公开(公告)号：US09350078B2

公开(公告)日：2016-05-24

申请号：US13513827

申请日：2010-12-06

申请人： Noriaki Ando ,  Hiroshi Toyao

发明人： Noriaki Ando ,  Hiroshi Toyao

IPC分类号： H01Q1/38 ,  H01Q9/04 ,  H01Q21/08

CPC分类号： H01Q9/0407 ,  H01L2224/16227 ,  H01Q21/08

摘要： A structure of the present disclosure is provided with a first conductor element (11), a conductor pattern (19) facing the first conductor element (11). In the conductor pattern (19), a part opposed to the first conductor element (11) includes a line part (14) with an open end (141), an opening (13) partially surrounding the line part (14) and a second conductor element (12) surrounding the opening (13) and being continuous to the line part (14). The first conductor element (11) and the line part (14) make up a microstrip line (16).

摘要翻译： 本公开的结构设置有第一导体元件（11），面向第一导体元件（11）的导体图案（19）。 在导体图案（19）中，与第一导体元件（11）相对的部分包括具有开口端（141）的线部分（14），部分围绕线部分（14）的开口（13） 导体元件（12）围绕开口（13）并且与线部分（14）连续。 第一导体元件（11）和线部分（14）构成微带线（16）。

公开(公告)号：US09084351B2

公开(公告)日：2015-07-14

申请号：US13583277

申请日：2011-02-18

申请人： Hiroshi Toyao ,  Naoki Kobayashi ,  Noriaki Ando

发明人： Hiroshi Toyao ,  Naoki Kobayashi ,  Noriaki Ando

IPC分类号： H04B3/28 ,  H05K1/02 ,  H01P3/00

CPC分类号： H05K1/0236 ,  H01P3/00 ,  H05K1/0298

摘要： A structure (10) includes a conductor (151), conductors (111, 131) that are located on the same side with respect to the conductor (151), that are opposed to at least a part of the conductor (151), and that overlap each other when seen in a plan view, a connection member (101) that penetrates the conductors (111, 131, 151), that is connected to the conductor (151), and that is insulated from the conductors (111, 131), openings (112, 132) that are formed in the conductors (111, 131), respectively, and which the connection member (101) passes through, and conductor elements (121, 141) that are formed to be opposed to the openings (112, 132), that are connected to the connection member (101) passing through the openings (112, 132), and that are larger than the openings (112, 132). The number of layers in which the conductor elements (121, 141) are located is two or more and less than or equal to the number of layers in which the conductors (111, 131) are located.

摘要翻译： 结构（10）包括导体（151），相对于导体（151）位于同一侧的与导体（151）的至少一部分相对的导体（111,131），以及 在平面图中看到彼此重叠的连接构件（101），其连接到与导体（151）连接并且与导体（111,131）绝缘的导体（111,131,151） ），分别形成在导体（111,131）中并且连接构件（101）通过的开口（112,132）以及形成为与开口相对的导体元件（121,141） （112,132），其连接到穿过所述开口（112,132）的所述连接构件（101），并且大于所述开口（112,132）。 导体元件（121,141）所在的层数为两个以上且小于等于导体（111,131）所在的层数。

公开(公告)号：US09065891B2

公开(公告)日：2015-06-23

申请号：US13576192

申请日：2011-03-25

申请人： Masanori Sakurai ,  Naoki Kobayashi ,  Noriaki Ando ,  Hiroshi Toyao ,  Masaharu Imazato

发明人： Masanori Sakurai ,  Naoki Kobayashi ,  Noriaki Ando ,  Hiroshi Toyao ,  Masaharu Imazato

IPC分类号： H01Q1/24 ,  H01Q19/06 ,  H01Q19/10 ,  H04M1/02 ,  H01Q15/00

CPC分类号： H01Q15/0086 ,  H01Q1/243 ,  H04M1/0214 ,  H04M1/0235 ,  H04M1/0241

摘要： A radio communication apparatus includes: a first casing; a second casing; a connection section that connects the first and second casings to each other to be movable; and an antenna device that operates at a predetermined communication frequency. In the radio communication apparatus, first and second states are switched between by relatively moving the first and second casings. The first state is a state in which the first and second casings are opened or closed with respect to one another, and a first conductor (122) installed from the connection section to the first casing and a second conductor (240) installed from the connection section to the second casing are separated and faced each other. In the first state, the first conductor (122) and the second conductor (240) are electrically connected to each other at the communication frequency. The second state is a state in which the first and second casings are closed or opened with respect to one another.

