune ,  Amane Mochizuki ,  Shunichi Hayashi ,  Hirofumi Fujii ,  Takahiro Fukuoka ,  Ryusuke Naitou

IPC分类号： G03F7/038 ,  G02B6/10

CPC分类号： G03F7/0387 ,  C08K5/06 ,  C08K5/3432 ,  C08L79/08 ,  G03F7/0005 ,  G03F7/001 ,  G03F7/0045 ,  C08L2666/22

摘要： A photosensitive polyimide resin precursor composition capable of providing a polyimide resin that is not substantially colored, is transparent and has heat resistance, an optical polyimide resin obtained from the composition, and an optical waveguide using the polyimide resin. The photosensitive polyimide resin precursor composition contains (a) 100 parts by weight of a polyamic acid obtained from a tetracarboxylic acid dianhydride and a diamine, (b) 0.01 parts by weight or more and less than 5 parts by weight of a 1,4-dihydropyridine derivative, (c) 5–50 parts by weight of a glycol (ether). The optical polyimide resin is obtained by irradiating the photosensitive resin precursor composition with UV light, followed by exposure, heating, development, and then heating. The optical waveguide comprises a core layer comprising the optical polyimide resin, and a cladding layer thereof.

摘要翻译： 能够提供基本不着色的聚酰亚胺树脂的光敏聚酰亚胺树脂前体组合物是透明的并且具有耐热性，由该组合物获得的光学聚酰亚胺树脂和使用该聚酰亚胺树脂的光波导。 感光性聚酰亚胺树脂前体组合物含有（a）100重量份由四羧酸二酐和二胺获得的聚酰胺酸，（b）0.01重量份以上且小于5重量份的1,4-二 二氢吡啶衍生物，（c）5-50重量份二醇（醚）。 通过用紫外光照射感光性树脂前体组合物，然后曝光，加热，显影，然后加热，得到光学聚酰亚胺树脂。 光波导包括包含光学聚酰亚胺树脂的芯层及其包覆层。

公开(公告)号：US06772515B2

公开(公告)日：2004-08-10

申请号：US09960919

申请日：2001-09-25

申请人： Tokihito Suwa ,  Atsushi Tanaka ,  Satoshi Tanigawa ,  Hirofumi Fujii ,  Kazunori Mune

发明人： Tokihito Suwa ,  Atsushi Tanaka ,  Satoshi Tanigawa ,  Hirofumi Fujii ,  Kazunori Mune

IPC分类号： H05K302

CPC分类号： H05K3/4644 ,  H05K1/09 ,  H05K3/108 ,  H05K3/388 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0344 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09563 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： To provide a method of producing a multilayer printed wiring board that can be intended to have low-profile, light-weight and high-density wiring of a printed wiring board, and a multilayer printed wiring board produced by the method of producing a multilayer printed wiring board, the double-sided substrate is produced by the steps of forming an insulating resin layer on a metal foil; of forming a via hole in the insulating resin layer; of forming a first circuit pattern on the insulating resin layer and forming a conductive layer in the via hole, by plating; and of etching the metal foil to form it into a second circuit pattern. The produced double-sided substrate is used as a core substrate for producing multilayer printed wiring board by a laminate-en-bloc or a build-up method.

摘要翻译： 本发明提供一种制造多层印刷电路板的方法，所述多层印刷电路板可以用于印刷电路板的薄型，重量轻和高密度布线，以及通过制造多层印刷方法制造的多层印刷线路板 通过在金属箔上形成绝缘树脂层的步骤制造双面基板; 在所述绝缘树脂层中形成通孔; 在所述绝缘树脂层上形成第一电路图案，并在所述通孔中形成导电层，通过电镀; 并蚀刻金属箔以形成第二电路图案。 将生产的双面基板用作通过层叠体或堆积方法制造多层印刷线路板的核心基板。

公开(公告)号：US06662442B1

公开(公告)日：2003-12-16

申请号：US09619502

申请日：2000-07-19

申请人： Kouji Matsui ,  Kazunori Mune ,  Hirofumi Fujii ,  Satoshi Tanigawa

发明人： Kouji Matsui ,  Kazunori Mune ,  Hirofumi Fujii ,  Satoshi Tanigawa

IPC分类号： H01K310

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L2221/68345 ,  H01L2924/15311 ,  H05K3/108 ,  H05K3/205 ,  H05K3/4007 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A process for producing a printed wiring board, particularly an interposer for a chip size package, which comprises the steps of (1) forming an outer insulator layer 22 having outer via-holes 24 on a substrate 32, (2) forming conducting passages 31 through the outer via-holes 24 by plating with metal up to substantially the same level as the upper surface of the outer insulator layer 22, (3) forming a thin metal film 29 on the outer insulator layer 22 and on the conducting passages 31, (4) forming a conductor layer 21 in a prescribed circuit pattern on the thin metal film 29 by plating, (5) removing the part of the thin metal film 29 on which the conductor layer 21 is not formed, (6) forming an inner insulator layer 23 on the conductor layer 21, and (7) removing the substrate 32. The outer insulator layer is formed with flatness to secure good adhesion to a semiconductor chip.

