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公开(公告)号:US4452154A
公开(公告)日:1984-06-05
申请号:US347267
申请日:1982-02-09
申请人: Hiroshi Kono , Haruhiko Asao
发明人: Hiroshi Kono , Haruhiko Asao
CPC分类号: B29B17/04 , C10B1/04 , C10B53/07 , B29B2017/0496 , B29L2030/00 , Y02P20/143 , Y02W30/625
摘要: Discarded rubber tires are charged in random state into a vertical dry distillation furnace, and the tires at a lower part thereof are caused to undergo combustion to give off hot combustion gases by which the tires at higher levels undergo dry distillation to produce distillation gases which are useable as fuel. The combustion is started by burners and is then self-sustained by supplying only air. The furnace interior at its part below the combustion zone is expanded or flared in the downward direction to an open end immersed in water, but the downward movement of the tires and residue is braked by a self-sustained grate effect until the residue finally drops out of the furnace to be removed by a conveyor. The continuous and efficient operation over a long period of this furnace is assisted by a separator also capable of long continuous operation.
摘要翻译: 将废弃的橡胶轮胎以随机状态装入立式干馏炉中,并使其下部的轮胎进行燃烧以产生热燃烧气体,通过该燃烧气体,较高级别的轮胎经历干馏以产生蒸馏气体,其为 可用作燃料。 燃烧由燃烧器启动,然后通过仅供应空气自我维持。 燃烧区下方的炉内部向下扩展或向下扩展至浸入水中的开放端,但轮胎和残渣的向下运动由自持式炉排作用制动,直到残渣最终脱落 的炉子被输送机除去。 长时间连续高效运行的炉子由能够长时间连续运行的分离器辅助。
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公开(公告)号:US4711433A
公开(公告)日:1987-12-08
申请号:US873784
申请日:1986-06-12
申请人: Motoo Goto , Hiroshi Kono , Haruhiko Asao , Yukio Miyamoto , Toshihiko Igarashi
发明人: Motoo Goto , Hiroshi Kono , Haruhiko Asao , Yukio Miyamoto , Toshihiko Igarashi
CPC分类号: C22B15/0041
摘要: A copper converter which includes: a converter body; a plurality of tuyeres disposed to the converter body, each tuyere having an outer end portion; a first concentrate blowing pipe assembly disposed at least one of said tuyeres, the concentrate blowing pipe assembly including an introducing pipe inserted into the at least one tuyere; a blowing unit, connected to the concentrate blowing pipe assembly, for blowing a material including a concentrate through the introducing pipe into the converter; an air supplying unit, disposed to the tuyeres, for supplying pressurized air to the tuyeres; and formations, disposed to said outer end of each tuyere and said concentrate blowing pipe assembly, for detachably interlocking the introducing pipe with the at least one tuyere.
摘要翻译: 一种铜转换器,包括:转换器主体; 多个风口设置在转换器主体上,每个风口具有外端部分; 设置有至少一个所述风口的第一浓缩吹管组件,所述浓缩吹送管组件包括插入所述至少一个风口中的导入管; 吹送单元,连接到浓缩物吹送管组件,用于通过引入管将包含浓缩物的材料吹入转化器; 空气供应单元,设置在风嘴上,用于向风嘴供应加压空气; 和形成物,设置在每个风口的所述外端和所述浓缩物吹送管组件上,用于将引入管与所述至少一个风口可拆卸地互锁。
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公开(公告)号:US08354715B2
公开(公告)日:2013-01-15
申请号:US12873749
申请日:2010-09-01
申请人: Hiroshi Kono , Takashi Shinohe
发明人: Hiroshi Kono , Takashi Shinohe
CPC分类号: H01L21/04 , H01L29/0619 , H01L29/0834 , H01L29/0839 , H01L29/1608 , H01L29/66068 , H01L29/7395 , H01L29/7802
摘要: According to the embodiments, a semiconductor device using SiC and having a high breakdown voltage, a low on-resistance, and excellent reliability is provided. The semiconductor device includes a silicon carbide substrate having first and second main surfaces; a first silicon carbide layer of a first conductive type provided on the first main surface of the silicon carbide substrate; first silicon carbide regions of a second conductive type formed on a surface of the first silicon carbide layer; second silicon carbide regions of the first conductive type formed on respective surfaces of the first silicon carbide regions; third silicon carbide regions of the second conductive type formed on the respective surfaces of the first silicon carbide regions; a fourth silicon carbide region of the second conductive type formed between the facing first silicon carbide regions with the first silicon carbide layer therebetween; a gate insulating film formed continuously on surfaces of the first silicon carbide regions, the first silicon carbide layer, and the fourth silicon carbide region; a gate electrode formed on the gate insulating film; an interlayer insulating film which covers the gate electrode; a first electrode which is electrically connected to the second silicon carbide regions and the third silicon carbide regions; and a second electrode formed on the second main surface of the silicon carbide substrate.