摘要翻译： 无线通信装置包括：第一壳体; 第二套 连接部，其将第一和第二壳体彼此连接成可移动; 以及以预定通信频率操作的天线装置。 在无线电通信装置中，通过相对移动第一和第二壳体来切换第一和第二状态。 第一状态是第一和第二壳体相对于彼此打开或关闭的状态，以及从连接部分安装到第一壳体的第一导体（122）和从连接部分安装的第二导体（240） 第二壳体的截面分离并面对彼此。 在第一状态下，第一导体（122）和第二导体（240）以通信频率彼此电连接。 第二状态是第一和第二壳体相对于彼此闭合或打开的状态。

公开(公告)号：US08952266B2

公开(公告)日：2015-02-10

申请号：US13813632

申请日：2011-08-26

申请人： Hiroshi Toyao

发明人： Hiroshi Toyao

IPC分类号： H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H04B3/28 ,  H01P3/08 ,  H05K1/14 ,  H05K1/02 ,  H01P1/20 ,  H01Q15/00 ,  H05K1/16

CPC分类号： H05K1/0296 ,  H01P1/2005 ,  H01P3/085 ,  H01Q15/006 ,  H01Q15/0086 ,  H05K1/0236 ,  H05K1/165 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09972

摘要： A structural body includes: a first conductor and a second conductor of which at least portions are opposite to each other; a third conductor, interposed between the first conductor and the second conductor, of which at least a portion is opposite to the first conductor and the second conductor, and has a first opening; an interconnect provided in the inside of the first opening; and a conductor via which is electrically connected to the first conductor and the second conductor and is electrically insulated from the third conductor, wherein the interconnect is opposite to the first conductor and the second conductor, one end thereof being electrically connected to the third conductor at an edge of the first opening and an other end thereof being formed as an open end.

摘要翻译： 结构体包括：至少部分彼此相对的第一导体和第二导体; 第三导体，插入在第一导体和第二导体之间，其中至少一部分与第一导体和第二导体相对，并具有第一开口; 设置在所述第一开口的内部的互连; 以及导体，其经由其电连接到第一导体和第二导体并与第三导体电绝缘，其中互连与第一导体和第二导体相对，其一端与第三导体电连接 第一开口的边缘和其另一端形成为开口端。

公开(公告)号：US08922455B2

公开(公告)日：2014-12-30

申请号：US13700960

申请日：2011-06-02

申请人： Hiroshi Toyao ,  Noriaki Ando

发明人： Hiroshi Toyao ,  Noriaki Ando

IPC分类号： H01Q1/00 ,  H01Q15/02 ,  H05K1/02 ,  H01Q13/28 ,  H05K1/16

CPC分类号： H01Q13/28 ,  H05K1/0236 ,  H05K1/024 ,  H05K1/165 ,  H05K2201/0141

摘要： A plurality of second conductors (200) are opposite to a first conductor (100), and are repeatedly, for example, periodically arranged. Third conductors (410) are provided at a position opposite to each of the plurality of second conductors (200). A variable dielectric constant layer is formed of a variable dielectric constant material of which the dielectric constant varies with a voltage, for example, a liquid crystal, and is provided at least one of between the plurality of second conductors (200) and the plurality of third conductors (410) and between the plurality of second conductors (200) and the first conductor (100). A fourth conductor (300) is connected to a first one of the second conductors (200) and a second one of the second conductors (200) located next thereto through a via (500). The fourth conductor (300) is opposite to the second conductor (200), and thus forms a transmission line using the second conductor (200) as a return path.

摘要翻译： 多个第二导体（200）与第一导体（100）相对，并且例如重复地周期性布置。 第三导体（410）设置在与多个第二导体（200）中的每一个相对的位置处。 可变介电常数层由介电常数随电压例如液晶变化的可变介电常数材料形成，并且设置在多个第二导体（200）和多个第二导体 第三导体（410）和多个第二导体（200）和第一导体（100）之间。 第四导体（300）通过通孔（500）连接到第二导体（200）中的第一导体和第二导体（200）中的第二导体（200）。 第四导体（300）与第二导体（200）相对，从而形成使用第二导体（200）作为返回路径的传输线。