摘要翻译： 一种用于制造印刷线路板的方法，特别是用于芯片尺寸封装的插入件，其包括以下步骤：（1）在基板32上形成具有外部通孔24的外部绝缘体层22，（2）形成导电通路31 通过用外部绝缘体层22的上表面大致相同的金属镀覆外部通孔24，（3）在外绝缘体层22和导电路31上形成薄金属膜29， （4）通过电镀在薄金属膜29上形成规定的电路图案的导体层21，（5）除去未形成导体层21的金属薄膜29的一部分，（6）形成内部 导体层21上的绝缘体层23，以及（7）去除衬底32.外绝缘层形成为平坦度，以确保对半导体芯片的良好粘合性。

公开(公告)号：US06904674B2

公开(公告)日：2005-06-14

申请号：US10119695

申请日：2002-04-11

申请人： Kazunori Mune ,  Hirofumi Fujii ,  Satoshi Tanigawa

发明人： Kazunori Mune ,  Hirofumi Fujii ,  Satoshi Tanigawa

IPC分类号： H05K1/11 ,  H01L21/48 ,  H01L23/12 ,  H05K3/20 ,  H05K3/24 ,  H05K3/40 ,  H05K3/42 ,  H01K3/10

CPC分类号： H01L21/486 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/205 ,  H05K3/423 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A printed wiring board, particularly, an interposer 20 for a chip scale package, comprising an outer insulator layer 22 having outer electrodes 31, a conductor layer 21, and an inner insulator layer 23 having inner electrodes 27, the electrodes 31 and/or 27 having been formed by electroplating using, as a negative electrode, a metal plate 32 that has been provided on the outer insulator layer 22 and removed after the electroplating. Having no plating leads, the printed wiring board has the electrodes in an orderly array at a fine pitch and a high density.

摘要翻译： 一种印刷电路板，特别是用于芯片级封装的插入件20，包括具有外部电极31，导体层21和具有内部电极27，电极31和/或27的内部绝缘体层23的外部绝缘体层22 通过使用已经设置在外绝缘体层22上并在电镀之后去除的金属板32作为负极来进行电镀而形成。 没有电镀引线，印刷线路板具有以细间距和高密度有序排列的电极。

公开(公告)号：US06379159B1

公开(公告)日：2002-04-30

申请号：US09541898

申请日：2000-04-03

申请人： Kazunori Mune ,  Kazuo Ouchi ,  Satoshi Tanigawa ,  Hirofumi Fujii

发明人： Kazunori Mune ,  Kazuo Ouchi ,  Satoshi Tanigawa ,  Hirofumi Fujii

IPC分类号： H05G336

CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/205 ,  H05K3/423 ,  H05K2201/09354 ,  H05K2201/10378 ,  H05K2203/0733 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655

摘要： In a method for manufacturing an interposer for CSP and its intermediate body, a first insulating layer is formed on a cathode substrate. An opening is formed at a position in the insulating layer where a contact is to be formed so that the surface of the substrate is exposed to the inner bottom of the opening. The opening is filled with metal by the electroplating using the cathode substrate as a cathode to form a conductive path. A circuit pattern which is contact with the conductive path is formed on the insulating layer. The cathode substrate is removed partially or entirely so that the end surface of the conductive path is exposed to form a contact. This permits a variation of the heights of a plurality of contacts to be reduced.

摘要翻译： 在制造CSP及其中间体用插入体的方法中，在阴极基板上形成第一绝缘层。 在要形成接触的绝缘层中的一个位置处形成开口，使得基板的表面暴露于开口的内底部。 通过使用阴极基板作为阴极的电镀，用金属填充开口以形成导电路径。 在绝缘层上形成与导电路径接触的电路图案。 部分或全部去除阴极基板，使得导电路径的端面暴露以形成接触。 这允许减少多个触点的高度的变化。

公开(公告)号：US06623843B2

公开(公告)日：2003-09-23

申请号：US10041451

申请日：2002-01-10

申请人： Hirofumi Fujii ,  Shunichi Hayashi

发明人： Hirofumi Fujii ,  Shunichi Hayashi

IPC分类号： B32B300

CPC分类号： H05K1/0346 ,  B32B15/08 ,  H05K3/285 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