摘要翻译: 根据实施例,提供了使用SiC并具有高击穿电压,低导通电阻和优异的可靠性的半导体器件。 半导体器件包括具有第一和第二主表面的碳化硅衬底; 设置在所述碳化硅衬底的所述第一主表面上的第一导电类型的第一碳化硅层; 形成在第一碳化硅层的表面上的第二导电类型的第一碳化硅区域; 形成在第一碳化硅区域的各个表面上的第一导电类型的第二碳化硅区域; 形成在第一碳化硅区域的各个表面上的第二导电类型的第三碳化硅区域; 形成在面对的第一碳化硅区域之间的第二导电类型的第四碳化硅区域,其间具有第一碳化硅层; 在第一碳化硅区域,第一碳化硅层和第四碳化硅区域的表面上连续形成的栅极绝缘膜; 形成在栅极绝缘膜上的栅电极; 覆盖栅电极的层间绝缘膜; 电连接到第二碳化硅区域和第三碳化硅区域的第一电极; 以及形成在碳化硅衬底的第二主表面上的第二电极。
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公开(公告)号:US20120056195A1
公开(公告)日:2012-03-08
申请号:US13034264
申请日:2011-02-24
申请人: Hiroshi Kono , Takashi Shinohe , Chiharu Ota , Makoto Mizukami , Takuma Suzuki , Johji Nishio
发明人: Hiroshi Kono , Takashi Shinohe , Chiharu Ota , Makoto Mizukami , Takuma Suzuki , Johji Nishio
IPC分类号: H01L29/161
CPC分类号: H01L29/7395 , H01L29/1033 , H01L29/66333
摘要: One embodiment of a semiconductor device includes: a silicon carbide substrate including first and second principal surfaces; a first-conductive-type silicon carbide layer on the first principal surface; a second-conductive-type first silicon carbide region at a surface of the first silicon carbide layer; a first-conductive-type second silicon carbide region at the surface of the first silicon carbide region; a second-conductive-type third silicon carbide region at the surface of the first silicon carbide region; a second-conductive-type fourth silicon carbide region formed between the first silicon carbide region and the second silicon carbide region, and having an impurity concentration higher than that of the first silicon carbide region; a gate insulator; a gate electrode formed on the gate insulator; an inter-layer insulator; a first electrode connected to the second silicon carbide region and the third silicon carbide region; and a second electrode on the second principal surface.
摘要翻译: 半导体器件的一个实施例包括:包含第一和第二主表面的碳化硅衬底; 第一主表面上的第一导电型碳化硅层; 在所述第一碳化硅层的表面处的第二导电型第一碳化硅区域; 在第一碳化硅区域的表面处的第一导电型第二碳化硅区域; 在第一碳化硅区域的表面处的第二导电型第三碳化硅区域; 在第一碳化硅区域和第二碳化硅区域之间形成的杂质浓度高于第一碳化硅区域的第二导电型第四碳化硅区域; 栅极绝缘体; 形成在栅绝缘体上的栅电极; 层间绝缘体; 连接到所述第二碳化硅区域和所述第三碳化硅区域的第一电极; 和在第二主表面上的第二电极。
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公开(公告)号:US20110059597A1
公开(公告)日:2011-03-10
申请号:US12716403
申请日:2010-03-03
申请人: Johji Nishio , Chiharu Ota , Takuma Suzuki , Hiroshi Kono , Makoto Mizukami , Takashi Shinohe
发明人: Johji Nishio , Chiharu Ota , Takuma Suzuki , Hiroshi Kono , Makoto Mizukami , Takashi Shinohe
IPC分类号: H01L21/20
CPC分类号: H01L29/7802 , H01L21/02378 , H01L21/02433 , H01L21/02529 , H01L21/02658 , H01L21/0495 , H01L21/30604 , H01L29/0878 , H01L29/1608 , H01L29/66068 , H01L29/66143 , H01L29/872 , H01L2924/0002 , H01L2924/00
摘要: A method of manufacturing a semiconductor device capable of realizing a high yield of a large-scale semiconductor device even when a silicon carbide semiconductor including a defect is used is provided. The method of manufacturing a semiconductor device includes: a step of epitaxially growing a silicon carbide semiconductor layer on a silicon carbide semiconductor substrate; a step of polishing a surface of the silicon carbide semiconductor layer; a step of ion-implanting impurities into the silicon carbide semiconductor layer after the step of polishing; a step of performing heat treatment to activate the impurities; a step of forming a first thermal oxide film on the surface of the silicon carbide semiconductor layer after the step of performing heat treatment; a step of chemically removing the first thermal oxide film; and a step of forming an electrode layer on the silicon carbide semiconductor film.
