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    HEAT SINK
    1.
    发明申请
    HEAT SINK 审中-公开
    散热器

    公开(公告)号：US20100006260A1

    公开(公告)日：2010-01-14

    申请号：US12496930

    申请日：2009-07-02

    申请人： Hyun-Jong OH ,  Chan-Hyung Yun ,  Dong-Woo Shin ,  Jin-Kyu Yang ,  Jae-Chan Lee

    发明人： Hyun-Jong OH ,  Chan-Hyung Yun ,  Dong-Woo Shin ,  Jin-Kyu Yang ,  Jae-Chan Lee

    IPC分类号： F28F3/00

    CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink includes a base plate and at least one elastic plate. The base plate is connected to a heat generator such as a semiconductor chip. One end portion of the elastic plate is connected to the base plate and the elastic plate has a zigzag structure to ensure desired elasticity. The elastic plate dissipates the heat generated from the heat generator.

    摘要翻译： 散热器包括基板和至少一个弹性板。 底板连接到诸如半导体芯片的发热体。 弹性板的一个端部连接到基板，并且弹性板具有锯齿形结构以确保期望的弹性。 弹性板消散了发热体产生的热量。

    Heat sink for dissipating heat and apparatus having the same
    2.
    发明授权
    Heat sink for dissipating heat and apparatus having the same 有权
    用于散热的散热器和具有相同功能的设备

    公开(公告)号：US07920383B2

    公开(公告)日：2011-04-05

    申请号：US12265101

    申请日：2008-11-05

    申请人： Jin-Kyu Yang ,  Dong-Woo Shin ,  Hyun-Jong Oh

    发明人： Jin-Kyu Yang ,  Dong-Woo Shin ,  Hyun-Jong Oh

    IPC分类号： H05K7/20

    CPC分类号： H01L23/3675 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink includes first and second base plates to contact with first and second surfaces of a heat source, respectively. The first base plate includes a support unit protruding from a first surface and a first dissipating unit to dissipate heat from the heat source. The second base plate includes a penetrating hole spaced apart from an edge portion to hold the support unit and a second dissipating unit to dissipate the heat from the heat source. A coupling member is positioned on an upper surface of the support unit and applies a force to the first and second base plates to thereby combine the first and second base plates to the heat source. The base plates are combined to the memory module without any loss of the surface area of the dissipating fin, to thereby improve the dissipation efficiency of the heat sink.

    摘要翻译： 散热器包括分别与热源的第一和第二表面接触的第一和第二基板。 第一基板包括从第一表面突出的支撑单元和第一散热单元，以从热源散发热量。 第二基板包括与边缘部分间隔开以保持支撑单元的穿透孔和用于消散来自热源的热量的第二消散单元。 联接构件定位在支撑单元的上表面上，并且向第一和第二基板施加力，从而将第一和第二基板组合到热源。 将基板组合到存储器模块中，而不会损耗散热片的表面积，从而提高散热器的散热效率。

    Heat spreader, semiconductor package module and memory module having the heat spreader
    5.
    发明授权
    Heat spreader, semiconductor package module and memory module having the heat spreader 有权
    散热器，半导体封装模块和具有散热器的存储模块

    公开(公告)号：US07518873B2

    公开(公告)日：2009-04-14

    申请号：US11481179

    申请日：2006-07-06

    申请人： Chang-Yong Park ,  Hyun-Jong Oh ,  Yong-Hyun Kim ,  Dong-Woo Shin ,  Kyung-Du Kim ,  Dong-Chun Lee ,  Kwang-Ho Chun

    发明人： Chang-Yong Park ,  Hyun-Jong Oh ,  Yong-Hyun Kim ,  Dong-Woo Shin ,  Kyung-Du Kim ,  Dong-Chun Lee ,  Kwang-Ho Chun

    IPC分类号： H05K7/20 ,  H01L23/34 ,  F28F7/00

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.

    摘要翻译： 散热器包括散热板和压力夹。 散热板将热量从热源辐射出来。 压力夹将散热板固定在热源上。 压力夹包括一个脊柱（按压部分），一个或多个肋和钩部件。 脊柱布置在散热板上。 一个或多个肋从脊部延伸并接触热源。 钩部分从脊柱延伸并由热源支撑。 压力夹还包括将脊柱连接到钩部件的安装部件。 在脊柱和散热板之间形成弯曲空间。 散热器可以用例如一触式方式附接到印刷电路板（PCB），使得存储器模块的组装过程可以自动化。

    Heat spreader, semiconductor package module and memory module having the heat spreader
    6.
    发明申请
    Heat spreader, semiconductor package module and memory module having the heat spreader 有权
    散热器，半导体封装模块和具有散热器的存储模块

    公开(公告)号：US20070008703A1

    公开(公告)日：2007-01-11

    申请号：US11481179

    申请日：2006-07-06

    申请人： Chang-Yong Park ,  Hyun-Jong Oh ,  Yong-Hyun Kim ,  Dong-Woo Shin ,  Kyung-Du Kim ,  Dong-Chun Lee ,  Kwang-Ho Chun

    发明人： Chang-Yong Park ,  Hyun-Jong Oh ,  Yong-Hyun Kim ,  Dong-Woo Shin ,  Kyung-Du Kim ,  Dong-Chun Lee ,  Kwang-Ho Chun

    IPC分类号： H05K7/20 ,  F28F7/00

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.

    摘要翻译： 散热器包括散热板和压力夹。 散热板将热量从热源辐射出来。 压力夹将散热板固定在热源上。 压力夹包括一个脊柱（按压部分），一个或多个肋和钩部件。 脊柱布置在散热板上。 一个或多个肋从脊部延伸并接触热源。 钩部分从脊柱延伸并由热源支撑。 压力夹还包括将脊柱连接到钩部件的安装部件。 在脊柱和散热板之间形成弯曲空间。 散热器可以用例如一触式方式附接到印刷电路板（PCB），使得存储器模块的组装过程可以自动化。