-
1.发明授权Heat exchanger and method of manufacturing a heat exchanging member of a heat exchanger 失效热交换器和热交换器的热交换构件的制造方法
公开(公告)号：US6032730A
公开(公告)日：2000-03-07
申请号：US925465
申请日：1997-09-08
申请人： Hiroyuki Akita , Hidemoto Arai , Akira Doi , Yoichi Sugiyama , Shinji Nakamoto , Kunihiko Kaga
发明人： Hiroyuki Akita , Hidemoto Arai , Akira Doi , Yoichi Sugiyama , Shinji Nakamoto , Kunihiko Kaga
CPC分类号： F24F12/006 , F28D9/0037 , Y02B30/563 , Y10T29/4935 , Y10T29/49366 , Y10T29/49389
摘要： A heat exchanger, in which an alternating flow of supply air and exhaust air are supplied in opposite directions between a plurality of stacked heat exchanging members, is characterized in that the heat exchanging members each is composed of a first paper member having a moisture permeability and corrugated in the width direction and having flat portions at the longitudinally opposite ends flattened under pressure, and a pair of second paper members having one end joined to the flat portions and the other end side extending flatly in the longitudinal direction to define a header defining portion for defining a header portion, so that the number of the parts can be decreased and the assembly can be made easier, whereby a heat exchanger with an improved productivity can be provided. A method for manufacturing a heat exchanger is also disclosed.
摘要翻译： 一种热交换器，其中在多个层叠的热交换构件之间沿相反方向供应供给空气和排出空气的交替流，其特征在于，所述热交换构件各自由具有透湿性的第一纸构件和 在宽度方向上呈波纹形状，并且在纵向相对端处的压力平坦化的平坦部分，以及一对第二纸部件，其一端接合到平坦部分，另一端侧在纵向方向上平坦地延伸，以限定出头部限定部分 用于限定集管部分，使得可以减少部件的数量并且可以使组装更容易，由此可以提供具有提高的生产率的热交换器。 还公开了一种制造热交换器的方法。
-
公开(公告)号：US20080107207A1
公开(公告)日：2008-05-08
申请号：US11976665
申请日：2007-10-26
CPC分类号： H04N5/602 , H04N19/44 , H04N21/42203 , H04N21/4223 , H04N21/4394 , H04N21/4398 , H04N21/4424 , H04N21/4524 , H04N21/4621 , H04N21/84 , H04N21/8451
摘要： A broadcast receiving terminal is equipped with a receiving unit for receiving a broadcast signal; a separating unit for separating audio coded data and band expansion information from the broadcast signal received by the receiving unit; a low frequency band audio decoding unit for decoding the audio coded data so as to output low frequency band audio data; a high frequency band audio producing unit for producing high frequency band audio data by employing the band expansion information and the low frequency band audio data; a switching unit for switching a sound reproducing mode of the broadcast receiving terminal between a first mode for reproducing sound based upon both the low frequency band audio data and the high frequency band audio data, and a second mode for reproducing sound based upon only the low frequency band audio data; and a control unit for controlling the switching unit so as to constitute a mode selected in response to a predetermined condition.
摘要翻译： 广播接收终端配备有用于接收广播信号的接收单元; 分离单元，用于从接收单元接收的广播信号中分离音频编码数据和频带扩展信息; 低频带音频解码单元，用于对音频编码数据进行解码，以输出低频带音频数据; 高频带音频产生单元，用于通过采用频带扩展信息和低频带音频数据产生高频带音频数据; 切换单元，用于在基于低频带音频数据和高频带音频数据的两者再现声音的第一模式之间切换广播接收终端的声音再现模式，以及仅基于低频带音频数据再现声音的第二模式 频段音频数据; 以及控制单元，用于控制切换单元，以便构成响应于预定条件选择的模式。
-
公开(公告)号：US20130311945A1
公开(公告)日：2013-11-21
申请号：US13982357
申请日：2012-03-02
申请人： Shinji Nakamoto
发明人： Shinji Nakamoto
IPC分类号： G06F3/0484
CPC分类号： G06F3/04842 , G06F3/0416 , G06F3/0488
摘要： An input device is provided in which a selectable object intended by a user is selected temporarily by the proximity position detecting section when the user brings the selection commanding body close to the display screen, and is judged to have been selected as a regular one when the user brings the selection commanding body into contact with the display screen at a position that is within a prescribed distance of the selectable object in a state that the user is notified of its temporary selection.
