Method of growing semi-polar nitride single crystal thin film and method of manufacturing nitride semiconductor light emitting diode using the same
    1.
    发明授权
    Method of growing semi-polar nitride single crystal thin film and method of manufacturing nitride semiconductor light emitting diode using the same 有权
    生长半极性氮化物单晶薄膜的方法和使用其制造氮化物半导体发光二极管的方法

    公开(公告)号:US07790584B2

    公开(公告)日:2010-09-07

    申请号:US12246594

    申请日:2008-10-07

    IPC分类号: H01L21/36

    摘要: A method of growing a semi-polar nitride single crystal thin film. The method includes forming a semi-polar nitride single crystal base layer on an m-plane hexagonal system single crystal substrate, forming a dielectric pattern layer on the semi-polar nitride single crystal base layer, and growing the semi-polar nitride single crystal thin film on the semi-polar nitride single crystal base layer having the dielectric pattern layer in a lateral direction. The growing of the semi-polar nitride single crystal thin film in a lateral direction includes primarily growing the semi-polar nitride single crystal thin film in the lateral direction such that part of a growth plane on the semi-polar nitride single crystal base layer has an a-plane, and secondarily growing the semi-polar nitride single crystal thin film in the lateral direction such that sidewalls of the primarily grown semi-polar nitride single crystal thin film are combined to have a (11 22) plane.

    摘要翻译: 生长半极性氮化物单晶薄膜的方法。 该方法包括在m面六方晶系单晶衬底上形成半极化氮化物单晶基底层,在半极化氮化物单晶基底层上形成电介质图案层,并生长半极化氮化物单晶薄膜 在具有横向方向上具有电介质图案层的半极性氮化物单晶基底层上的膜。 半极性氮化物单晶薄膜在横向上的生长包括主要在横向上生长半极性氮化物单晶薄膜,使得半极性氮化物单晶基底层上的生长面的一部分具有 a平面,并且在横向上二次生长半极性氮化物单晶薄膜,使得主要生长的半极性氮化物单晶薄膜的侧壁被组合成具有(1122)面。

    METHOD OF GROWING NITRIDE SINGLE CRYSTAL AND METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE
    2.
    发明申请
    METHOD OF GROWING NITRIDE SINGLE CRYSTAL AND METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
    生长氮化物单晶的方法及制造氮化物半导体发光装置的方法

    公开(公告)号:US20090298214A1

    公开(公告)日:2009-12-03

    申请号:US12263873

    申请日:2008-11-03

    IPC分类号: H01L33/00 H01L21/205

    摘要: There is provided a method of growing a nitride single crystal. A method of growing a nitride single crystal according to an aspect of the invention may include: growing a first nitride single crystal layer on a substrate; forming a dielectric pattern having an open area on the first nitride single crystal layer, the open area exposing a part of an upper surface of the first nitride single crystal layer; and growing a second nitride single crystal layer on the first nitride single crystal layer through the open area while the second nitride single crystal layer grows to be equal to or larger than a height of the dielectric pattern, wherein the height of the dielectric pattern is greater than a width of the open area so that dislocations in the second nitride single crystal layer move laterally, collide with side walls of the dielectric pattern, and are terminated.

    摘要翻译: 提供了生长氮化物单晶的方法。 根据本发明的一个方面的生长氮化物单晶的方法可以包括:在衬底上生长第一氮化物单晶层; 在所述第一氮化物单晶层上形成具有开放区域的电介质图案,所述开放区域露出所述第一氮化物单晶层的上表面的一部分; 以及通过所述开放区域在所述第一氮化物单晶层上生长第二氮化物单晶层,而所述第二氮化物单晶层生长至等于或大于所述电介质图案的高度,其中所述电介质图案的高度较大 比第二氮化物单晶层的位错横向移动,与介质图案的侧壁碰撞而终止。

    METHOD OF GROWING SEMI-POLAR NITRIDE SINGLE CRYSTAL THIN FILM AND METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR LIGHT EMITTING DIODE USING THE SAME
    3.
    发明申请
    METHOD OF GROWING SEMI-POLAR NITRIDE SINGLE CRYSTAL THIN FILM AND METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR LIGHT EMITTING DIODE USING THE SAME 有权
    使用半阳极氮化物单晶薄膜的方法和使用其制造氮化物半导体发光二极管的方法

