公开(公告)号：US09480173B2

公开(公告)日：2016-10-25

申请号：US14522742

申请日：2014-10-24

Applicant: IBIDEN Co., Ltd.

Inventor： Teruyuki Ishihara ,  Michimasa Takahashi ,  Takashi Kariya

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/46 ,  H05K3/36

CPC classification number: H05K3/4691 ,  H05K2201/0187 ,  H05K2203/308

Abstract: A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer formed on first surfaces of the flexible and non-flexible substrates, a second wiring layer embedded in second surfaces of the flexible and non-flexible substrates, a first insulating layer covering the first surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the first surface of the flexible substrate, and a second insulating layer covering the second surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the second surface of the flexible substrate. The first wiring layer includes non-embedded wirings on the first surfaces of the flexible and non-flexible substrates, and the second wiring layer includes embedded wirings in the second surfaces of the flexible and non-flexible substrates.

Abstract translation: 挠性刚性布线板包括柔性基板，非柔性基板，定位成使得非柔性基板在柔性基板的水平方向上延伸;形成在柔性和非柔性基板的第一表面上的第一布线层 嵌入在所述柔性和非柔性基板的第二表面中的第二布线层，覆盖所述柔性和非柔性基板的所述第一表面的第一绝缘层，并且具有暴露柔性基板的第一表面的一部分的开口， 以及覆盖所述柔性和非柔性基板的第二表面的第二绝缘层，并且具有露出柔性基板的第二表面的一部分的开口。 第一布线层包括在柔性和非柔性基板的第一表面上的非嵌入布线，并且第二布线层包括在柔性和非柔性基板的第二表面中的嵌入布线。

公开(公告)号：US09277650B2

公开(公告)日：2016-03-01

申请号：US14542753

申请日：2014-11-17

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki Ishihara ,  Michimasa Takahashi

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H05K3/36 ,  H05K3/00

CPC classification number: H05K1/142 ,  H05K1/0228 ,  H05K1/0271 ,  H05K1/144 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/2018 ,  H05K2201/2072 ,  H05K2203/0169 ,  Y10T29/49126

Abstract: A combined wiring board includes multiple wiring boards, and a connected metal frame having multiple metal frames and one or more connecting portions such that the metal frames are connected each other by the connecting portion or connecting portions and have accommodation opening portions formed to accommodate the wiring boards, respectively.

Abstract translation: 组合布线板包括多个布线板，以及具有多个金属框架和一个或多个连接部分的连接的金属框架，使得金属框架通过连接部分或连接部分彼此连接，并具有容纳布线的容纳开口部分 板。

公开(公告)号：US20150245474A1

公开(公告)日：2015-08-27

申请号：US14707379

申请日：2015-05-08

Applicant: IBIDEN CO., LTD.

Inventor： Michimasa Takahashi ,  Teruyuki Ishihara

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/111 ,  H05K1/115 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/368 ,  H05K3/46 ,  H05K3/4691 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T156/10

Abstract: A wiring board includes a first multilayer wiring board having a built-in electronic component and first conductive layers, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing a surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer.

Abstract translation: 布线板包括具有内置电子部件和第一导电层的第一多层布线板，具有第二导电层的第二多层布线板，并且定位成使得第二多层布线板具有面对第一多层布线的表面的表面 以及包含粘合片的粘合剂层，并且插入在第一多层布线板和第二多层布线板之间，使得粘合层粘附第一多层布线板和第二多层布线板。 第一多层布线板在第一多层布线板的表面上具有第一焊盘，第二多层布线板在第二多层布线板的表面上具有第二焊盘，第一焊盘和第二焊盘定位成使得 第一垫和第二垫彼此面对粘合剂层。

公开(公告)号：US09538663B2

公开(公告)日：2017-01-03

申请号：US14077563

申请日：2013-11-12

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki Ishihara ,  Michimasa Takahashi

IPC: H05K1/14 ,  H05K3/00

CPC classification number: H05K3/00 ,  H05K3/0097 ,  H05K2201/096 ,  H05K2201/10545 ,  H05K2203/0169 ,  H05K2203/167 ,  Y10T29/49124

Abstract: A method for manufacturing a combined wiring board includes providing a metal frame having an accommodation opening portion, positioning a wiring board in the accommodation opening portion of the metal frame, and subjecting the metal frame to plastic deformation such that a sidewall of the wiring board is connected to a sidewall of the metal frame inside the accommodation opening portion of the metal frame.