摘要翻译： 提供一种输入装置，其中当用户将选择指令体接近显示屏幕时，用户期望的可选择对象由临近位置检测部分临时选择，并且当被选择为常规选择对象时 在用户被通知其临时选择的状态下，用户使选择指令体与在可选择对象的规定距离内的位置处与显示屏幕接触。
-
4.发明申请Substrate For Mounting Device and Package for Housing Device Employing the Same 有权用于使用其的外壳装置的安装装置和封装的基板公开(公告)号：US20110273846A1
公开(公告)日：2011-11-10
申请号：US12865107
申请日：2010-01-22
IPC分类号： H05K7/20
CPC分类号： H01L23/3675 , H01L23/057 , H01L23/36 , H01L23/3677 , H01L2224/48091 , H01L2224/48247 , H01L2924/09701 , Y10T29/49121 , H01L2924/00014
摘要： There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion.The substrate for mounting the device includes a support body having, on one main surface of the support body, a device mounting portion for mounting a power semiconductor device, the support body having a plurality of columnar parts that are spaced apart in a thickness direction with respect to the device mounting portion and are arranged apart from each other; and a heat accumulating region which is disposed between the columnar parts and is lower in thermal conductivity than the support body.
摘要翻译： 提供了一种用于安装装置的基板和用于容纳使用其的装置的封装，其中功率半导体装置可以容易地设定为适合于操作的温度，并且因此可以以适当的方式起作用。 用于安装装置的基板包括：支撑体，其在支撑体的一个主表面上具有用于安装功率半导体器件的器件安装部分，所述支撑体具有多个沿厚度方向间隔开的柱状部分， 相对于装置安装部分并且彼此分开布置; 以及集热区域，其设置在所述柱状部件之间，并且导热率低于所述支撑体。
-
5.发明授权Semiconductor element housing package and semiconductor device equipped with the same 有权半导体元件外壳封装和配备相同的半导体器件公开(公告)号：US08847381B2
公开(公告)日：2014-09-30
申请号：US13980440
申请日：2011-12-19
IPC分类号： H01L23/04 , H01L23/00 , H01L23/495 , H01L23/057
CPC分类号： H01L23/562 , H01L23/057 , H01L23/49551 , H01L23/49562 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/06181 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2224/85444 , H01L2224/85455 , H01L2924/00014 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor element housing package includes a substrate, a frame body disposed on the substrate; an insulating substrate disposed in a frame-body-surrounded region of the substrate; a first mounting member disposed on the insulating substrate, for mounting a power semiconductor element thereon; a second mounting member disposed on the insulating substrate so as to be spaced away from the first mounting member; a first lead member having a first bend; and a second lead member having a second bend. The first lead member is disposed so as to pass through the frame body from an exterior thereof and extend over the first mounting member and makes connection therewith through the first bend. The second lead member is disposed so as to pass through the frame body from the exterior thereof and extend over the second mounting member and makes connection therewith through the second bend.