    公开(公告)号:US20090155947A1

    公开(公告)日:2009-06-18

    申请号:US12246594

    申请日:2008-10-07

    IPC分类号: H01L33/00 H01L21/205

    摘要: A method of growing a semi-polar nitride single crystal thin film. The method includes forming a semi-polar nitride single crystal base layer on an m-plane hexagonal system single crystal substrate, forming a dielectric pattern layer on the semi-polar nitride single crystal base layer, and growing the semi-polar nitride single crystal thin film on the semi-polar nitride single crystal base layer having the dielectric pattern layer in a lateral direction. The growing of the semi-polar nitride single crystal thin film in a lateral direction includes primarily growing the semi-polar nitride single crystal thin film in the lateral direction such that part of a growth plane on the semi-polar nitride single crystal base layer has an a-plane, and secondarily growing the semi-polar nitride single crystal thin film in the lateral direction such that sidewalls of the primarily grown semi-polar nitride single crystal thin film are combined to have a (11 22) plane.

    摘要翻译: 生长半极性氮化物单晶薄膜的方法。 该方法包括在m面六方晶系单晶衬底上形成半极化氮化物单晶基底层,在半极化氮化物单晶基底层上形成电介质图案层,并生长半极化氮化物单晶薄膜 在具有横向方向上具有电介质图案层的半极性氮化物单晶基底层上的膜。 半极性氮化物单晶薄膜在横向上的生长包括主要在横向上生长半极性氮化物单晶薄膜,使得半极性氮化物单晶基底层上的生长面的一部分具有 a平面,并且在横向上二次生长半极性氮化物单晶薄膜,使得主要生长的半极性氮化物单晶薄膜的侧壁被组合成具有(11 22)飞机。

    Method of growing nitride single crystal and method of manufacturing nitride semiconductor light emitting device
    4.
    发明授权
    Method of growing nitride single crystal and method of manufacturing nitride semiconductor light emitting device 有权
    氮化物单晶的生长方法及氮化物半导体发光元件的制造方法

    公开(公告)号:US08148178B2

    公开(公告)日:2012-04-03

    申请号:US12263873

    申请日:2008-11-03

    IPC分类号: H01L33/00

    摘要: There is provided a method of growing a nitride single crystal. A method of growing a nitride single crystal according to an aspect of the invention may include: growing a first nitride single crystal layer on a substrate; forming a dielectric pattern having an open area on the first nitride single crystal layer, the open area exposing a part of an upper surface of the first nitride single crystal layer; and growing a second nitride single crystal layer on the first nitride single crystal layer through the open area while the second nitride single crystal layer grows to be equal to or larger than a height of the dielectric pattern, wherein the height of the dielectric pattern is greater than a width of the open area so that dislocations in the second nitride single crystal layer move laterally, collide with side walls of the dielectric pattern, and are terminated.

    摘要翻译: 提供了生长氮化物单晶的方法。 根据本发明的一个方面的生长氮化物单晶的方法可以包括:在衬底上生长第一氮化物单晶层; 在所述第一氮化物单晶层上形成具有开放区域的电介质图案,所述开放区域露出所述第一氮化物单晶层的上表面的一部分; 以及通过所述开放区域在所述第一氮化物单晶层上生长第二氮化物单晶层,而所述第二氮化物单晶层生长至等于或大于所述电介质图案的高度,其中所述电介质图案的高度较大 比第二氮化物单晶层的位错横向移动,与介质图案的侧壁碰撞而终止。

    Method of manufacturing substrate for forming device, and method of manufacturing nitride-based semiconductor laser diode
    7.
    发明授权
    Method of manufacturing substrate for forming device, and method of manufacturing nitride-based semiconductor laser diode 有权
    用于形成装置的基板的制造方法以及制造氮化物基半导体激光二极管的方法

    公开(公告)号:US08163579B2

    公开(公告)日:2012-04-24

    申请号:US12073293

    申请日:2008-03-04

    IPC分类号: H01L33/00

    摘要: Provided is a method of manufacturing a semiconductor laser diode. The method includes the steps of: preparing a GaN substrate having an a-plane or m-plane GaN layer formed thereon; forming a plurality of laser diode structures on the GaN layer; etching the GaN substrate such that a cutting reference line is formed in a groove shape along the crystal surface of the a-plane or m-plane, not a main plane; and cutting the GaN substrate along the cutting reference line so as to form a mirror surface of the semiconductor laser diode, the mirror surface coinciding with the crystal surface of the a-plane or m-plane, not the main plane.