公开(公告)号：US08873246B2

公开(公告)日：2014-10-28

申请号：US13583884

申请日：2011-02-18

申请人： Hiroshi Toyao ,  Manabu Kusumoto ,  Naoki Kobayashi ,  Noriaki Ando

发明人： Hiroshi Toyao ,  Manabu Kusumoto ,  Naoki Kobayashi ,  Noriaki Ando

IPC分类号： H05K7/00 ,  H05K1/16 ,  H05K1/02 ,  H05K1/11

CPC分类号： H05K1/0236 ,  H05K1/0218 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/116 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09618 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/0979 ,  H05K2201/10371 ,  H05K2201/10674

摘要： A wiring board includes a metal cap pad that is arranged so as to surround a mounting position of an electronic component and is connected to an end portion of a metal cap, a power source plane that is connected to the electronic component through a connection member and has a gap, a ground plane that is connected to the electronic component through a connection member, and a plurality of conductive body elements that are repeatedly arranged so as to surround the connection members and the gap. The power source plane and the ground plane extend so as to include at least a part of an area that is surrounded by the plurality of conductive body elements and at least a part of an area facing the plurality of conductive body elements.

摘要翻译： 布线基板包括金属盖焊盘，其被设置为围绕电子部件的安装位置并且连接到金属盖的端部，电源平面，其通过连接构件连接到电子部件， 具有间隙，通过连接构件连接到电子部件的接地平面，以及重复地布置成围绕连接构件和间隙的多个导电体元件。 电源平面和接地平面延伸成包括由多个导电体元件围绕的区域的至少一部分和面向多个导电体元件的区域的至少一部分。

公开(公告)号：US20130143445A1

公开(公告)日：2013-06-06

申请号：US13816703

申请日：2011-05-25

申请人： Masashi Kawakami ,  Hiroshi Toyao

发明人： Masashi Kawakami ,  Hiroshi Toyao

IPC分类号： H05K5/00

CPC分类号： H05K1/0216 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H05K1/0224 ,  H05K1/0236 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/165 ,  H05K1/181 ,  H05K5/0091 ,  H01L2224/0401

摘要： Provided is an interconnect substrate that includes a laminated body including an electric conductor and an insulator, over which an electronic element (141) is disposed, wherein the laminated body includes a first layer (130) having at least one first conductor (131) separated in an island shape, a first connecting member (142) which is buried in the laminated body in order to electrically connect the electronic element (141) and the first conductor (131), a second layer (110) having a third conductor (111) which is provided opposite to at least a partial region of the first conductor (131), a second conductor (122) which is provided opposite to at least one of the first conductor (131) and the third conductor (111) with a layer of an insulator interposed therebetween, wherein when the laminated body is seen in a plan view, the second conductor (122) is located at a region less than a quarter of a wavelength occurring at a frequency of noise propagated from the electronic element (141) to the first conductor (131), from an end of the first conductor (131).

摘要翻译： 提供了一种互连基板，其包括具有电导体和绝缘体的层叠体，在该绝缘体上设置有电子元件（141），其中所述层叠体包括第一层（130），所述第一层具有至少一个第一导体（131） 为岛状，为了使电子元件（141）和第一导体（131）电连接而埋设在层叠体中的第一连接部件（142），具有第三导体（111）的第二层（110） ）与第一导体（131）的至少一部分区域相对设置，第二导体（122）与第一导体（131）和第三导体（111）中的至少一个相对设置，层 插入其间的绝缘体，其中当在平面图中看到层叠体时，第二导体（122）位于小于发射在从电子元件（141）传播的噪声频率处的波长的四分之一的区域 ）从第一导体（131）的端部到第一导体（131）。

公开(公告)号：US20130069848A1

公开(公告)日：2013-03-21

申请号：US13700960

申请日：2011-06-02

申请人： Hiroshi Toyao ,  Noriaki Ando

发明人： Hiroshi Toyao ,  Noriaki Ando

IPC分类号： H01Q1/00

CPC分类号： H01Q13/28 ,  H05K1/0236 ,  H05K1/024 ,  H05K1/165 ,  H05K2201/0141

摘要： A plurality of second conductors (200) are opposite to a first conductor (100), and are repeatedly, for example, periodically arranged. Third conductors (410) are provided at a position opposite to each of the plurality of second conductors (200). A variable dielectric constant layer is formed of a variable dielectric constant material of which the dielectric constant varies with a voltage, for example, a liquid crystal, and is provided at least one of between the plurality of second conductors (200) and the plurality of third conductors (410) and between the plurality of second conductors (200) and the first conductor (100). A fourth conductor (300) is connected to a first one of the second conductors (200) and a second one of the second conductors (200) located next thereto through a via (500). The fourth conductor (300) is opposite to the second conductor (200), and thus forms a transmission line using the second conductor (200) as a return path.