摘要翻译： 半导体元件外壳封装包括基板，设置在基板上的框体; 设置在所述基板的框体周围的区域中的绝缘基板; 第一安装构件，设置在所述绝缘基板上，用于在其上安装功率半导体元件; 第二安装构件，设置在所述绝缘基板上，以与所述第一安装构件隔开; 具有第一弯曲部的第一引线部件; 以及具有第二弯曲部的第二引导部件。 第一引导构件被设置成从框架体的外部穿过框架体并且在第一安装构件上延伸并且通过第一弯曲件与其连接。 第二引导构件被设置成从框架体的外部穿过框架体并且延伸穿过第二安装构件并通过第二弯曲件与其连接。
-
6.发明申请公开(公告)号：US20130307135A1
公开(公告)日：2013-11-21
申请号：US13980440
申请日：2011-12-19
IPC分类号： H01L23/00
CPC分类号： H01L23/562 , H01L23/057 , H01L23/49551 , H01L23/49562 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/06181 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2224/85444 , H01L2224/85455 , H01L2924/00014 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor element housing package includes a substrate, a frame body disposed on the substrate; an insulating substrate disposed in a frame-body-surrounded region of the substrate; a first mounting member disposed on the insulating substrate, for mounting a power semiconductor element thereon; a second mounting member disposed on the insulating substrate so as to be spaced away from the first mounting member; a first lead member having a first bend; and a second lead member having a second bend. The first lead member is disposed so as to pass through the frame body from an exterior thereof and extend over the first mounting member and makes connection therewith through the first bend. The second lead member is disposed so as to pass through the frame body from the exterior thereof and extend over the second mounting member and makes connection therewith through the second bend.
摘要翻译： 半导体元件外壳封装包括基板，设置在基板上的框体; 设置在所述基板的框体周围的区域中的绝缘基板; 第一安装构件，设置在所述绝缘基板上，用于在其上安装功率半导体元件; 第二安装构件，设置在所述绝缘基板上，以与所述第一安装构件隔开; 具有第一弯曲部的第一引线部件; 以及具有第二弯曲部的第二引导部件。 第一引导构件被设置成从框架体的外部穿过框架体并且在第一安装构件上延伸并且通过第一弯曲件与其连接。 第二引导构件被设置成从框架体的外部穿过框架体并且延伸穿过第二安装构件并通过第二弯曲件与其连接。
-
公开(公告)号：US20090016637A1
公开(公告)日：2009-01-15
申请号：US12171433
申请日：2008-07-11
申请人： Masato TAKEMOTO , Shinji Nakamoto , Yasuyuki Hara
发明人： Masato TAKEMOTO , Shinji Nakamoto , Yasuyuki Hara
CPC分类号： H04M1/72522 , H04M2250/12 , H04N5/60 , H04N5/63 , H04N21/41407 , H04N21/42202 , H04N21/42203 , H04N21/42215 , H04N21/439 , H04N21/4394 , H04N21/44 , H04N21/44209 , H04N21/44227 , H04N21/4425 , H04N21/4621
摘要： An electronic appliance is equipped with: a voice processing unit for executing one voice processing operation selected from plural sorts of voice processing operations; a zapping detecting unit for detecting a zapping condition; and a process switching unit for switching the presently executed voice processing operation to a different voice processing operation in response to a detection result for indicating whether or not the zapping condition is detected. When the zapping detecting unit detects the zapping condition, the process switching unit controls the voice processing unit to switch the presently executed voice processing operation to a voice processing operation which does not contain a sound quality improving function.
摘要翻译： 电子设备配备有：语音处理单元，用于执行从多种语音处理操作中选择的一种语音处理操作; 用于检测切换条件的切换检测单元; 以及处理切换单元，用于响应于用于指示是否检测到切换条件的检测结果，将当前执行的语音处理操作切换到不同的语音处理操作。 当切换检测单元检测到切换条件时，处理切换单元控制语音处理单元将当前执行的语音处理操作切换到不包含音质改善功能的语音处理操作。
-
公开(公告)号：US5823824A
公开(公告)日：1998-10-20
申请号：US899302
申请日：1997-07-24
IPC分类号： H01R13/648 , H01R13/50 , H01R13/52 , H01R13/627 , H01R13/6593 , H01R4/66
CPC分类号： H01R13/50 , H01R13/6593 , H01R13/5221 , H01R13/6272
摘要： A sealed connector is provided which includes: an inner housing accommodating a terminal; an outer housing surrounding the inner housing; a metallic shield positioned between the inner housing and outer housing; a connecting portion connecting the inner housing and the outer housing to form a one-piece body; a shield insertion hole which is formed for communication of the interior of the sealed connector with a shield insertion space located between both inner and outer housing; and a connecting protrusion which is formed by notching at the pointed end of the metallic shield and which protrudes in the connector fitting direction through insertion of the metallic shield into the shield insertion space. The metallic shield includes a slit adjacent to the connecting protrusion and an engaging piece opposite to an engaging slot portion of the inner housing, wherein the bottom end portion of the slit contacts the connecting portion between the inner and outer housings. Each of the slits of the metallic shield accomodates the connecting protrusions of the other metallic shield which are alternately fitted into each other resulting in an elimination of the clearances when the male- and female-side sealed connectors are fitted into each other.
