公开(公告)号：US09234263B2

公开(公告)日：2016-01-12

申请号：US13317463

申请日：2011-10-19

申请人： Hiromitsu Kuroda ,  Toru Sumi ,  Hideyuki Sagawa ,  Seigi Aoyama ,  Masayoshi Goto ,  Takahiko Hanada ,  Takahiro Sato ,  Hidenori Abe

发明人： Hiromitsu Kuroda ,  Toru Sumi ,  Hideyuki Sagawa ,  Seigi Aoyama ,  Masayoshi Goto ,  Takahiko Hanada ,  Takahiro Sato ,  Hidenori Abe

IPC分类号： B32B15/20 ,  C22C9/00 ,  B23K31/00 ,  C22C1/02 ,  C22C1/10 ,  C22F1/00 ,  C22F1/08

CPC分类号： C22C9/00 ,  B23K31/00 ,  B32B15/20 ,  C22C1/02 ,  C22C1/1036 ,  C22F1/00 ,  C22F1/08 ,  Y10T428/1266 ,  Y10T428/12667 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/1291

摘要： A weldment includes metal materials that are welded to each other. At least one of the metal materials includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Fe, Si, Al, Ca, V, Ni, Mn, Ti and Cr. A method of manufacturing a weldment includes melting a dilute copper alloy material by SCR continuous casting and rolling at a molten copper temperature of not less than 1100° C. and not more than 1320° C. to make a molten metal, forming a cast bar from the molten metal, forming a dilute copper alloy member by hot-rolling the cast bar, and welding the dilute copper alloy member to a metal material. The dilute copper alloy material includes the pure copper, more than 2 mass ppm of oxygen, and the additive element,?

摘要翻译： 焊件包括彼此焊接的金属材料。 至少一种金属材料包括包含不可避免的杂质的纯铜，大于2质量ppm的氧，以及选自Mg，Zr，Nb，Fe，Si，Al，Ca，V，Ni ，Mn，Ti和Cr。 一种焊接件的制造方法，其特征在于，以不低于1100℃，不高于1320℃的熔融铜温度，通过SCR连续铸造，熔融稀释的铜合金材料，形成熔融金属 从熔融金属中，通过对铸造棒进行热轧而形成稀铜合金构件，并将稀铜合金构件焊接到金属材料上。 稀铜合金材料包括纯铜，超过2质量ppm的氧和添加元素，

公开(公告)号：US20120100390A1

公开(公告)日：2012-04-26

申请号：US13317463

申请日：2011-10-19

申请人： Hiromitsu Kuroda ,  Toru Sumi ,  Hideyuki Sagawa ,  Seigi Aoyama ,  Masayoshi Goto ,  Takahiko Hanada ,  Takahiro Sato ,  Hidenori Abe

发明人： Hiromitsu Kuroda ,  Toru Sumi ,  Hideyuki Sagawa ,  Seigi Aoyama ,  Masayoshi Goto ,  Takahiko Hanada ,  Takahiro Sato ,  Hidenori Abe

IPC分类号： B32B15/20 ,  B23K31/00

CPC分类号： C22C9/00 ,  B23K31/00 ,  B32B15/20 ,  C22C1/02 ,  C22C1/1036 ,  C22F1/00 ,  C22F1/08 ,  Y10T428/1266 ,  Y10T428/12667 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/1291

摘要： A weldment includes metal materials that are welded to each other. At least one of the metal materials includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Fe, Si, Al, Ca, V, Ni, Mn, Ti and Cr. A method of manufacturing a weldment includes melting a dilute copper alloy material by SCR continuous casting and rolling at a molten copper temperature of not less than 1100° C. and not more than 1320° C. to make a molten metal, forming a cast bar from the molten metal, forming a dilute copper alloy member by hot-rolling the cast bar, and welding the dilute copper alloy member to a metal material. The dilute copper alloy material includes the pure copper, more than 2 mass ppm of oxygen, and the additive element,

摘要翻译： 焊件包括彼此焊接的金属材料。 至少一种金属材料包括包含不可避免的杂质的纯铜，大于2质量ppm的氧，以及选自Mg，Zr，Nb，Fe，Si，Al，Ca，V，Ni ，Mn，Ti和Cr。 一种焊接件的制造方法，其特征在于，以不低于1100℃，不高于1320℃的熔融铜温度，通过SCR连续铸造，熔融稀释的铜合金材料，形成熔融金属 从熔融金属中，通过对铸造棒进行热轧而形成稀铜合金构件，并将稀铜合金构件焊接到金属材料上。 稀铜合金材料包括纯铜，大于2质量ppm的氧和添加元素，