Abstract translation: 一种组合布线板的制造方法，其特征在于，具备：具有容纳开口部的金属框架，将金属框架的容纳开口部配置布线基板，使金属框架发生塑性变形，使布线基板的侧壁成为 连接到金属框架的侧壁在金属框架的容纳开口部分内。

公开(公告)号：US09425137B2

公开(公告)日：2016-08-23

申请号：US14552771

申请日：2014-11-25

Applicant: IBIDEN CO., LTD.

Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC: H01L23/053 ,  H01L23/12 ,  H05K1/11 ,  H01L23/498 ,  H01L23/538 ,  H05K3/46 ,  H05K1/02 ,  H05K1/09 ,  H05K1/18 ,  H05K3/00 ,  H05K3/40

CPC classification number: H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/116 ,  H05K1/18 ,  H05K3/0011 ,  H05K3/0094 ,  H05K3/4069 ,  H05K3/4611 ,  H05K3/4623 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09854 ,  Y10T156/1056

Abstract: A wiring board includes multiple insulating layers including first, second, third, fourth and fifth insulation layers laminated in the order of the first, second, third, fourth and fifth insulation layers. The first insulation layer has a first conductor including plating, the second insulation layer has a second conductor including plating, the third insulation layer has a third conductor including conductive paste, the fourth insulation layer has a fourth conductor including plating, the fifth insulation layer has a fifth conductor including plating, and the first conductor, the second conductor, the third conductor, the fourth conductor and the fifth conductor are formed along the same axis and are electrically continuous with each other.

Abstract translation: 布线板包括多个绝缘层，包括以第一，第二，第三，第四和第五绝缘层的顺序层叠的第一，第二，第三，第四和第五绝缘层。 所述第一绝缘层具有包括电镀的第一导体，所述第二绝缘层具有包括电镀的第二导体，所述第三绝缘层具有包括导电糊的第三导体，所述第四绝缘层具有包括电镀的第四导体，所述第五绝缘层具有 包括电镀的第五导体，并且第一导体，第二导​​体，第三导体，第四导体和第五导体沿着相同的轴线形成并且彼此电连接。

公开(公告)号：US20150055313A1

公开(公告)日：2015-02-26

申请号：US14465127

申请日：2014-08-21

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Michimasa Takahashi

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K3/0097 ,  H05K3/0032 ,  H05K3/0052 ,  H05K3/3494 ,  H05K2201/0909 ,  H05K2201/10424 ,  Y10T29/49126

Abstract: A method for manufacturing a combined wiring board includes preparing wiring boards, preparing a metal frame having opening portions formed to accommodate the wiring boards, respectively, positioning the wiring boards in the opening portions in the metal frame, and forming crimped portions in the metal frame by plastic deformation such that sidewalls of the metal frame in the opening portions bond sidewalls of each of the wiring boards. The crimped portions are formed such that the crimped portions in the metal frame have amounts of the plastic deformation which are set different for positions of the crimped portions in the metal frame.

Abstract translation: 一种组合布线板的制造方法，其特征在于，准备配线基板，分别配置形成为容纳布线基板的开口部的金属框架，将布线基板定位在金属框架的开口部，在金属框架内形成卷曲部 通过塑性变形使得开口部分中的金属框架的侧壁粘合每个布线板的侧壁。 卷边部分形成为使得金属框架中的卷曲部分具有对于金属框架中的卷曲部分的位置设定的塑性变形量。

公开(公告)号：US09844151B2

公开(公告)日：2017-12-12

申请号：US14492424

申请日：2014-09-22

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki Ishihara ,  Michimasa Takahashi

IPC: H05K3/36 ,  H05K3/00

CPC classification number: H05K3/368 ,  H05K3/0097 ,  H05K2201/10598 ,  H05K2201/2018 ,  H05K2203/0152 ,  H05K2203/1484 ,  Y10T29/49126

Abstract: A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards.

