公开(公告)号：US5253702A

公开(公告)日：1993-10-19

申请号：US820566

申请日：1992-01-14

申请人： Howard L. Davidson ,  Ehsan Ettehadieh

发明人： Howard L. Davidson ,  Ehsan Ettehadieh

IPC分类号： F28D15/02 ,  H01L23/427

CPC分类号： F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28D15/04 ,  H01L23/427 ,  F28F2210/02 ,  H01L2924/0002 ,  Y10T29/49353

摘要： An integral heat pipe, heat exchanger, and clamping plate. A base plate functioning as an evaporator has disposed in it a multiplicity of intersecting parallel and perpendicular internal channels extending laterally substantially across the base plate. A sintered copper thermal wick is applied to all channels. Thin-walled condenser tubes forming a condenser region are joined to the base plate at intersections of width wise and cross wise channels contained in the base plate. A multiplicity of fins extend to all condenser tubes. For heat pipe arrangements operating in horizontal configurations, all wick-lined channels within the base plate remain open. For heat pipe arrangements intended to operate in oblique or vertical configurations, horizontally extending channels vertically displaced relative to other horizontal channels are isolated from the latter by a multiplicity of plugs. The vertically isolated horizontally extending channels constrain the working fluid and its vapor to remain within a single horizontal channel and yet disperse laterally within the maximum internal dimensions of the evaporator. Condensed working fluid returning from the condenser region to the base plate and subsequently to the heated region via capillary action is cycled more rapidly through the evaporation and condensation phases, thereby increasing the efficiency of the integral heat pipe arrangement.

摘要翻译： 整体热管，热交换器和夹板。 用作蒸发器的基板在其中设置有多个相交的平行和垂直的内部通道，其基本横跨基板横向延伸。 将铜烧结铜芯片应用于所有通道。 形成冷凝器区域的薄壁冷凝器管在包含在基板中的宽度和横向通道的交叉点处接合到基板。 多个翅片延伸到所有冷凝器管。 对于以水平配置工作的热管布置，底板内的所有灯芯通道保持打开。 对于旨在以倾斜或垂直构造操作的热管装置，相对于其他水平通道垂直移位的水平延伸通道通过多个插塞与后者隔离。 垂直隔离的水平延伸的通道约束工作流体及其蒸气以保持在单个水平通道内，并且横向分散在蒸发器的最大内部尺寸内。 通过毛细管作用从冷凝器区域返回到基板并随后通过加热区域的冷凝工作流体通过蒸发和冷凝阶段更快地循环，从而提高整体式热管装置的效率。

公开(公告)号：US5216580A

公开(公告)日：1993-06-01

申请号：US820569

申请日：1992-01-14

申请人： Howard L. Davidson ,  Ehsan Ettehadieh ,  John Schulte

发明人： Howard L. Davidson ,  Ehsan Ettehadieh ,  John Schulte

IPC分类号： F28D15/02 ,  F28D15/04 ,  H01L23/427

CPC分类号： F28D15/046 ,  F28D15/0266 ,  H01L23/427 ,  F28D2021/0031 ,  F28F2013/005 ,  H01L2924/0002 ,  H01L2924/3011

摘要： An optimized integral heat pipe and electronic circuit module arrangement is described. A ceramic multi-chip module bearing electronic circuit components has applied to the side opposite the electronic circuit components preparatory metallization and a thermal wick. A heat pipe evaporator chamber and condenser assembly is attached to the multi-chip module and wick assembly. A suitable working fluid is introduced into the vapor chamber and the vapor chamber hermetically sealed. Application of the thermal wick to the heat producing multi-chip module eliminates the thermal impedance contributed by thermal transmission media used in prior art heat pipe assemblies, permitting a doubling of heat flux from the multi-chip module to the heat pipe evaporator.