公开(公告)号：US10030287B2

公开(公告)日：2018-07-24

申请号：US13577400

申请日：2011-02-08

申请人： Seigi Aoyama ,  Toru Sumi ,  Hiromitsu Kuroda ,  Hideyuki Sagawa

发明人： Seigi Aoyama ,  Toru Sumi ,  Hiromitsu Kuroda ,  Hideyuki Sagawa

IPC分类号： C22C9/00 ,  C22F1/08 ,  H01B1/02 ,  B21C1/00 ,  C22C1/10

摘要： A soft dilute copper alloy material includes 2 mass ppm to 12 mass ppm of sulfur, more than 2 mass ppm and not more than 30 mass ppm of oxygen, 4 mass ppm to 55 mass ppm of Ti, and a balance including copper. An average crystal grain size is not more than 20 μm in a surface layer up to a depth of 50 μm from a surface. The average crystal grain size in the surface layer is less than the average crystal grain size in an inner portion located more interiorly than the surface layer.

公开(公告)号：US09734937B2

公开(公告)日：2017-08-15

申请号：US14005224

申请日：2012-03-16

申请人： Seigi Aoyama ,  Toru Sumi ,  Hiromitsu Kuroda ,  Hideyuki Sagawa

发明人： Seigi Aoyama ,  Toru Sumi ,  Hiromitsu Kuroda ,  Hideyuki Sagawa

IPC分类号： H01B7/04 ,  C22C9/00 ,  H01B1/02 ,  C22F1/08 ,  C22C1/02

CPC分类号： H01B7/04 ,  C22C1/02 ,  C22C9/00 ,  C22F1/08 ,  H01B1/026

摘要： Provided are a soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire which have high electrical conductivity and high bending life and can limit disconnection during use compared with oxygen-free copper wire, and also provided are an insulated wire, coaxial cable, and composite cable using the soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire. The soft dilute-copper alloy wire is subjected to annealing treatment by elongation processing of soft dilute-copper alloy material comprising copper and an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Hf, Fe, Mn and Cr, with inevitable impurities as the balance, wherein the soft dilute-copper alloy wire has an average grain size that is 20 μm or less in a surface layer having a depth of 50 μm from the surface, and an elongation value that is at least 1% higher than the average elongation value of oxygen-free copper wire that has been subjected to the aforementioned annealing treatment.

公开(公告)号：US20140000932A1

公开(公告)日：2014-01-02

申请号：US14005224

申请日：2012-03-16

申请人： Seigi Aoyama ,  Toru Sumi ,  Hiromitsu Kuroda ,  Hideyuki Sagawa

发明人： Seigi Aoyama ,  Toru Sumi ,  Hiromitsu Kuroda ,  Hideyuki Sagawa

IPC分类号： H01B7/04

CPC分类号： H01B7/04 ,  C22C1/02 ,  C22C9/00 ,  C22F1/08 ,  H01B1/026

摘要： Provided are a soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire which have high electrical conductivity and high bending life and can limit disconnection during use compared with oxygen-free copper wire, and also provided are an insulated wire, coaxial cable, and composite cable using the soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire. The soft dilute-copper alloy wire is subjected to annealing treatment by elongation processing of soft dilute-copper alloy material comprising copper and an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Hf, Fe, Mn and Cr, with inevitable impurities as the balance, wherein the soft dilute-copper alloy wire has an average grain size that is 20 μm or less in a surface layer having a depth of 50 μm from the surface, and an elongation value that is at least 1% higher than the average elongation value of oxygen-free copper wire that has been subjected to the aforementioned annealing treatment.

