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    Sliding shell
    1.
    发明申请
    Sliding shell 审中-公开
    滑壳

    公开(公告)号：US20070060219A1

    公开(公告)日：2007-03-15

    申请号：US11221741

    申请日：2005-09-09

    Applicant: Hung-Chih Lin ,  Shun-Fan Cheng

    Inventor： Hung-Chih Lin ,  Shun-Fan Cheng

    IPC: H04M1/00

    CPC classification number: H04M1/0235

    Abstract: A sliding shell comprises a first shell body with a first surface, a first interface layer formed by coating a smooth material on the first surface, a first sliding assembly formed on the first surface of the first shell body, a second shell body with a second surface, and a second sliding assembly formed on the second surface of the second shell body. The second sliding. assembly is correspondingly connected to the first sliding assembly to allow the first shell body sliding between the first position and the second position on the second shell body. In addition, the first interface layer overlaps the second surface, and thus the first interface layer can make the sliding between two shell bodies with benefits of smooth sliding and abrasion prevention.

    Abstract translation: 滑动壳体包括具有第一表面的第一壳体，通过在第一表面上涂覆光滑材料形成的第一界面层，形成在第一壳体的第一表面上的第一滑动组件，具有第二壳体的第二壳体 表面和形成在第二壳体的第二表面上的第二滑动组件。 第二滑。 组件相应地连接到第一滑动组件，以允许第一壳体在第二壳体上的第一位置和第二位置之间滑动。 此外，第一界面层与第二表面重叠，因此第一界面层可以在两个壳体之间滑动，具有平滑滑动和防磨损的优点。

    Adaptive test sequence for testing integrated circuits
    2.
    发明授权
    Adaptive test sequence for testing integrated circuits 有权
    用于测试集成电路的自适应测试序列

    公开(公告)号：US09310437B2

    公开(公告)日：2016-04-12

    申请号：US13072325

    申请日：2011-03-25

    Applicant: Chun-Cheng Chen ,  Hung-Chih Lin ,  Mill-Jer Wang ,  Hao Chen ,  Ching-Nen Peng

    Inventor： Chun-Cheng Chen ,  Hung-Chih Lin ,  Mill-Jer Wang ,  Hao Chen ,  Ching-Nen Peng

    IPC: G01R31/02 ,  G01R31/319 ,  G01R31/3183 ,  G01R31/3185

    CPC classification number: G01R31/31919 ,  G01R31/318371 ,  G01R31/318511

    Abstract: A method includes testing a first device and a second device identical to each other and comprising integrated circuits. The testing of the first device is performed according to a first test sequence of the first device, wherein the first test sequence includes a plurality of ordered test items, and wherein the first test sequence includes a test item. A test priority of the test item is calculated based on a frequency of fails of the test item in the testing of a plurality of devices having an identical structure as the first device. The first test sequence is then adjusted to generate a second test sequence in response to the test priority of the test item, wherein the second test sequence is different from the first test sequence. The second device is tested according to the second test sequence.

    Abstract translation: 一种方法包括测试彼此相同并包括集成电路的第一设备和第二设备。 根据第一装置的第一测试顺序执行第一装置的测试，其中第一测试序列包括多个有序测试项目，并且其中第一测试序列包括测试项目。 基于与具有与第一装置相同的结构的多个装置的测试中的测试项目的失败频率来计算测试项目的测试优先级。 然后调整第一测试序列以响应于测试项目的测试优先级产生第二测试序列，其中第二测试序列与第一测试序列不同。 根据第二个测试顺序对第二个设备进行测试。

    Dynamic testing based on thermal and stress conditions
    4.
    发明授权
    Dynamic testing based on thermal and stress conditions 有权
    基于热和应力条件的动态测试

    公开(公告)号：US08836355B2

    公开(公告)日：2014-09-16

    申请号：US13082769

    申请日：2011-04-08

    Applicant: Mill-Jer Wang ,  Ching Nen Peng ,  Hung-Chih Lin ,  Hao Chen

    Inventor： Mill-Jer Wang ,  Ching Nen Peng ,  Hung-Chih Lin ,  Hao Chen

    IPC: G01R31/10 ,  G01R31/28

    CPC classification number: G01R31/287 ,  G01R31/2856 ,  G01R31/2863 ,  G01R31/2874 ,  G01R31/2875

    Abstract: A plurality of sets of test conditions of a die in a stacked system is established, wherein the plurality of test conditions are functions of temperatures of the die, and wherein the stacked system comprises a plurality of stacked dies. A temperature of the die is measured. A respective set of test conditions of the die is found from the plurality of sets of test conditions, wherein the set of test conditions corresponds to the temperature. The die is at the temperature using the set of test conditions to generate test results.