摘要翻译： 描述了优化的积分热管和电子电路模块布置。 具有电子电路元件的陶瓷多芯片模块已经应用于电子电路元件准备金属化和热芯的相对侧。 热管式蒸发器室和冷凝器组件连接到多芯片模块和灯芯组件。 将合适的工作流体引入蒸气室并将气室密封。 将热芯应用于制热多芯片模块消除了现有技术热管组件中使用的热传递介质所产生的热阻抗，允许从多芯片模块到热管蒸发器的热通量加倍。

公开(公告)号：US6067225A

公开(公告)日：2000-05-23

申请号：US905464

申请日：1997-08-04

申请人： Naum Reznikov ,  Michael F. McCormick, Jr. ,  Ehsan Ettehadieh ,  Daniel Hruska ,  Anthony N. Eberhardt

发明人： Naum Reznikov ,  Michael F. McCormick, Jr. ,  Ehsan Ettehadieh ,  Daniel Hruska ,  Anthony N. Eberhardt

IPC分类号： G11B33/12 ,  H05K7/14 ,  G06F1/16 ,  H05K5/00 ,  H05K7/16

CPC分类号： G11B33/124 ,  G11B33/122 ,  H05K7/1409 ,  H05K7/1418

摘要： A bracket having two parallel sides and an interconnecting crosspiece is attached to a disk drive or similar peripheral with the sides of the bracket extending longitudinally of the sides of the drive and the crosspiece extending across the front of the drive. A chassis of a computer or the like has internal parallel sides formed with horizontal guides to receive the bracket, a substantially open front face and an internal connector engageable with a mating connector on the rear of the drive when the bracket is fully inserted in the chassis. The sides of the bracket have features to protect the drive from horizontal and vertical vibrations. A handle is pivoted to the crosspiece near one end moveable between at least three positions: a first or latched position parallel to the crosspiece, a second position swinging out at about a 15.degree. angle and a third position at about a 45.degree. angle. In second position a first point on the end of the handle engages the front edge of the side and a second point is about to enter a slot in one side of the chassis. As the handle is pivoted toward third position the second point engages a margin of the slot and pulls the two connectors apart. To reinsert the drive, the positions of the handle are reversed. A spring biased latch engages a hook on handle. A second spring opens the unlatched handle from the first to second positions.

摘要翻译： 具有两个平行侧面和互连横档的托架被附接到盘驱动器或类似的外围设备，其中托架的侧面沿驱动器的侧面纵向延伸并且横档延伸穿过驱动器的前部。 计算机等的底盘具有形成有水平导向器的内部平行侧，用于接收支架，当支架完全插入到底盘中时，基本敞开的前表面和内部连接器可与驱动器后部的配合连接器接合 。 支架的侧面具有保护驱动器免受水平和垂直振动的特征。 手柄枢转到靠近一端的横档，可在至少三个位置之间移动：平行于横档的第一或闩锁位置，以大约15度角摆动的第二位置和大约45度角的第三位置。 在第二位置，手柄的端部上的第一点接合侧面的前边缘，第二点即将进入底盘一侧的槽。 当把手枢转到第三位置时，第二点接合槽的边缘并将两个连接器分开。 要重新插入驱动器，手柄的位置相反。 弹簧偏置的闩锁与手柄上的钩接合。 第二弹簧从第一到第二位置打开解锁手柄。

公开(公告)号：US6081028A

公开(公告)日：2000-06-27

申请号：US514390

申请日：1995-08-11

申请人： Ehsan Ettehadieh ,  Sunil Kaul ,  Dev Malladi

发明人： Ehsan Ettehadieh ,  Sunil Kaul ,  Dev Malladi

IPC分类号： H01L23/42

CPC分类号： H01L23/42 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195

摘要： A thermal conducting material for providing lateral thermal conduction across a surface of an integrated circuit and for enhancing thermal dissipation from the integrated circuit. The integrated circuit is incorporated within a semiconductor device having a cavity package. A layer of the thermal conducting material, preferably electrically non-conductive, is disposed on a surface of an integrated circuit in the form of a die to provide lateral heat conduction to reduce the number of hot spots within the integrated circuit. Alternatively, the thermal conducting, electrically non-conductive material may be used to fill a cavity within the cavity package so that the cavity package dissipates heat in a more effective manner.