摘要翻译： 提供一种柔软的稀铜合金线和软的稀铜铜合金绞线，具有高导电性和高弯曲寿命，并且与无氧铜线相比可以限制使用时的断开，并且还提供了绝缘线，同轴电缆 ，复合电缆采用软弱铜铜合金线和软铜铜合金绞合线。 软铜铜合金线材通过伸长加工进行退火处理，该软质稀铜铜合金材料包含选自由Ti，Mg，Zr，Nb，Ca，V，Ni，Hf组成的组的铜和添加元素， Fe，Mn，Cr等不可避免的杂质作为平衡，其中，软质铜 - 铜合金线的表面的深度为50μm的表面层的平均粒径为20μm以下，伸长率值 比经过上述退火处理的无氧铜线的平均伸长率高1％以上。

公开(公告)号：US20130022831A1

公开(公告)日：2013-01-24

申请号：US13553762

申请日：2012-07-19

申请人： Hideyuki Sagawa ,  Seigi Aoyama ,  Hiromitsu Kuroda ,  Toru Sumi ,  Keisuke Fujito

发明人： Hideyuki Sagawa ,  Seigi Aoyama ,  Hiromitsu Kuroda ,  Toru Sumi ,  Keisuke Fujito

IPC分类号： B32B5/02

CPC分类号： H01B1/026 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L2224/05624 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/48824 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/10253 ,  Y10T428/12431 ,  H01L2224/45664 ,  H01L2224/45618 ,  H01L2224/45655 ,  H01L2224/45644 ,  H01L2224/45669 ,  H01L2224/45639 ,  H01L2924/01022 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01024 ,  H01L2924/00014 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/20755 ,  H01L2224/45124 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2924/2011 ,  H01L2924/01006 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/01008 ,  H01L2924/01016

摘要： A soft dilute copper alloy wire is composed of a soft dilute copper alloy material containing an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Cu, V, Ni, Mn, and Cr, and balance comprising Cu. An average size of crystal grains lying from a surface of the soft dilute copper alloy wire at least to a depth of 20% of a wire diameter is not greater than 20 μm.

摘要翻译： 软的稀铜合金线由含有选自Ti，Mg，Zr，Nb，Cu，V，Ni，Mn和Cr组成的组的添加元素的软的稀铜合金材料构成，余量为Cu。 从软的稀铜合金线的表面至少达到线径的20％的深度的晶粒的平均尺寸不大于20μm。

公开(公告)号：US20120305286A1

公开(公告)日：2012-12-06

申请号：US13577400

申请日：2011-02-08

申请人： Seigi Aoyama ,  Toru Sumi ,  Hiromitsu Kuroda ,  Hideyuki Sagawa

发明人： Seigi Aoyama ,  Toru Sumi ,  Hiromitsu Kuroda ,  Hideyuki Sagawa

IPC分类号： C22C9/00 ,  H01B5/08 ,  H01B7/00 ,  H01B5/00

CPC分类号： C22C9/00 ,  B21C1/003 ,  C22C1/10 ,  C22F1/08 ,  H01B1/026

摘要： Provided are a soft dilute copper alloy material, a soft dilute copper alloy wire, a soft dilute copper alloy sheet, a soft dilute copper alloy stranded wire, and a cable, a coaxial cable and a composite cable using same. The disclosed soft-3dilute-copper-alloy material contains: copper; at least one additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn, and Cr; and inevitable impurities as the remainder. The soft dilute copper alloy material is characterized in that the average grain size is at most 20 μm in the surface layer up to a depth of 50 μm from the surface.

摘要翻译： 提供了一种软的稀铜合金材料，一种软的稀铜合金线，一种软的稀铜合金板，一种软的稀铜合金绞线，以及一根电缆，一根同轴电缆和一根使用它的复合电缆。 所公开的软3dilute-铜合金材料包含：铜; 选自Ti，Mg，Zr，Nb，Ca，V，Ni，Mn和Cr中的至少一种附加元素; 和不可避免的杂质作为剩余部分。 软的稀铜合金材料的特征在于，表面层的平均粒径为20μm以下，距表面50μm为深度。

公开(公告)号：US09805836B2

公开(公告)日：2017-10-31

申请号：US13317461

申请日：2011-10-19

申请人： Hiromitsu Kuroda ,  Toru Sumi ,  Hideyuki Sagawa ,  Seigi Aoyama

发明人： Hiromitsu Kuroda ,  Toru Sumi ,  Hideyuki Sagawa ,  Seigi Aoyama

IPC分类号： H01B1/02 ,  C22C9/00 ,  B22D11/00 ,  C22F1/08

CPC分类号： H01B1/026 ,  B22D11/004 ,  C22C9/00

摘要： A dilute copper alloy material used in an environment with presence of hydrogen includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Ca, V, Fe, Al, Si, Ni, Mn, Ti and Cr, the additive element being capable of forming an oxide in combination with the oxygen. A method of manufacturing a dilute copper alloy member excellent in characteristics of resistance to hydrogen embrittlement includes melting the dilute copper alloy material by SCR continuous casting and rolling at a copper melting temperature of not less than 1100° C. and not more than 1320° C. to make molten metal, forming a cast bar from the molten metal, and forming the dilute copper alloy member by hot-rolling the cast bar.