公开(公告)号：US09635765B2

公开(公告)日：2017-04-25

申请号：US14465127

申请日：2014-08-21

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki Ishihara ,  Michimasa Takahashi

IPC: H05K3/00 ,  H05K3/34

CPC classification number: H05K3/0097 ,  H05K3/0032 ,  H05K3/0052 ,  H05K3/3494 ,  H05K2201/0909 ,  H05K2201/10424 ,  Y10T29/49126

Abstract: A method for manufacturing a combined wiring board includes preparing wiring boards, preparing a metal frame having opening portions formed to accommodate the wiring boards, respectively, positioning the wiring boards in the opening portions in the metal frame, and forming crimped portions in the metal frame by plastic deformation such that sidewalls of the metal frame in the opening portions bond sidewalls of each of the wiring boards. The crimped portions are formed such that the crimped portions in the metal frame have amounts of the plastic deformation which are set different for positions of the crimped portions in the metal frame.

公开(公告)号：US09370101B2

公开(公告)日：2016-06-14

申请号：US14014654

申请日：2013-08-30

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki Ishihara ,  Michimasa Takahashi

IPC: H05K3/36 ,  H05K1/14 ,  H05K3/00 ,  H05K3/22

CPC classification number: H05K1/142 ,  H05K3/0032 ,  H05K3/0097 ,  H05K3/225 ,  H05K3/36 ,  H05K2203/0169 ,  H05K2203/0554 ,  H05K2203/107 ,  H05K2203/1572 ,  Y10T29/49126

Abstract: A plug-in board replacement method includes preparing a board having a piece board, forming first conductive pattern on first surface of the board, forming second conductive pattern on second surface on the opposite side such that the second pattern is on the opposite side of the first pattern, irradiating laser upon the first and second surfaces along the first and second patterns such that the piece is cut out from the board, and fitting the piece into another board. The irradiating includes irradiating laser upon the first surface along the first pattern such that laser is irradiated along the border between edge portion of the first pattern and the first surface and laser upon the second surface along the second pattern such that laser is irradiated along the border between edge portion of the second pattern and the second surface such that the piece is cut out through the board.

Abstract translation: 插入式电路板的更换方法包括：准备具有单板的板，在所述板的第一表面上形成第一导电图案，在相对侧的第二表面上形成第二导电图案，使得所述第二图案位于所述板的相对侧上 第一图案，沿着第一图案和第二图案在第一表面和第二表面上照射激光，使得该片从板上切出，并将该件装配到另一个板中。 所述照射包括沿着所述第一图案将激光照射在所述第一表面上，使得沿着所述第二图案沿着所述第一图案的边缘部分和所述第一表面之间的边界处的激光照射激光，并且沿着所述第二图案激光沿所述第二表面照射激光， 在所述第二图案的边缘部分和所述第二表面之间，使得所述片材通过所述板被切出。

公开(公告)号：US20150114690A1

公开(公告)日：2015-04-30

申请号：US14522768

申请日：2014-10-24

Applicant: IBIDEN Co., Ltd.

Inventor： Teruyuki ISHIHARA ,  Michimasa Takahashi ,  Takashi Kariya

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/10 ,  H05K1/11

CPC classification number: H05K3/4691 ,  H05K2201/0187 ,  H05K2203/308

Abstract: A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer on first surface sides of the flexible and non-flexible substrates, a second wiring layer on second surface sides of the flexible and non-flexible substrates, a first insulating layer covering the first sides of the flexible and non-flexible substrates and having an opening exposing a portion of the first side of the flexible substrate, and a second insulating layer covering the second sides of the flexible and non-flexible substrates and having an opening exposing a portion of the second side of the flexible substrate. The first wiring layer includes first conductor pattern on the first side of the flexible substrate, and the second wiring layer includes second conductor pattern extending across the second sides of the flexible and non-flexible substrates.

Abstract translation: 柔性刚性布线板包括柔性基板，非柔性基板，其定位成使得非柔性基板在柔性基板的水平方向上延伸;柔性基板和非柔性基板的第一表面侧上的第一布线层 ，在所述柔性和非柔性基板的第二表面侧上的第二布线层，覆盖所述柔性和非柔性基板的第一侧的第一绝缘层，并且具有暴露柔性基板的第一侧的一部分的开口， 以及覆盖所述柔性和非柔性基板的第二侧面的第二绝缘层，并且具有暴露所述柔性基板的第二侧的一部分的开口。 所述第一布线层包括在所述柔性基板的第一侧上的第一导体图案，并且所述第二布线层包括延伸穿过所述柔性和非柔性基板的第二侧的第二导体图案。