摘要翻译： 一种用于在集成电路的表面上提供横向热传导并用于增强集成电路的散热的导热材料。 集成电路结合在具有空腔封装的半导体器件中。 导热材料层优选不导电地设置在芯片形式的集成电路的表面上，以提供横向热传导以减少集成电路内的热点数量。 或者，导热的非导电材料可以用于填充空腔封装内的空腔，使得空腔封装以更有效的方式散热。

公开(公告)号：US06798650B2

公开(公告)日：2004-09-28

申请号：US10021409

申请日：2001-12-12

申请人： Naum Reznikov ,  Michael F. McCormick, Jr. ,  Ehsan Ettehadieh ,  Daniel Hruska ,  Anthony N. Eberhardt

发明人： Naum Reznikov ,  Michael F. McCormick, Jr. ,  Ehsan Ettehadieh ,  Daniel Hruska ,  Anthony N. Eberhardt

IPC分类号： G06F116

CPC分类号： G11B33/124 ,  G11B33/122 ,  H05K7/1409 ,  H05K7/1418 ,  Y10T292/696

摘要： A bracket having two parallel sides and an interconnecting crosspiece is attached to a disk drive or similar peripheral with the sides of the bracket extending longitudinally of the sides of the drive and the crosspiece extending across the front of the drive. A chassis of a computer or the like has internal parallel sides formed with horizontal guides to receive the bracket, a substantially open front face and an internal connector engageable with a mating connector on the rear of the drive when the bracket is fully inserted in the chassis. The sides of the bracket have features to protect the drive from horizontal and vertical vibrations. A handle is pivoted to the crosspiece near one end moveable between at least three positions: a first or latched position parallel to the crosspiece, a second position swinging out at about a 15° angle and a third position at about a 45° angle. In second position a first point on the end of the handle engages the front edge of the side and a second point is about to enter a slot in one side of the chassis. As the handle is pivoted toward third position the second point engages a margin of the slot and pulls the two connectors apart. To reinsert the drive, the positions of the handle are reversed. A spring biased latch engages a hook on the handle. A second spring opens the unlatched handle from the first to second positions.

摘要翻译： 具有两个平行侧面和互连横档的托架被附接到盘驱动器或类似的外围设备，其中托架的侧面沿驱动器的侧面纵向延伸并且横档延伸穿过驱动器的前部。 计算机等的底盘具有形成有水平导向器的内部平行侧，用于接收支架，当支架完全插入到底盘中时，基本敞开的前表面和内部连接器可与驱动器后部的配合连接器接合 。 支架的侧面具有保护驱动器免受水平和垂直振动的特征。 手柄枢转到靠近一端的横档，可在至少三个位置之间移动：平行于横档的第一或闭锁位置，以大约15°角摆动的第二位置和以大约45°角摆动的第三位置。 在第二位置，手柄的端部上的第一点接合侧面的前边缘，第二点即将进入底盘一侧的槽。 当把手枢转到第三位置时，第二点接合槽的边缘并将两个连接器分开。 要重新插入驱动器，手柄的位置相反。 弹簧偏置的闩锁接合手柄上的钩。 第二弹簧从第一到第二位置打开解锁手柄。

公开(公告)号：US06378965B1

公开(公告)日：2002-04-30

申请号：US09490851

申请日：2000-01-24

申请人： Naum Reznikov ,  Michael F. McCormick, Jr. ,  Ehsan Ettehadieh ,  Daniel Hruska ,  Anthony N. Eberhardt

发明人： Naum Reznikov ,  Michael F. McCormick, Jr. ,  Ehsan Ettehadieh ,  Daniel Hruska ,  Anthony N. Eberhardt

IPC分类号： H05K718

CPC分类号： G11B33/124 ,  G11B33/122 ,  H05K7/1409 ,  H05K7/1418 ,  Y10T292/696

摘要： A bracket having two parallel sides and an interconnecting crosspiece is attached to a disk drive or similar peripheral with the sides of the bracket extending longitudinally of the sides of the drive and the crosspiece extending across the front of the drive. A chassis of a computer or the like has internal parallel sides formed with horizontal guides to receive the bracket, a substantially open front face and an internal connector engageable with a mating connector on the rear of the drive when the bracket is fully inserted in the chassis. The sides of the bracket have features to protect the drive from horizontal and vertical vibrations. A handle is pivoted to the crosspiece near one end moveable between at least three positions: a first or latched position parallel to the crosspiece, a second position swinging out at about a 15° angle and a third position at about a 45° angle. In second position a first point on the end of the handle engages the front edge of the side and a second point is about to enter a slot in one side of the chassis. As the handle is pivoted toward third position the second point engages a margin of the slot and pulls the two connectors apart. To reinsert the drive, the positions of the handle are reversed. A spring biased latch engages a hook on handle. A second spring opens the unlatched handle from the first to second positions.

