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    MEMORY CORE AND SEMICONDUCTOR MEMORY DEVICE INCLUDING THE SAME
    3.
    发明申请
    MEMORY CORE AND SEMICONDUCTOR MEMORY DEVICE INCLUDING THE SAME 有权
    存储核心和半导体存储器件，包括它们

    公开(公告)号：US20120212989A1

    公开(公告)日：2012-08-23

    申请号：US13304851

    申请日：2011-11-28

    申请人： Hak-Soo YU ,  Su-A Kim ,  Hong-Sun Hwang ,  Chul-Woo Park

    发明人： Hak-Soo YU ,  Su-A Kim ,  Hong-Sun Hwang ,  Chul-Woo Park

    IPC分类号： G11C5/02

    CPC分类号： G11C7/02 ,  G11C7/062 ,  H01L27/10882 ,  H01L27/10885 ,  H01L27/10891 ,  H01L27/10897

    摘要： A semiconductor memory device is disclosed. The semiconductor memory device includes a memory array block, a first word line and a second word line. The memory array block includes a plurality of adjacent columns of memory cells, each column of memory cells including a plurality of consecutive memory cells having a plurality of respective consecutive cell transistors that comprise at least a first group of cell transistors and a second group of cell transistors. The first word line is disposed above the plurality of respective consecutive cell transistors and electrically connected to the first group of cell transistors, and the second word line is disposed below the plurality of respective consecutive cell transistors and electrically connected to the second group of cell transistors.

    摘要翻译： 公开了一种半导体存储器件。 半导体存储器件包括存储器阵列块，第一字线和第二字线。 存储器阵列块包括多个相邻列的存储器单元，每列存储器单元包括多个连续的存储单元，其具有多个相应的连续单元晶体管，其包括至少第一组单元晶体管和第二组单元 晶体管。 第一字线设置在多个相应的连续单元晶体管的上方并电连接到第一组单元晶体管，第二字线设置在多个相应的连续单元晶体管的下方，并电连接到第二组单元晶体管 。

    SEMICONDUCTOR MEMORY DEVICE WITH HIERARCHICAL BIT LINE STRUCTURE
    4.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE WITH HIERARCHICAL BIT LINE STRUCTURE 有权

    公开(公告)号：US20090154213A1

    公开(公告)日：2009-06-18

    申请号：US12347233

    申请日：2008-12-31

    申请人： Nam-Seog KIM ,  Jong-Cheol LEE ,  Hak-Soo YU ,  Uk-Rae CHO

    发明人： Nam-Seog KIM ,  Jong-Cheol LEE ,  Hak-Soo YU ,  Uk-Rae CHO

    IPC分类号： G11C5/02 ,  G11C8/00 ,  G11C7/06 ,  G11C5/06

    CPC分类号： G11C11/417 ,  G11C7/18 ,  G11C8/12

    摘要： A semiconductor memory device has a hierarchical bit line structure. The semiconductor memory device may include first and second memory cell clusters, which share the same bit line pair and are divided operationally; third and fourth memory cell clusters, which are connected respectively corresponding to word lines coupled with the first and second memory cell clusters, and which share a bit line pair different from the bit line pair and are divided operationally; and a column pass gate for switching one of bit line pairs connected with the first to fourth memory cell clusters, to a common sense amplifier, in response to a column selection signal. Whereby an operating speed decrease caused by load of peripheral circuits connected to the bit line is improved, and the number of column pass gates is reduced substantially with a reduction of chip size.

    SEMICONDUCTOR MEMORY DEVICE WITH HIERARCHICAL BIT LINE STRUCTURE
    5.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE WITH HIERARCHICAL BIT LINE STRUCTURE 有权
    具有分层位线结构的半导体存储器件

    公开(公告)号：US20090154265A1

    公开(公告)日：2009-06-18

    申请号：US12347239

    申请日：2008-12-31

    申请人： Nam-Seog KIM ,  Jong-Cheol LEE ,  Hak-Soo YU ,  Uk-Rae CHO

    发明人： Nam-Seog KIM ,  Jong-Cheol LEE ,  Hak-Soo YU ,  Uk-Rae CHO

    IPC分类号： G11C11/416 ,  G11C8/00

    CPC分类号： G11C11/417 ,  G11C7/18 ,  G11C8/12

    摘要： A semiconductor memory device has a hierarchical bit line structure. The semiconductor memory device may include first and second memory cell clusters, which share the same bit line pair and are divided operationally; third and fourth memory cell clusters, which are connected respectively corresponding to word lines coupled with the first and second memory cell clusters, and which share a bit line pair different from the bit line pair and are divided operationally; and a column pass gate for switching one of bit line pairs connected with the first to fourth memory cell clusters, to a common sense amplifier, in response to a column selection signal. Whereby an operating speed decrease caused by load of peripheral circuits connected to the bit line is improved, and the number of column pass gates is reduced substantially with a reduction of chip size.

    摘要翻译： 半导体存储器件具有分层位线结构。 半导体存储器件可以包括第一和第二存储器单元簇，其共享相同的位线对并且在操作上被分割; 第三和第四存储单元簇，其分别对应于与第一和第二存储器单元簇耦合的字线，并且共享与位线对不同的位线对，并在操作上分割; 以及用于响应于列选择信号将与第一至第四存储器单元簇连接的位线对之一切换到公共读出放大器的列通路。 由此，连接到位线的外围电路的负载导致的工作速度降低得到改善，并且随着芯片尺寸的减小，列通道的数量大幅减少。