    Abstract translation: 建立了堆叠系统中的模具的多组测试条件，其中多个测试条件是模具的温度的函数，并且其中堆叠的系统包括多个堆叠的模具。 测量模具的温度。 从多组测试条件中可以找到相应的模具测试条件，其中该组测试条件对应于温度。 模具在使用一组测试条件的温度下产生测试结果。

    Backlight module with heat dissipating element and heat sink
    5.
    发明授权
    Backlight module with heat dissipating element and heat sink 有权
    带散热元件和散热片的背光模组

    公开(公告)号：US08573811B2

    公开(公告)日：2013-11-05

    申请号：US13073057

    申请日：2011-03-28

    Applicant: Hung-Chih Lin ,  Yi-Wen Lin

    Inventor： Hung-Chih Lin ,  Yi-Wen Lin

    IPC: F21V29/00

    CPC classification number: G02B6/0085

    Abstract: A backlight module includes a light guide plate, a back plate, a heat-dissipating element, a light-emitting element, and at least one high-performance heat sink. The heat-dissipating element is disposed adjacent to a light incident surface of the light guide plate, and the heat-dissipating element has a bottom portion and a side portion forming an angle with the bottom portion. The light-emitting element is disposed on one side of the heat-dissipating element facing the light guide plate. The high-performance heat sink is disposed on the back plate, one end of the high-performance heat sink overlaps the heat-dissipating element, and another end of the high-performance heat sink extends away from the light-emitting element.

    Abstract translation: 背光模块包括导光板，背板，散热元件，发光元件和至少一个高性能散热器。 所述散热元件与所述导光板的光入射面相邻配置，所述散热元件具有与所述底部形成角度的底部和侧面部。 发光元件设置在散热元件面向导光板的一侧。 高性能散热器设置在背板上，高性能散热器的一端与散热元件重叠，高性能散热器的另一端远离发光元件。

    Power Compensation in 3DIC Testing
    8.
    发明申请
    Power Compensation in 3DIC Testing 有权
    3DIC测试中的功率补偿

    公开(公告)号：US20120242346A1

    公开(公告)日：2012-09-27

    申请号：US13053951

    申请日：2011-03-22

    Applicant: Mill-Jer Wang ,  Ching Nen Peng ,  Hung-Chih Lin ,  Hao Chen

    Inventor： Mill-Jer Wang ,  Ching Nen Peng ,  Hung-Chih Lin ,  Hao Chen

    IPC: G01R31/02

    CPC classification number: G01R31/318513 ,  G01R31/2886

    Abstract: A device, such as a 3DIC stacked device includes a first device under test (DUT) connected to a first force pad by a first through substrate via (TSV) stack and connected to a first sense pad by a second TSV stack. The device further includes a second DUT stacked above the first DUT and connected to a second force pad and a second force pad by a second third TSV and connected to a second sense pad by a fourth TSV. Functional blocks on either the first or second blocks can be accessed for testing by way of the TSVs. In some applications the TSVs are vertically aligned to form TSV stacks.

    Abstract translation: 诸如3DIC堆叠设备的设备包括被第一通过衬底经由（TSV）堆叠连接到第一力垫的第一被测设备（DUT），并且通过第二TSV堆叠连接到第一感测焊盘。 该装置还包括堆叠在第一DUT上方的第二DUT，并通过第二个第三TSV连接到第二强制焊盘和第二受力垫，并通过第四TSV连接到第二传感焊盘。 可以访问第一或第二块上的功能块，以便通过TSV进行测试。 在一些应用中，TSV被垂直对准以形成TSV堆叠。

    Production Flow and Reusable Testing Method
    10.
    发明申请
    Production Flow and Reusable Testing Method 有权
    生产流程和可重复使用的测试方法

    公开(公告)号：US20130078745A1

    公开(公告)日：2013-03-28

    申请号：US13247071

    申请日：2011-09-28

    Applicant: Mill-Jer Wang ,  Ching-Nen Peng ,  Hung-Chih Lin ,  Hao Chen

    Inventor： Mill-Jer Wang ,  Ching-Nen Peng ,  Hung-Chih Lin ,  Hao Chen

    IPC: G01R31/00 ,  H01L21/66

    CPC classification number: H01L22/32 ,  G01R31/2884 ,  H01L22/14 ,  H01L22/20

    Abstract: An embodiment is a method. The method comprises providing a substrate comprising a die area. The die area comprises sections of pad patterns, and first sections of the sections each comprise a first uniform pad pattern. The method further comprises probing a first one of the first sections with a first probe card; stepping the first probe card to a second one of the first sections; and probing the second one of the first sections with the first probe card.

    Abstract translation: 实施例是一种方法。 该方法包括提供包括管芯区域的衬底。 管芯区域包括焊盘图案的部分，并且这些部分的第一部分各自包括第一均匀焊盘图案。 该方法还包括用第一探针卡探测第一部分中的第一部分; 将第一探针卡推到第一部分的第二部分; 并用第一个探针卡探测第一个部分的第二个部分。

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