摘要翻译： 具有两个平行侧面和互连横档的托架被附接到盘驱动器或类似的外围设备，其中托架的侧面沿驱动器的侧面纵向延伸并且横档延伸穿过驱动器的前部。 计算机等的底盘具有形成有水平导向器的内部平行侧，用于接收支架，当支架完全插入到底盘中时，基本敞开的前表面和内部连接器可与驱动器后部的配合连接器接合 。 支架的侧面具有保护驱动器免受水平和垂直振动的特征。 手柄枢转到靠近一端的横档，可在至少三个位置之间移动：平行于横档的第一或闭锁位置，以大约15°角摆动的第二位置和以大约45°角摆动的第三位置。 在第二位置，手柄的端部上的第一点接合侧面的前边缘，第二点即将进入底盘一侧的槽。 当把手枢转到第三位置时，第二点接合槽的边缘并将两个连接器分开。 要重新插入驱动器，手柄的位置相反。 弹簧偏置的闩锁与手柄上的钩接合。 第二弹簧从第一到第二位置打开解锁手柄。

公开(公告)号：US5972736A

公开(公告)日：1999-10-26

申请号：US205424

申请日：1998-12-04

申请人： Deviprasad Malladi ,  Mario J. Lee ,  Ehsan Ettehadieh ,  Nagaraj Mitty

发明人： Deviprasad Malladi ,  Mario J. Lee ,  Ehsan Ettehadieh ,  Nagaraj Mitty

IPC分类号： H01L23/24 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/24 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181

摘要： An integrated circuit package with heat slug is disclosed. The heat slug is thermally coupled to one or more semiconductor die using a single layer of high conductivity adhesive. The assembly process of this invention includes the steps of initially attaching a temporary heat slug to the back side of a package body, to which one or more semiconductor die are attached. The semiconductor die are then electrically connected to the package body and encapsulated to maintain fixed positions within the package cavity. The temporary heat slug is then moved and a final heat slug is attached to the package body and the back side of the one or more semiconductor dies utilizing a single layer of high conductivity adhesive. The package is compact, has reduced complexity, and is inexpensive to manufacture.

摘要翻译： 公开了一种具有热塞的集成电路封装。 使用单层高导电性粘合剂将散热块热耦合到一个或多个半导体管芯。 本发明的组装方法包括以下步骤：将临时散热块附接到一个或多个半导体管芯附接到封装主体的背面。 然后将半导体管芯电连接到封装主体并封装以保持封装腔内的固定位置。 然后移动临时热块，并且使用单层高导电性粘合剂将最终的热块附着到封装主体和一个或多个半导体管芯的背面。 封装紧凑，复杂性降低，制造成本低廉。

公开(公告)号：US06502628B1

公开(公告)日：2003-01-07

申请号：US09639959

申请日：2000-08-16

申请人： Hassan Siahpolo ,  Mark Chen ,  Eric Eberhardt ,  Ehsan Ettehadieh

发明人： Hassan Siahpolo ,  Mark Chen ,  Eric Eberhardt ,  Ehsan Ettehadieh

IPC分类号： F28F1312

CPC分类号： H05K7/20172 ,  F28F27/02 ,  G06F1/20 ,  G06F2200/201

摘要： The present invention is a method and apparatus for unidirectional coolant flow control unit for pressurized cooling systems. The invention comprises a valve on a coolant flow control unit. The valve remains in the open position during normal function of the coolant flow control unit. If the coolant flow control unit fails, the valve closes. Thus, the cooling system performs better than prior art cooling systems in the event of a failure of one or more coolant flow control units. In one embodiment, multiple improved coolant flow control units can be implemented wherein a flow of coolant enters one side of the system and exits the other side. In the even of a failure, the closure of the valve is caused by the shifting pressure within the system, which forestalls the cooling problems associated with prior art redundant coolant control flow systems.

摘要翻译： 本发明是用于加压冷却系统的单向冷却剂流量控制单元的方法和装置。 本发明包括在冷却剂流量控制单元上的阀。 在冷却剂流量控制单元的正常功能期间阀保持在打开位置。 如果冷却液流量控制单元出现故障，阀门关闭。 因此，在一个或多个冷却剂流量控制单元发生故障的情况下，冷却系统的性能优于现有技术的冷却系统。 在一个实施例中，可以实现多个改进的冷却剂流量控制单元，其中冷却剂流进入系统的一侧并离开另一侧。 即使发生故障，阀门的关闭是由系统内的换档压力引起的，这将阻止与现有技术的冗余冷却剂控制流系统相关的冷却问题。