摘要翻译: 提供了即使当使用包括缺陷的碳化硅半导体时也能够实现大规模半导体器件的高产率的半导体器件的制造方法。 制造半导体器件的方法包括:在碳化硅半导体衬底上外延生长碳化硅半导体层的步骤; 抛光所述碳化硅半导体层的表面的步骤; 在抛光步骤之后将杂质离子注入到碳化硅半导体层中的步骤; 进行热处理以活化杂质的步骤; 在进行热处理的步骤之后,在碳化硅半导体层的表面上形成第一热氧化膜的工序; 化学去除第一热氧化膜的步骤; 以及在所述碳化硅半导体膜上形成电极层的步骤。
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公开(公告)号:US08835288B2
公开(公告)日:2014-09-16
申请号:US13407249
申请日:2012-02-28
申请人: Johji Nishio , Masaru Furukawa , Hiroshi Kono , Takashi Shinohe
发明人: Johji Nishio , Masaru Furukawa , Hiroshi Kono , Takashi Shinohe
IPC分类号: H01L21/265 , H01L21/425 , H01L21/04 , H01L29/66 , H01L29/861 , H01L29/872 , H01L29/78 , H01L29/06 , H01L29/16
CPC分类号: H01L21/046 , H01L21/045 , H01L21/049 , H01L29/0615 , H01L29/0619 , H01L29/0661 , H01L29/1608 , H01L29/6606 , H01L29/66068 , H01L29/7802 , H01L29/8613 , H01L29/872
摘要: A method of manufacturing a silicon carbide semiconductor device of an embodiment includes: implanting ions in a silicon carbide substrate; performing first heating processing of the silicon carbide substrate in which the ions are implanted; and performing second heating processing of the silicon carbide substrate for which the first heating processing is performed, at a temperature lower than the first heating processing.
摘要翻译: 制造实施例的碳化硅半导体器件的方法包括:将离子注入碳化硅衬底中; 对其中注入离子的碳化硅衬底进行第一加热处理; 在低于第一加热处理的温度下进行进行了第一加热处理的碳化硅基板的第二加热处理。
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公开(公告)号:US08686436B2
公开(公告)日:2014-04-01
申请号:US13600532
申请日:2012-08-31
申请人: Hiroshi Kono , Takashi Shinohe , Takuma Suzuki , Johji Nishio
发明人: Hiroshi Kono , Takashi Shinohe , Takuma Suzuki , Johji Nishio
IPC分类号: H01L29/16
CPC分类号: H01L29/1608 , H01L29/0696 , H01L29/086 , H01L29/1045 , H01L29/1095 , H01L29/7395 , H01L29/7802
摘要: According to one embodiment, a semiconductor device includes a first semiconductor region, a second semiconductor region, a third semiconductor region, a fourth semiconductor region, an insulating film, a control electrode, a first electrode, and a second electrode. The first semiconductor region includes silicon carbide, and has a first portion. The second semiconductor region is provided on the first semiconductor region, and includes silicon carbide. The third semiconductor region and the fourth semiconductor region are provided on the second semiconductor region, and includes silicon carbide. The electrode is provided on the film. The second semiconductor region has a first region and a second region. The first region contacts with the third semiconductor region and the fourth semiconductor region. The second region contacts with the first portion. The impurity concentration of the first region is higher than an impurity concentration of the second region.
