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12 条记录 (耗时 0.023 秒)

    Method for forming conductor layers and method for fabricating multilayer substrates
    5.
    发明授权
    Method for forming conductor layers and method for fabricating multilayer substrates 失效
    形成导体层的方法和用于制造多层基板的方法

    公开(公告)号：US4963512A

    公开(公告)日：1990-10-16

    申请号：US281879

    申请日：1988-12-08

    申请人： Shoichi Iwanaga ,  Akio Fujiwara ,  Takayoshi Sowa ,  Hitoshi Yokono

    发明人： Shoichi Iwanaga ,  Akio Fujiwara ,  Takayoshi Sowa ,  Hitoshi Yokono

    IPC分类号： H01L21/48 ,  H05K3/00 ,  H05K3/38 ,  H05K3/46

    CPC分类号： H01L21/4846 ,  H01L21/4857 ,  H05K3/465 ,  H05K2201/0154 ,  H05K2203/072 ,  H05K2203/0733 ,  H05K3/0041 ,  H05K3/388 ,  H05K3/4661

    摘要： A method for forming conductor layers of substrates for mounting LSIs and the like and a fabrication method of multilayer substrates are disclosed. These methods comprise steps of forming a metal underlayer having a shape similar to that of a conductor pattern on the substrate, forming an insulation layer over portions of the substrate which are not covered by the metal underlayer, and disposing a plating layer on the metal underlayer by carrying out electroless plating while using the insulation layer as the resist and thereby forming conductors. As compared with a conventional conductor layer forming method, the number of fabrication steps is reduced. And the elimination of the surface grinding step facilitates the fabrication.

    摘要翻译： 公开了一种用于形成用于安装LSI等的基板的导体层的方法和多层基板的制造方法。 这些方法包括以下步骤：在基板上形成类似于导体图案的形状的金属底层，在基底的不被金属底层覆盖的部分上形成绝缘层，并在金属底层上设置镀层 通过在使用绝缘层作为抗蚀剂的同时进行化学镀，从而形成导体。 与常规的导体层形成方法相比，制造步骤的数量减少。 并且消除表面研磨步骤有助于制造。

    Dew sensor
    6.
    发明授权
    Dew sensor 失效
    露水传感器

    公开(公告)号：US4481813A

    公开(公告)日：1984-11-13

    申请号：US436944

    申请日：1982-10-27

    申请人： Hirayoshi Tanei ,  Shoichi Iwanaga ,  Akira Ikegami ,  Hiroshi Otsu ,  Hiromi Isonae

    发明人： Hirayoshi Tanei ,  Shoichi Iwanaga ,  Akira Ikegami ,  Hiroshi Otsu ,  Hiromi Isonae

    IPC分类号： H01C7/00 ,  G01N27/12

    CPC分类号： G01N27/121

    摘要： A dew sensor of direct current type and resistance-lowering type with increasing humidity for quick and sharp detection of dewing is provided, which comprises a pair of counterposed electrodes, humidity-sensitive layer of insulating porous metal oxide with a porosity of 20 to 60% provided on and between the counterposed electrodes, and an organic polymer coating layer having a thickness of 0.05 to 2 .mu.m provided on the humidity-sensitive layer.

    摘要翻译： 提供了一种具有增加湿度的直流型和电阻降低型的露点传感器，用于快速和清晰的检测检测，其包括一对相对电极，绝缘多孔金属氧化物的湿度敏感层，孔隙率为20至60％ 设置在相对电极之间和之间，以及设置在湿度敏感层上的厚度为0.05至2μm的有机聚合物涂层。

    Gas detection device and method for detecting gas
    7.
    发明授权
    Gas detection device and method for detecting gas 失效
    气体检测装置及气体检测方法

    公开(公告)号：US4457161A

    公开(公告)日：1984-07-03

    申请号：US366304

    申请日：1981-04-07

    申请人： Shoichi Iwanaga ,  Nobuo Sato ,  Akira Ikegami ,  Tokio Isogai ,  Takanobu Noro ,  Hideo Arima

    发明人： Shoichi Iwanaga ,  Nobuo Sato ,  Akira Ikegami ,  Tokio Isogai ,  Takanobu Noro ,  Hideo Arima

    IPC分类号： G01N27/04 ,  G01N27/12 ,  G01N33/00

    CPC分类号： G01N33/0031 ,  G01N27/12

    摘要： A gas detection device and a method for detecting a gas where gas information including concentrations of gas components in a mixed gas, concentration, presence of specific gas components and the like is detected by measuring, e.g., the output voltages of a plurality of gas sensors having different gas selectivities. The gas selectivities, as a characteristic constant of the specific gas sensor, was previously determined. The measured output voltages and gas selectivities are then used for solving plural simultaneous equations for gas concentrations.