公开(公告)号：US5329993A

公开(公告)日：1994-07-19

申请号：US4102

申请日：1993-01-13

申请人： Ehsan Ettehadieh

发明人： Ehsan Ettehadieh

IPC分类号： F28D15/02 ,  H01L23/427

CPC分类号： F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28D15/04 ,  H01L23/427 ,  F28F2210/02 ,  H01L2924/0002 ,  Y10T29/49353

摘要： An integral heat pipe, heat exchanger, and clamping plate. A base plate functioning as an evaporator has disposed in it a multiplicity of intersecting parallel and perpendicular internal channels extending laterally substantially across the base plate. A sintered copper thermal wick is applied to all channels. Thin-walled condenser tubes forming a condenser region are joined to the base plate at intersections of width wise and cross wise channels contained in the base plate. A multiplicity of fins extend to all condenser tubes. For heat pipe arrangements operating in horizontal configurations, all wick-lined channels within the base plate remain open. For heat pipe arrangements intended to operate in oblique or vertical configurations, horizontally extending channels vertically displaced relative to other horizontal channels are isolated from the latter by a multiplicity of plugs. The vertically isolated horizontally extending channels constrain the working fluid and its vapor to remain within a single horizontal channel and yet disperse laterally within the maximum internal dimensions of the evaporator. Condensed working fluid returning from the condenser region to the base plate and subsequently to the heated region via capillary action is cycled more rapidly through the evaporation and condensation phases, thereby increasing the efficiency of the integral heat pipe arrangement.

摘要翻译： 整体热管，热交换器和夹板。 用作蒸发器的基板在其中设置有多个相交的平行和垂直的内部通道，其基本横跨基板横向延伸。 将铜烧结铜芯片应用于所有通道。 形成冷凝器区域的薄壁冷凝器管在包含在基板中的宽度和横向通道的交叉点处接合到基板。 多个翅片延伸到所有冷凝器管。 对于以水平配置工作的热管布置，底板内的所有灯芯通道保持打开。 对于旨在以倾斜或垂直构造操作的热管装置，相对于其他水平通道垂直移位的水平延伸通道通过多个插塞与后者隔离。 垂直隔离的水平延伸的通道约束工作流体及其蒸气以保持在单个水平通道内，并且横向分散在蒸发器的最大内部尺寸内。 通过毛细管作用从冷凝器区域返回到基板并随后通过加热区域的冷凝工作流体通过蒸发和冷凝阶段更快地循环，从而提高整体式热管装置的效率。

公开(公告)号：US5280409A

公开(公告)日：1994-01-18

申请号：US958924

申请日：1992-10-09

申请人： Erich Selna ,  Ehsan Ettehadieh ,  James LaGassa

发明人： Erich Selna ,  Ehsan Ettehadieh ,  James LaGassa

IPC分类号： H05K7/20 ,  H01L23/36 ,  H01L23/40 ,  H05K1/02

CPC分类号： H01L23/4006 ,  H01L23/4093 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2924/0002

摘要： An apparatus providing a heat sink and protective cover for a Tape Automated Bonding ("TAB") integrated circuit mounted on a printed circuit board. The apparatus is comprised of a printed circuit board with a plurality of thermal vias drilled through it. The TAB integrated circuit is mounted on the printed circuit board over the thermal vias. The vias draw then heat generated by the TAB integrated circuit to the other side of the printed circuit board. A heat sink is then placed over the thermal vias on the opposite side of the board to dissipate the heat. The heat sink is held in place by a spring clip which hooks onto a molded plastic cover placed over the TAB integrated circuit. The apparatus is easy to manufacture and efficiently dissipates the heat generated by TAB integrated circuits.

摘要翻译： 一种为安装在印刷电路板上的磁带自动粘合（“TAB”）集成电路提供散热器和保护盖的设备。 该装置包括具有穿过其穿过的多个热通孔的印刷电路板。 TAB集成电路通过热通孔安装在印刷电路板上。 通孔将TAB集成电路产生的热量吸引到印刷电路板的另一侧。 然后将散热器放置在板的相对侧上的热通孔上，以散热。 散热器通过弹簧夹固定在适当位置，弹簧夹钩挂在放置在TAB集成电路上的模制塑料盖上。 该设备易于制造并有效地消散TAB集成电路产生的热量。