公开(公告)号：US09363891B2

公开(公告)日：2016-06-07

申请号：US14680463

申请日：2015-04-07

Applicant: IBIDEN CO., LTD.

Inventor： Satoru Kawai ,  Kenji Sakai ,  Liyi Chen

IPC: H05K1/11 ,  H05K1/09 ,  H05K7/12 ,  H05K3/40 ,  H05K1/02 ,  H05K1/03 ,  H05K3/34 ,  H05K3/20 ,  H05K3/46

CPC classification number: H05K1/112 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/032 ,  H05K1/113 ,  H05K3/205 ,  H05K3/3457 ,  H05K3/4007 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/09472 ,  H05K2201/096 ,  H05K2203/0361 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a conductive circuit formed on the second surface of the resin insulation layer, and a via conductor formed in the opening and connecting the pad and the conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.

Abstract translation: 印刷电路板包括树脂绝缘层，该树脂绝缘层具有在第一表面的相对侧上的第一表面和第二表面，树脂绝缘层具有用于通路导体的开口，形成在树脂绝缘层的第一表面上的焊盘 并且提供用于安装电子部件，形成在树脂绝缘层的第二表面上的导电电路和形成在开口中并连接焊盘和导电电路的通孔导体。 垫具有嵌入在树脂绝缘层中的嵌入部分和从树脂绝缘层突出的突出部分，并且嵌入部分具有大于突出部分的外部形状的外部形状。

公开(公告)号：US09357660B2

公开(公告)日：2016-05-31

申请号：US14067080

申请日：2013-10-30

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiro Yoshikawa ,  Liyi Chen ,  Toshiki Furutani

IPC: H05K1/18 ,  H05K3/46 ,  H01L23/498 ,  H01L23/538 ,  H05K1/16

CPC classification number: H05K3/4644 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L2924/0002 ,  H01L2924/3511 ,  H05K1/165 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/00

Abstract: A printed wiring board includes a core substrate having opening, an electronic component device accommodated in the opening of the substrate and including inductor and passive components, a wiring structure connecting the inductor and passive components in the electronic device, a filler resin body filling space formed between the substrate and electronic device in the opening of the substrate, a first buildup layer including a first interlayer insulation layer on first surface of the substrate, a first conductive layer on the first insulation layer, and a first via conductor in the first insulation layer, and a second buildup layer including a second interlayer insulation layer on second surface of the substrate on the opposite side of the first surface of the substrate, a second conductive layer on the second insulation layer, and a second via conductor in the second insulation layer.

Abstract translation: 印刷电路板包括具有开口的芯基板，容纳在基板的开口中并包括电感器和无源部件的电子部件装置，连接电子装置中的电感器和无源部件的布线结构，填充树脂体填充空间 在衬底和电子器件之间的衬底的开口中的第一堆积层，在衬底的第一表面上包括第一层间绝缘层，第一绝缘层上的第一导电层和第一绝缘层中的第一通孔导体 以及第二累积层，其在基板的第一表面的相反侧的第二表面上包括第二层间绝缘层，第二绝缘层上的第二导电层和第二绝缘层中的第二通孔导体 。

公开(公告)号：US20150216050A1

公开(公告)日：2015-07-30

申请号：US14680463

申请日：2015-04-07

Applicant: IBIDEN CO., LTD.

Inventor： Satoru KAWAI ,  Kenji Sakai ,  Liyi Chen

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/34 ,  H05K1/02

CPC classification number: H05K1/112 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/032 ,  H05K1/113 ,  H05K3/205 ,  H05K3/3457 ,  H05K3/4007 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/09472 ,  H05K2201/096 ,  H05K2203/0361 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a conductive circuit formed on the second surface of the resin insulation layer, and a via conductor formed in the opening and connecting the pad and the conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.

Abstract translation: 印刷电路板包括树脂绝缘层，该树脂绝缘层具有在第一表面的相对侧上的第一表面和第二表面，树脂绝缘层具有用于通路导体的开口，形成在树脂绝缘层的第一表面上的焊盘 并且提供用于安装电子部件，形成在树脂绝缘层的第二表面上的导电电路和形成在开口中并连接焊盘和导电电路的通孔导体。 垫具有嵌入在树脂绝缘层中的嵌入部分和从树脂绝缘层突出的突出部分，并且嵌入部分具有大于突出部分的外部形状的外部形状。