    摘要翻译: 提供一种制造半导体激光二极管的方法。 该方法包括以下步骤:制备其上形成有a面或m面GaN层的GaN衬底; 在所述GaN层上形成多个激光二极管结构; 蚀刻GaN衬底,使得切割参考线沿着a面或m面的晶体表面而不是主平面形成为沟槽形状; 并且沿着切割参考线切割GaN衬底以形成半导体激光二极管的镜面,镜面与a面或m面的晶体表面重合,而不是主平面。

    Method of manufacturing substrate for forming device, and method of manufacturing nitride-based semiconductor laser diode
    8.
    发明申请
    Method of manufacturing substrate for forming device, and method of manufacturing nitride-based semiconductor laser diode 有权
    用于形成装置的基板的制造方法以及制造氮化物基半导体激光二极管的方法

    公开(公告)号:US20090155945A1

    公开(公告)日:2009-06-18

    申请号:US12073293

    申请日:2008-03-04

    IPC分类号: H01L21/00

    摘要: Provided is a method of manufacturing a semiconductor laser diode. The method includes the steps of: preparing a GaN substrate having an a-plane or m-plane GaN layer formed thereon; forming a plurality of laser diode structures on the GaN layer; etching the GaN substrate such that a cutting reference line is formed in a groove shape along the crystal surface of the a-plane or m-plane, not a main plane; and cutting the GaN substrate along the cutting reference line so as to form a mirror surface of the semiconductor laser diode, the mirror surface coinciding with the crystal surface of the a-plane or m-plane, not the main plane.

    摘要翻译: 提供一种制造半导体激光二极管的方法。 该方法包括以下步骤:制备其上形成有a面或m面GaN层的GaN衬底; 在所述GaN层上形成多个激光二极管结构; 蚀刻GaN衬底,使得切割参考线沿着a面或m面的晶体表面而不是主平面形成为沟槽形状; 并且沿着切割参考线切割GaN衬底以形成半导体激光二极管的镜面,镜面与a面或m面的晶体表面重合,而不是主平面。

    Light emitting diode package
    10.
    发明授权
    Light emitting diode package 有权
    发光二极管封装

    公开(公告)号:US08558268B2

    公开(公告)日:2013-10-15

    申请号:US12343452

    申请日:2008-12-23

    IPC分类号: H01L33/00

    摘要: Provided is a light emitting diode (LED) package. The LED package includes a package main body, first and second electrode structures, first and second LED chips, and first and second resin packing parts. The package main body includes a concave portion and a barrier wall dividing the concave portion into at least first and second accommodation recesses. The first and second electrode structures are formed at the package main body and are exposed at bottom surfaces of the first and second accommodation recesses respectively. The first and second LED chips are electrically connected to the first and second electrode structures are respectively mounted on the bottom surfaces of the first and second accommodation recesses. The first and second resin packing parts include at least one fluorescent material and are formed in the first and second accommodation recesses for packing the first and second LED chips.

    摘要翻译: 提供了一种发光二极管(LED)封装。 LED封装包括封装主体,第一和第二电极结构,第一和第二LED芯片以及第一和第二树脂封装部件。 包装主体包括凹部和将凹部分成至少第一和第二容纳凹部的阻挡壁。 第一和第二电极结构形成在封装主体处,分别暴露在第一和第二容纳凹槽的底表面处。 第一和第二LED芯片电连接到第一和第二电极结构分别安装在第一和第二容纳凹部的底表面上。 第一和第二树脂包装部分包括至少一种荧光材料,并且形成在用于包装第一和第二LED芯片的第一和第二容纳凹部中。