摘要： The present invention provides a resin composition for a wiring circuit board; a substrate for a wiring circuit board in which a base insulating layer has been formed from the resin composition for a wiring circuit board; and a wiring circuit board having insulating layers including a cover insulating layer formed from the resin composition for a wiring circuit board. The resin composition for a wiring circuit board, the substrate for a wiring circuit board, and the wiring circuit board can prevent warpage and curling, increase adhesion between the insulating layer and the conductor layer, and enhance the durability and reliability of the wiring circuit board. The resin composition for a wiring circuit board contains a polyimide resin precursor, and a polyhydric phenol compound.

公开(公告)号：US06889426B2

公开(公告)日：2005-05-10

申请号：US10198121

申请日：2002-07-19

申请人： Hirofumi Fujii ,  Shunichi Hayashi

发明人： Hirofumi Fujii ,  Shunichi Hayashi

IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K3/28 ,  H01R43/00

CPC分类号： H05K3/0097 ,  H05K1/0393 ,  H05K3/28 ,  H05K2201/051 ,  H05K2203/0182 ,  H05K2203/1545 ,  Y10T29/49071 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49158 ,  Y10T29/49163 ,  Y10T29/49171 ,  Y10T29/49176

摘要： A method for manufacturing wired circuit board that enables a wired circuit board of high quality to be manufactured without changing in dimension of the wired circuit board substantially. In this method, the wired circuit board is wound in layers in the winding process in such a manner that after an uncured thermosetting resin layer is formed on the wired circuit board in the resin layer forming process, a right-side spacer and a left-side spacer are disposed on the already wound wired circuit board at both widthwise ends thereof and also an upper spacer is disposed on the right-side spacer and the left-side spacer so as to cover a widthwise area of the wired circuit board, so that the right-side spacer, the left-side spacer and the upper spacer are positioned between the layers of the wired circuit board when wound. Thereafter, the wired circuit board wound in the rolled state is heated as it is, to cure the uncured thermosetting resin layer in the curing process.

摘要翻译： 一种用于制造布线电路板的方法，其能够在不改变布线电路板的尺寸的基础上制造高质量的布线电路板。 在这种方法中，布线电路板在卷绕过程中以这样一种方式缠绕，即在树脂层形成工艺中在布线电路板上形成未固化的热固性树脂层之后，将右侧间隔物和左侧间隔物 侧间隔件在其两个宽度方向的两端均布置在已经缠绕的布线电路板上，并且上侧间隔件设置在右侧隔离物和左侧间隔件上以覆盖布线电路板的宽度方向区域，使得 当缠绕时，右侧间隔件，左侧间隔件和上间隔件位于布线电路板的层之间。 此后，卷绕成轧制状态的布线电路板原样加热，在固化工序中固化未固化的热固性树脂层。

公开(公告)号：US06746816B2

公开(公告)日：2004-06-08

申请号：US09983943

申请日：2001-10-26

申请人： Shunichi Hayashi ,  Hirofumi Fujii

发明人： Shunichi Hayashi ,  Hirofumi Fujii

IPC分类号： G03C173

CPC分类号： G03F7/0387 ,  G03F7/0045 ,  H05K3/287 ,  Y10S430/106

摘要： A photosensitive resin composition which is excellent in both sensitivity and resolution, can be rapidly developed with an aqueous alkali solution alone, further has excellent adhesion to substrates, and can give through imidization a light-colored polyimide resin film; and a circuit board having an insulating layer obtained from the photosensitive resin composition. The photosensitive resin composition comprises a poly(amic acid) resin, a 1,4-dihydropyridine derivative and a polyethylene glycol, and may optionally further contain a polyhydric phenol compound. This photosensitive resin composition can be developed at a high rate with a developing solution consisting only of an aqueous alkali solution. As a result, a satisfactory negative-pattern film which is a light-colored film can be formed with high sensitivity, high resolution, and a reduced film loss while preventing film coloration.