摘要翻译： 提供一种密封连接器，其包括：容纳端子的内壳体; 围绕所述内壳体的外壳; 定位在内壳体和外壳体之间的金属屏蔽件; 连接部，其连接所述内壳体和所述外壳体，以形成一体式主体; 屏蔽插入孔，其形成为用于将密封连接器的内部与位于内壳体和外壳体之间的屏蔽插入空间连通; 以及连接突起，其通过在金属屏蔽的尖端处开槽而形成，并且通过将金属屏蔽插入屏蔽插入空间而沿着连接器配合方向突出。 金属屏蔽包括与连接突起相邻的狭缝和与内壳的接合槽部相对的接合片，其中狭缝的底端部分接触内壳体和外壳体之间的连接部分。 金属屏蔽的每个狭缝都容纳彼此交替装配的另一金属屏蔽的连接突起，从而消除了阳和阴侧密封连接器相互嵌合时的间隙。
-
9.发明授权Substrate for mounting device and package for housing device employing the same 有权用于安装装置的基板和用于采用该装置的壳体装置的封装公开(公告)号：US08837164B2
公开(公告)日：2014-09-16
申请号：US12865107
申请日：2010-01-22
IPC分类号： H05K7/02 , H01L23/367 , H01L23/36 , H01L23/057
CPC分类号： H01L23/3675 , H01L23/057 , H01L23/36 , H01L23/3677 , H01L2224/48091 , H01L2224/48247 , H01L2924/09701 , Y10T29/49121 , H01L2924/00014
摘要： There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion.The substrate for mounting the device includes a support body having, on one main surface of the support body, a device mounting portion for mounting a power semiconductor device, the support body having a plurality of columnar parts that are spaced apart in a thickness direction with respect to the device mounting portion and are arranged apart from each other; and a heat accumulating region which is disposed between the columnar parts and is lower in thermal conductivity than the support body.
摘要翻译： 提供了一种用于安装装置的基板和用于容纳使用其的装置的封装，其中功率半导体装置可以容易地设定为适合于操作的温度，并且因此可以以适当的方式起作用。 用于安装装置的基板包括：支撑体，其在支撑体的一个主表面上具有用于安装功率半导体器件的器件安装部分，所述支撑体具有多个沿厚度方向间隔开的柱状部分， 相对于装置安装部分并且彼此分开布置; 以及集热区域，其设置在所述柱状部件之间，并且导热率低于所述支撑体。
-
10.发明申请Mode switching method, mode switching program, and broadcast receiving terminal 审中-公开模式切换方式，模式切换程序，广播接收终端公开(公告)号：US20080107208A1
公开(公告)日：2008-05-08
申请号：US11979115
申请日：2007-10-31
CPC分类号： H03G3/348
摘要： A broadcast receiving terminal having a calculating process unit operated at different clock frequencies in response to modes executes a mode switching method comprising the below-mentioned steps. The mode switching method is comprised of: a step for judging whether or not a mode switching instruction is issued while the calculating process unit is operated; a step for setting the calculating process unit to an idling status when the mode switching instruction is issued; and a step for releasing the idling status of the calculating process unit.
摘要翻译： 具有响应于模式以不同时钟频率操作的计算处理单元的广播接收终端执行包括下述步骤的模式切换方法。 模式切换方法包括：在计算处理单元被操作时判断是否发出模式切换指令的步骤; 在发出模式切换指示时将计算处理单位设定为空转状态的步骤; 以及释放计算处理单元的空转状态的步骤。
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.025 秒)
