摘要:
The memory cell is located at respective intersections between the first wirings and the second wirings. Each of the memory cells has a rectifier element and a variable resistance element connected in series. The rectifier element includes a p type first semiconductor region, and a n type second semiconductor region. The first semiconductor region is formed of, at least in part, silicon-germanium mixture (Si1-xGex (0
摘要:
The memory cell is located at respective intersections between the first wirings and the second wirings. Each of the memory cells has a rectifier element and a variable resistance element connected in series. The rectifier element includes a p type first semiconductor region, and a n type second semiconductor region. The first semiconductor region is formed of, at least in part, silicon-germanium mixture (Sii-xGex (0
摘要:
A method for manufacturing a semiconductor device includes forming a copper anti-diffusion film on a copper trench wiring layer, and forming an opening portion in the copper anti-diffusion film by laser ablation, the opening portion being formed in a region corresponding to an alignment region used for lithography process for forming an aluminum wiring on the copper trench wiring layer.
摘要:
A process for producing a conjugated diolefinic polymer by polymerizing at least one conjugated diolefin or copolymerizing at least one conjugated diolefin with at least one vinyl aromatic hydrocarbon in a hydrocarbon solvent in the presence of an alfin catalyst and at least one molecular weight regulator selected from the group consisting of (A) unsaturated halohydrocarbons represented by the general formula, RCX .dbd. CYZ, wherein R represents hydrogen, an alkyl group having 1 to 7 carbon atoms, a vinyl group, a phenyl group, a substituted phenyl group, or a halogen atom and X, Y and Z represent independently a hydrogen or halogen atom, at least one of said R, X, Y and Z being a halogen atom, (B) halogenated aromatic hydrocarbons, (C) ethers, polyethers, and acetals and (D) tertiary amines and, if necessary, a dihydro aromatic hydrocarbon, characterized in that said polymerization or copolymerization is effected in the presence of 0.03 to 0.9 mole of water and/or an alcohol per mole of organosodium contained in said alfin catalyst. According to this invention, there is obtained a polymer or copolymer excellent in green strength and processability of the unvulcanized compound and in physical properties of the vulcanizate.
摘要:
According to one embodiment, a method for manufacturing a memory device is disclosed. The method includes forming a silicon diode. At least an upper portion of the silicon diode is made of a semiconductor material containing silicon and doped with impurity. The method includes forming a metal layer made of a metal on the silicon diode. The method includes forming a metal nitride layer made of a nitride of the metal on the metal layer. The method includes forming a resistance change film. In addition, the method includes reacting the metal layer with the silicon diode and the metal nitride layer by heat treatment to form an electrode film containing the metal, silicon, and nitrogen.
摘要:
A communication terminal device includes a first display part configured to display streaming sub information, a second display part configured to display streaming main information related to the streaming sub information, a sub information reception unit configured to receive the streaming sub information sequentially transmitted from an information providing device and to display the received streaming sub information on the first display part, a request transmission unit configured to transmit to the information providing device an information request signal for requesting the streaming main information related to the streaming sub information displayed on the first display part, and a main information reception unit configured to receive the streaming main information and to display the streaming main information on the second display part.
摘要:
According to one embodiment, a semiconductor memory device includes a word line interconnection layer, a bit line interconnection layer and a pillar. The word line interconnection layer includes a plurality of word lines which extend in a first direction. The bit line interconnection layer includes a plurality of bit lines which extend in a second direction crossing over the first direction. The pillar is arranged between each of the word lines and each of the bit lines. The pillar includes a silicon diode and a variable resistance film, and the silicon diode includes a p-type portion and an n-type portion. The word line interconnection layer and the bit line interconnection layer are alternately stacked, and a compressive force is applied to the silicon diode in a direction in which the p-type portion and the n-type portion become closer to each other.
摘要:
According to one embodiment, a semiconductor device includes a plurality of silicon films. The plurality of silicon films are disposed on one plane and are made of polysilicon containing an impurity. A crystal orientation of each of the silicon films is a (311) orientation.
摘要:
According to one embodiment, a semiconductor device includes a plurality of silicon films. The plurality of silicon films are disposed on one plane and are made of polysilicon containing an impurity. A crystal orientation of each of the silicon films is a (311) orientation.
摘要:
According to one embodiment, a nonvolatile memory device includes a word line interconnect layer, a bit line interconnect layer, a pillar, and charge bearing members. The word line interconnect layer includes a plurality of word lines extending in a first direction. The bit line interconnect layer includes a plurality of bit lines extending in a second direction that intersects the first direction. The pillar is disposed between each of the word lines and each of the bit lines. The charge bearing members contain a negative fixed charge, and provided on side faces of the pillars. The pillars includes a diode film provided with a p-type layer and an n-type layer and a variable resistance film stacked on the diode film. The charge bearing member is disposed on side faces of the p-type layer, and is not disposed on side faces of the n-type layer.