摘要翻译： 敏感性和分辨率优异的感光性树脂组合物可以单独用碱性水溶液快速显影，进一步具有优异的与基材的粘合性，并且可以通过酰亚胺化得到浅色聚酰亚胺树脂膜; 以及具有由感光性树脂组合物得到的绝缘层的电路基板。 感光性树脂组合物包含聚（酰胺酸）树脂，1,4-二氢吡啶衍生物和聚乙二醇，还可以含有多元酚化合物。 该感光性树脂组合物可以用仅由碱性水溶液构成的显影液高速显影。 结果，在防止膜着色的同时，可以以高灵敏度，高分辨率和降低的膜损失形成作为浅色膜的令人满意的负图案膜。

公开(公告)号：US6048663A

公开(公告)日：2000-04-11

申请号：US230583

申请日：1999-01-29

申请人： Hirofumi Fujii ,  Shunichi Hayashi

发明人： Hirofumi Fujii ,  Shunichi Hayashi

IPC分类号： G03F7/004 ,  G03F7/038 ,  H01L21/027

CPC分类号： G03F7/0387

摘要： A negative-working photoresist composition comprising 1,4-dihydropyridine derivative as a photosensitive material and a polyamic acid, a heat-resisting photoresist composition comprising a photosensitive polyamic acid which is excellent in sensitivity and resolution and can be easily developed with an aqueous alkali solution is provided. The negative-working photoresist composition contains a polyamic acid and a 1,4-dihydropyridine derivative represented by following formula (I): ##STR1## wherein Ar represents an aromatic group having a nitro group at the ortho-position; R.sup.1 represents an alkylene group having from 1 to 5 carbon atoms; and R.sup.2, R.sup.3, R.sup.4, and R.sup.5 each represents a hydrogen atom or an alkyl group having from 1 to 4 carbon atoms.

摘要翻译： PCT No.PCT / JP97 / 02605 Sec。 371日期1999年1月29日第 102（e）1999年1月29日PCT PCT 1997年7月28日PCT公布。 公开号WO98 / 04959 日期1998年2月5日包含感光材料的1,4-二氢吡啶衍生物和聚酰胺酸的负性光致抗蚀剂组合物，包含感光性聚酰胺酸的耐热性光致抗蚀剂组合物，其灵敏度和分辨率优异且易于开发 提供碱性水溶液。 负性光刻胶组合物含有聚酰胺酸和下式（I）表示的1,4-二氢吡啶衍生物：其中Ar表示在邻位具有硝基的芳基; R1表示具有1至5个碳原子的亚烷基; 并且R 2，R 3，R 4和R 5各自表示氢原子或具有1至4个碳原子的烷基。

公开(公告)号：US08728705B2

公开(公告)日：2014-05-20

申请号：US12788837

申请日：2010-05-27

申请人： Katsutoshi Hirashima ,  Hirofumi Fujii ,  Yasushi Tamura ,  Ryouji Suezaki

发明人： Katsutoshi Hirashima ,  Hirofumi Fujii ,  Yasushi Tamura ,  Ryouji Suezaki

IPC分类号： G03F7/038 ,  G03F7/38

CPC分类号： G03F7/0387 ,  G03F7/0045 ,  G03F7/38 ,  H05K1/056 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/287 ,  H05K3/4092 ,  H05K2201/0154 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/0969 ,  H05K2203/056 ,  H05K2203/1476 ,  Y10S430/107

摘要： A negative photosensitive material is provided which has a lower linear expansion coefficient and a lower hygroscopic expansion coefficient and is excellent in gradational patternability and PI etchability in patterning. The negative photosensitive material comprises: (A) a polyimide precursor having a structural unit represented by the following general formula (1) and a structural unit represented by the following general formula (2), the structural unit represented by the general formula (2) being present in the polyimide precursor in a proportion of less than 30 mol % based on the overall amount of the polyimide precursor; and (B) at least one of a pyridine derivative represented by the following general formula (3) and a pyridine derivative represented by the following general formula (4): wherein R1, R2, R3, R4 and R5, which may be the same or different, are each a C1 to C4 alkyl group, and Ar is an aryl group having a nitro group at its ortho position, wherein R1, R2, R4 and R5, which may be the same or different, are each a C1 to C4 alkyl group, and Ar is an aryl group having a nitro group at its ortho position.

摘要翻译： 提供具有较低线性膨胀系数和较低吸湿膨胀系数的负型感光材料，并且在图案化中具有优异的梯度图案性和PI可蚀刻性。 负型感光材料包括：（A）具有由以下通式（1）表示的结构单元和由以下通式（2）表示的结构单元的聚酰亚胺前体，由通式（2）表示的结构单元， 以聚酰亚胺前体的总量小于30mol％的比例存在于聚酰亚胺前体中; 和（B）由以下通式（3）表示的吡啶衍生物和由以下通式（4）表示的吡啶衍生物中的至少一种：其中R1，R2，R3，R4和R5可以相同 或不同的，各自为C1〜C4烷基，Ar为其邻位具有硝基的芳基，其中R1，R2，R4和R5可以相同或不同，分别为C1〜C4 烷基，Ar是在其邻位具有硝基的芳基。