摘要:
A thin film transistor (TFT) and method of fabricating the same. A planarization layer of polymer is formed on the interlayer to reduce short-circuit. The planarization layer further reduces the capacitance of the crossover capacitor and the delay time of the LCD panel using the TFT is therefor minimized. A gate thereof can be design under the data line to increase aperture ratio.
摘要:
A reflective and a transflective liquid crystal display device and a manufacturing method thereof are provided. The manufacturing method includes the following steps. First, a substrate structure of a reflective or a transflective liquid crystal display device is provided. Next, a reflection layer is formed over the substrate structure, a protection layer is formed over the reflection layer, and a photoresist layer is formed over the protection layer. Then, the photoresist layer is patterned to form a patterned photoresist layer, the protection layer is patterned to form a patterned protection layer, and the reflection layer is patterned to form a patterned reflection layer. Thereafter, the patterned photoresist layer is removed.
摘要:
Systems for displaying images and methods for fabricating the same. A representative system includes a substrate having a display region and a peripheral region, and a mosaic color filter pattern formed in the peripheral region. The mosaic color filter pattern includes a plurality of separated pillars and a plurality of channels adjacent to the pillars. Specifically the volume ratio between the pillars and the channel is 1:5 to 2:1, preferably 1:3 to 1:1.
摘要:
A structure of an amorphous-silicon thin film transistor array comprises a substrate, a gate electrode, a gate insulating layer, an amorphous-silicon active layer, an n+ amorphous-silicon layer and a metal layer. The metal layer defines a source electrode and a drain electrode. The structure simplifies the photolithography process by using a less number of masks to manufacture thin film transistors. It also reduces the occurrence of open circuits in the first metal (MI) layer or short circuits between the MI layer and the second metal (MII) layer caused by the photoresist residue or particle contamination. The manufacturing method combines a conventional back-channel-etched (BCE) reduced mask process and a two-step exposure technology. The two-step exposure technology uses two photoresist pattern masks. One is a pattern mask for complete exposure with higher light intensity and the other is a pattern mask for incomplete exposure with lower light intensity. The photoresist pattern with incomplete exposure is then etched by an O2 plasma etching process. The amorphous-silicon layer and the metal layer has the characteristic of an island metal masking structure that protects the active layer from plasma damage in plasma etching process.
摘要:
Systems for displaying images and methods for fabricating the same. A representative system includes a substrate having a display region and a peripheral region, and a mosaic color filter pattern formed in the peripheral region. The mosaic color filter pattern includes a plurality of separated pillars and a plurality of channels adjacent to the pillars. Specifically the volume ratio between the pillars and the channel is 1:5 to 2:1, preferably 1:3 to 1:1.
摘要:
A thin film transistor design is described which is not subject to either dark or photo current leakage. The process to manufacture this device begins with the formation of a gate electrode on a transparent substrate followed by its over coating with layers of gate insulation, undoped amorphous silicon, doped amorphous silicon, and a second layer of chromium. The chromium and amorphous silicon layers are then patterned and etched to form a channel pedestal. In a key feature of the invention the vertical side walls of this pedestal are then given a protective coating of oxide or nitride, forming spacers. This is then followed by the deposition of second level metal which is etched to form source and drain electrodes with a suitable gap between them.
摘要:
A polymer of the following formula: ##STR1## wherein m is an integer from 1 to 100; n is an integer from 0 to 3; each of X and Y, independently, is biphenyl, 1,4-phenylene, or halogen-substituted 1,4-phenylene; and Z is R, --O--(C.dbd.O)--R, or --(C.dbd.O)--O--R, wherein R is selected from (2R)-2-(C.sub.4-8 alkyl), (1S,2S)-1-halo-2-methyl-1-(C.sub.3-5 alkyl), (2S)-2-methyl-1-(C.sub.4-7 alkyl), (2S)-1-halo-2-methyl-3-propyl, and (2S)-3-halo-2-methyl-1-(C.sub.4-7 alkyl); anda monomer of the following formula:H.sub.2 C.dbd.CH.sub.2 CH.sub.2 --(OCH.sub.2 CH.sub.2).sub.n --O--X--(C.dbd.O)--O--Y--Zwherein n is an integer from 0 to 3; each of X and Y independently is biphenyl, 1,4-phenylene, or halogen-substituted 1,4-phenylene; and Z is R, --O--(C.dbd.O)--R, or --(C.dbd.O)--O--R, wherein R is selected from (2R)-2-(C.sub.4-8 alkyl), (1S,2S)-1-halo-2-methyl-1-(C.sub.3-5 alkyl), (2S)-2-methyl-1-(C.sub.5-7 alkyl), (2S)-1-halo-2-methyl-3-propyl, and (2S)-3-halo-2-methyl-1-(C.sub.4-7 alkyl).
摘要:
A method of fabricating an array of structures sensitive to ESD is disclosed. First, an array of structures is provided on a substrate, with the structures conductively coupled by interconnections. Thereafter, the interconnections are removed before fabricating another array of structures. Therefore, the structures have equal potential. Further, an electrostatic discharge structure is provided near the periphery of the substrates.
摘要:
Within a method for forming a thin film transistor (TFT) structure, there is first provided a substrate. There is then formed over the substrate a gate electrode. There is then formed adjacent to the gate electrode but not covering a top surface of the gate electrode a backfilling dielectric layer. There is then formed over and covering the top surface of the gate electrode a gate dielectric layer. There is then formed over and covering the gate dielectric layer an active semiconductor layer. Finally, there is then formed over and in electrical communication with the active semiconductor layer a pair of source/drain electrodes, where the pair of source/drain electrodes having a separation distance which defines a channel region of the active semiconductor layer. The method for forming the thin film transistor (TFT) structure contemplates a thin film transistor (TFT) structure fabricated in accord with the method for forming the thin film transistor (TFT) structure. The method provides the thin film transistor (TFT) structure with enhanced functionality and reliability.
摘要:
A method for fabricating a BCE type TFT array by using reduced number of masks and devices formed are disclosed. In the method, only five masks are required for forming the BCE type TFT array which is less than that normally required in a typical TFT fabrication process, i.e., at least six masks. The five masks required in the present invention process are a first mask for gate busline patterning, a second mask for island and S/D data line patterning, a third mask for the data line, TFT channel and Cst patterning, a fourth mask for the passivation layer patterning and a fifth mask for the conductive electrode layer patterning. The present invention novel method produces a TFT that has improved contact resistance between the S/D metal and the n+ amorphous silicon layer. The improved contact resistance is achieved by an immediate deposition process of a S/D metal thin film after the deposition of the n+ amorphous silicon layer such that any exposure of the interface to chemical contaminants and native oxide is substantially reduced or eliminated. The present invention novel method further provides the benefit that the Metal 2 layer shields the TFT island structure from plasma damages and residual photoresists resulting in a TFT array structure of improved reliability.