摘要翻译： 多个第二导体（200）与第一导体（100）相对，并且例如重复地周期性布置。 第三导体（410）设置在与多个第二导体（200）中的每一个相对的位置处。 可变介电常数层由介电常数随电压例如液晶变化的可变介电常数材料形成，并且设置在多个第二导体（200）和多个第二导体 第三导体（410）和多个第二导体（200）和第一导体（100）之间。 第四导体（300）通过通孔（500）连接到第二导体（200）中的第一导体和第二导体（200）中的第二导体（200）。 第四导体（300）与第二导体（200）相对，从而形成使用第二导体（200）作为返回路径的传输线。

公开(公告)号：US20120032865A1

公开(公告)日：2012-02-09

申请号：US13254326

申请日：2010-04-23

申请人： Hiroshi Toyao ,  Noriaki Ando

发明人： Hiroshi Toyao ,  Noriaki Ando

IPC分类号： H01Q1/38 ,  H01Q21/00 ,  H01Q19/10 ,  H01P3/08

CPC分类号： H01P1/2005 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/15192 ,  H01P3/08 ,  H01Q9/42 ,  H01Q15/008 ,  H01Q15/0086 ,  H01Q15/14 ,  H01Q21/065 ,  H05K1/0236 ,  H05K1/036 ,  H05K1/165 ,  H05K2201/0191 ,  H05K2201/09318

摘要： A structural body of the invention includes a first conductor plane (1), a plurality of second conductor planes (4) of which at least a portion is provided facing the first conductor plane (1), and a transmission line (6), having an open end, which is disposed between the first conductor plane (1) and the second conductor plane (4), electrically connected to any one conductor plane of the first conductor plane (1) or the second conductor plane (4) through a conductor connection portion (5) and provided facing the other conductor plane. A unit structure including at least the second conductor plane (4), the transmission line (6), and the conductor connection portion (5) is repeatedly disposed.

摘要翻译： 本发明的结构体包括第一导体平面（1），多个第二导体平面（4），其至少部分设置成面对第一导体平面（1），以及传输线（6），其具有 布置在第一导体平面（1）和第二导体平面（4）之间的开口端通过导线与第一导体平面（1）或第二导体平面（4）的任何一个导体平面电连接 连接部分（5）并面向另一个导体平面设置。 重复设置至少包括第二导体平面（4），传输线（6）和导体连接部分（5）的单元结构。

公开(公告)号：US20100214178A1

公开(公告)日：2010-08-26

申请号：US12457802

申请日：2009-06-22

申请人： Hiroshi Toyao ,  Noriaki Ando

发明人： Hiroshi Toyao ,  Noriaki Ando

IPC分类号： H01Q9/00 ,  H01Q1/24 ,  H01Q1/38

CPC分类号： H01P3/003 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01P1/2005 ,  H01Q13/08 ,  H01Q15/006 ,  H01Q15/008 ,  H03H7/46

摘要： An antenna or a printed-circuit board is formed using a plurality of unit structures which are repetitively aligned in a one-dimensional manner or in a two-dimensional manner. The unit structure includes a conductive plane and a conductive patch which are disposed in parallel with each other, a power-supply unit applying a high frequency signal between the conductive plane and the conductive patch, and at least one shunt which is aligned in the conductive patch and which is constituted of a transmission line having an open end aligned in a plane above or below the conductive patch and a conductive via electrically connecting the transmission line to the conductive plane. Alternately, the transmission line is aligned in a plane above or below the conductive plane so that the transmission line is electrically connected to the conductive patch via the conductive via.

摘要翻译： 使用以一维方式或二维方式重复对准的多个单位结构形成天线或印刷电路板。 所述单元结构包括彼此并联设置的导电平面和导电贴片，在所述导电平面和所述导电贴片之间施加高频信号的电源单元以及在所述导电平面和所述导电贴片之间对准的至少一个分流器 贴片，其由在导电贴片上方或下方的平面中对准的开口端的传输线和导电通孔电连接到导电平面。 或者，传输线在导电平面上方或下方的平面中对准，使得传输线经由导电通孔电连接到导电贴片。