公开(公告)号：US08779294B2

公开(公告)日：2014-07-15

申请号：US13276680

申请日：2011-10-19

申请人： Toru Sumi ,  Seigi Aoyama ,  Hiromitsu Kuroda ,  Hideyuki Sagawa

发明人： Toru Sumi ,  Seigi Aoyama ,  Hiromitsu Kuroda ,  Hideyuki Sagawa

IPC分类号： H01B7/08 ,  C22C9/00

CPC分类号： H01B1/026 ,  B22F2998/00 ,  C22C9/00 ,  C22F1/08 ,  C22C32/00

摘要： The present invention provides a flexible flat cable having high conductivity and high bending durability, and a method for manufacturing the same. The present invention is a flexible flat cable comprising conductors and insulating films applied over the conductors, wherein the conductor is comprised of at least one additive element selected from the group consisting of magnesium (Mg), zirconium (Zr), niobium (Nb), calcium (Ca), vanadium (V), nickel (Ni), manganese (Mn), titanium (Ti), and chromium (Cr); 2 mass-ppm or more of oxygen; and the balance being inevitable impurity and copper, wherein the conductor has such a recrystallized texture that the size of crystal grains in the inner area of the conductor is large and that of in the surface area thereof is smaller than that of the inner area, wherein both sides of the conductor are sandwiched between insulating films.

摘要翻译： 本发明提供一种具有高导电性和高弯曲耐久性的柔性扁平电缆及其制造方法。 本发明是一种柔性扁平电缆，其包括施加在导体上的导体和绝缘膜，其中导体由至少一种选自镁（Mg），锆（Zr），铌（Nb）， 钙（Ca），钒（V），镍（Ni），锰（Mn），钛（Ti）和铬（Cr） 2质量ppm以上的氧气; 余量是不可避免的杂质和铜，其中导体具有这样的再结晶织构，导体的内部区域中的晶粒尺寸大，表面积的晶粒尺寸小于内部区域的晶粒尺寸，其中 导体的两侧夹在绝缘膜之间。

公开(公告)号：US20130042949A1

公开(公告)日：2013-02-21

申请号：US13571781

申请日：2012-08-10

申请人： Hideyuki Sagawa ,  Seigi Aoyama ,  Hiromitsu Kuroda ,  Toru Sumi ,  Keisuke Fujito ,  Ryohei Okada ,  Shinichi Masui

发明人： Hideyuki Sagawa ,  Seigi Aoyama ,  Hiromitsu Kuroda ,  Toru Sumi ,  Keisuke Fujito ,  Ryohei Okada ,  Shinichi Masui

IPC分类号： C22F1/08 ,  B21D31/00

CPC分类号： C22F1/08 ,  B21C1/003 ,  C22C9/00 ,  H01B1/026 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45611 ,  H01L2224/45618 ,  H01L2224/45639 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/01022 ,  H01L2924/01012 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01025 ,  H01L2924/01024 ,  H01L2924/01016 ,  H01L2924/01008 ,  H01L2924/01205

摘要： A method of manufacturing a soft-dilute-copper-alloy material includes a plastic working of a soft-dilute-copper-alloy including an additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn and Cr, and a balance consisting of copper and inevitable impurity, and a subsequent annealing treatment of the soft-dilute-copper-alloy. A working ratio in the plastic working before the annealing treatment is not less than 50%.

摘要翻译： 软 - 稀铜合金材料的制造方法包括：软 - 稀铜合金的塑性加工，其包含选自Ti，Mg，Zr，Nb，Ca，V，Ni， Mn和Cr，余量由铜和不可避免的杂质组成，以及随后的软 - 稀铜铜合金的退火处理。 退火处理前塑料加工的加工率不小于50％。