摘要翻译: 根据一个实施例,半导体器件包括第一半导体区域,第二半导体区域,第三半导体区域,第四半导体区域,绝缘膜,控制电极,第一电极和第二电极。 第一半导体区域包括碳化硅,并且具有第一部分。 第二半导体区域设置在第一半导体区域上,并且包括碳化硅。 第三半导体区域和第四半导体区域设置在第二半导体区域上,并且包括碳化硅。 电极设在膜上。 第二半导体区域具有第一区域和第二区域。 第一区域与第三半导体区域和第四半导体区域接触。 第二区域与第一部分接触。 第一区域的杂质浓度高于第二区域的杂质浓度。
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公开(公告)号:USD672323S1
公开(公告)日:2012-12-11
申请号:US29399128
申请日:2011-08-09
申请人: Hiroshi Kono
设计人: Hiroshi Kono
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公开(公告)号:US08155852B2
公开(公告)日:2012-04-10
申请号:US12095406
申请日:2006-12-21
IPC分类号: G06F19/00 , G06F7/70 , B60T8/24 , B60T8/1761 , B60T8/1764
CPC分类号: B60T8/17552 , B60T2230/02 , B60W10/04 , B60W10/10 , B60W10/184 , B60W10/20 , B60W50/06 , B60W2050/0012 , B60W2050/0028 , B60W2050/0033 , B60W2050/0034 , B60Y2200/12
摘要: A driving/braking force manipulation control input of a k-th wheel, which denotes one or more specific wheels among a plurality of wheels of a vehicle, is determined such that a required condition concerning a relationship among a road surface reaction force that may act from a road surface on the k-th wheel on the basis of the detected values or estimated values of a side slip angle and a friction characteristic of the k-th wheel, a feedback control input related to the driving/braking force of the k-th wheel for bringing a difference between a state amount of the vehicle and a reference state amount close to zero, a driving/braking force feedforward control input based on a drive manipulated variable supplied by a driver of the vehicle, and a k-th wheel driving/braking force manipulation control input is satisfied. This arrangement makes it possible to properly control a motion of an actual vehicle to a desired motion while properly considering the characteristics of a road surface reaction force acting from a road surface on a wheel.
摘要翻译: 确定表示车辆的多个车轮中的一个以上的特定车轮的第k个车轮的驾驶/制动力操纵控制输入,使得能够起作用的路面反作用力之间的关系的要求条件 基于第k轮的侧滑角和摩擦特性的检测值或估计值从第k轮的路面,与k的驱动/制动力相关的反馈控制输入 用于使车辆的状态量与接近零的基准状态量之间的差异,基于由车辆的驾驶员提供的驱动操作量的驱动/制动力前馈控制输入和第k 轮驱动/制动力操纵控制输入被满足。 这种布置使得可以适当地考虑从车轮上的路面起作用的路面反作用力的特性来适当地控制实际车辆的运动到期望的运动。
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公开(公告)号:US08024091B2
公开(公告)日:2011-09-20
申请号:US12095397
申请日:2006-12-21
IPC分类号: B60T8/58
CPC分类号: B62D6/003 , B60T8/1755 , B60T2270/86 , B60W10/04 , B60W10/10 , B60W10/18 , B60W50/06 , B60W2050/0028 , B60W2050/0033 , B60W2050/0034 , B60Y2200/12
摘要: An FB distribution rule 20 determines an actual vehicle actuator operation control input and a vehicle model operation control input such that a difference between a reference state amount determined by a vehicle model 16 and an actual state amount of an actual vehicle 1 (a state amount error) approximates to zero, and the control inputs are used to operate an actuator device 3 of the actual vehicle 1 and the vehicle model 16. In the FB distribution law 20, when an actual vehicle feedback required amount based on the state amount error exists in a dead zone, then an actual vehicle actuator operation control input is determined by using the required amount as a predetermined value. A vehicle model manipulated variable control input is determined such that a state amount error is brought close to zero, independently of whether an actual vehicle feedback required amount exists in a dead zone. This enhances linearity of a control system and also enhances the robustness against disturbance factors or changes therein while carrying out operation control of an actuator that suits a behavior of an actual vehicle as much as possible.
摘要翻译: FB分配规则20确定实际车辆致动器操作控制输入和车辆模型操作控制输入,使得由车辆型号16确定的基准状态量与实际车辆1的实际状态量之间的差(状态量误差 )近似为零,并且控制输入用于操作实际车辆1和车辆模型16的致动器装置3.在FB分配规则20中,当基于状态量误差的实际车辆反馈所需量存在于 死区,则通过使用所需量作为预定值来确定实际车辆致动器操作控制输入。 确定车辆模型操纵变量控制输入,使得状态量误差接近于零,而与在死区中是否存在实际车辆反馈需求量无关。 这提高了控制系统的线性度,并且在尽可能地执行适合实际车辆的行为的致动器的操作控制的同时,增强了抗干扰因素或其变化的鲁棒性。
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