    摘要翻译： 一种气体检测装置和气体检测方法，其中气体信息包括混合气体中气体组分的浓度，浓度，特定气体组分的存在等，通过测量多个气体传感器的输出电压 具有不同的气体选择性。 作为特定气体传感器的特性常数，气体选择性是先前确定的。 然后测量的输出电压和气体选择性用于求解气体浓度的多个联立方程。

    Method for manufacturing multilayer ceramic substrate
    9.
    发明授权
    Method for manufacturing multilayer ceramic substrate 失效
    多层陶瓷基板的制造方法

    公开(公告)号：US5503787A

    公开(公告)日：1996-04-02

    申请号：US207620

    申请日：1994-03-09

    申请人： Hirayoshi Tanei ,  Shoichi Iwanaga ,  Shousaku Ishihara ,  Kousaku Morita

    发明人： Hirayoshi Tanei ,  Shoichi Iwanaga ,  Shousaku Ishihara ,  Kousaku Morita

    IPC分类号： B32B18/00 ,  C04B35/64 ,  H05K1/09 ,  H05K3/46

    CPC分类号： B32B18/00 ,  C04B35/64 ,  C04B35/645 ,  C04B2235/48 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2235/6582 ,  C04B2235/6585 ,  C04B2235/6586 ,  C04B2235/661 ,  C04B2237/124 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  H05K1/092 ,  H05K3/4611 ,  H05K3/4629

    摘要： According to this method for manufacturing a multilayer glass-ceramic circuit board, a green sheet laminate is fired in a non-oxidizing atmosphere in a first firing step so that a void content of at least 10% is maintained and strength of the ceramic laminate is increased. Then the laminate is fired in an oxidizing atmosphere in a second firing step so that the organic binder contained in the laminate is removed and the residual carbon content is at most 200 ppm. Thereafter the laminate is fired in a reducing atmosphere in a third firing step to reduce the oxidized conductor circuit. Finally, the laminate is fired in a non-oxidizing atmosphere in a fourth firing step to densify the ceramic laminate. The firing temperature in the first, second and third steps is 100.degree.-200.degree. C. lower than the softening point of the glass and the firing temperature in the fourth step is higher than the softening point of the glass and lower than the melting point of the conductor.

    摘要翻译： 根据该多层玻璃 - 陶瓷电路板的制造方法，在第一烧成工序中，在非氧化性气氛中烧成生片层压体，使得保持至少10％的空隙率，陶瓷层叠体的强度为 增加。 然后在第二烧成工序中，在氧化性气氛中烧成层叠体，除去层叠体中含有的有机粘结剂，残存碳含量在200ppm以下。 此后，在第三烧制步骤中，在还原气氛中烧制层压体以还原氧化的导体电路。 最后，在第四烧成工序中，在非氧化性气氛中烧成层叠体，使陶瓷层叠体致密化。 第一，第二和第三步骤的烧成温度比玻璃的软化点低100-200℃，第四步骤的烧成温度高于玻璃的软化点并低于熔点 的导体。

    Thin film ceramic multilayer wiring hybrid board
    10.
    发明授权
    Thin film ceramic multilayer wiring hybrid board 失效
    薄膜陶瓷多层布线混合板

    公开(公告)号：US5396034A

    公开(公告)日：1995-03-07

    申请号：US27346

    申请日：1993-03-08

    申请人： Tsuyoshi Fujita ,  Shoichi Iwanaga ,  Hirayoshi Tanei

    发明人： Tsuyoshi Fujita ,  Shoichi Iwanaga ,  Hirayoshi Tanei

    IPC分类号： H05K3/46 ,  H01L21/48 ,  H01L23/538 ,  H05K1/00

    CPC分类号： H01L23/5385 ,  H01L21/4857 ,  H05K3/4605 ,  H01L2224/16225 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/0154 ,  H05K3/4611 ,  H05K3/467

    摘要： A ceramic thin film hybrid circuit board is provided by flattening the surface of a ceramic multi-layer interconnection substrate, forming capture pads on the flattened surface, filling spaces between the capture pads with an insulating layer composed of a glass material or an organic resin material, grinding the resultant surface until the capture pads are exposed to flatness, and laminating a plurality of thin film interconnection layers on the flattened surface. The ceramic thin film hybrid circuit board has an increased package density of mounted electronic parts such as LSIs and the like because failures of thin film interconnection layer generated owing to the roughness of the surface of the ceramic substrate, defects such as voids and the hollows produced with the capture pads are greatly reduced, and is very suitable for large scale electronic computers, in which the wiring length is reduced so as to reduce the signal delay.

    摘要翻译： 陶瓷薄膜混合电路板通过使陶瓷多层互连基板的表面平坦化，在平坦化表面上形成捕获垫来填充捕获垫之间的空间，由玻璃材料或有机树脂材料构成的绝缘层 研磨所得到的表面直到捕获垫暴露于平坦度，并且在平坦表面上层叠多个薄膜互连层。 陶瓷薄膜混合电路板由于陶瓷基板的表面的粗糙度而产生的薄膜互连层的故障，诸如空隙和中空产生的缺陷导致了诸如LSI等的安装电子部件的封装密度增加 捕获垫大大减少，非常适合于大型电子计算机，其中布线长度减小以减少信号延迟。