公开(公告)号：US3778127A

公开(公告)日：1973-12-11

申请号：US3778127D

申请日：1971-12-30

Applicant: IBM

Inventor： LANGSTON P ,  TUMMALA R ,  WILSON D

IPC: G02F1/1339 ,  G09F9/307 ,  H01J9/26 ,  H01J9/38

CPC classification number: H01J9/261

Abstract: In a method for sealing a gaseous display and/or memory device, an unfused, low-softening point glass rod sealant, arranged in a picture frame pattern, together with high-softening point glass spacing rods are positioned between a pair of aligned flat glass plates, and the resulting assembly is placed in an oven enclosure. The assembly is then heated above the softening point of the glass rod sealant which reflows and fuses the plates to establish a gas-filled envelope. As the sealing material softens, the upper plate settles u;on the spacing rods to thus establish a predetermined and uniform spacing within the envelope.

Abstract translation: 在密封气体显示器和/或记忆装置的方法中，以相框框图案布置的未熔化的低软化点玻璃棒密封剂与高软化点玻璃间隔棒一起定位在一对对准的平板玻璃 板，并将所得组件放置在烘箱外壳中。 然后将组件加热到玻璃棒密封剂的软化点之上，玻璃棒密封剂的软化点回流并熔化板以建立充满气体的外壳。 随着密封材料的软化，上板在间隔杆上沉降，从而在外壳内建立预定和均匀的间距。

公开(公告)号：US3726002A

公开(公告)日：1973-04-10

申请号：US3726002D

申请日：1971-08-27

Applicant: IBM

Inventor： GREENSTEIN B ,  TURETZKY M ,  LANGSTON P ,  NARKEN B

IPC: H01L21/48 ,  H01L23/14 ,  H01L23/538 ,  H05K1/03 ,  H05K3/10 ,  H05K3/20 ,  H05K3/24 ,  H05K3/46 ,  B01J17/00

CPC classification number: H01L24/16 ,  H01L21/4857 ,  H01L23/14 ,  H01L23/5383 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/205 ,  H05K3/243 ,  H05K3/4647 ,  H05K3/4664 ,  H05K3/4667 ,  H05K3/467 ,  H05K2201/09509 ,  H05K2203/0733 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/4916 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A process for fabricating a high performance electrical interconnection package for a plurality of semiconductor chips including the steps of selecting an appropriate dissimilar refractory substrate, forming a plurality of bubble-free layers of glass over the substrate, depositing a plurality of planar metallization patterns on each layer of deposited glass, selectively depositing vertical studs for electrical interconnection between various conductive patterns, and bonding a plurality of integrated circuit chips to the upper surface of the glass package.

Abstract translation: 一种用于制造用于多个半导体芯片的高性能电互连封装件的方法，包括以下步骤：选择合适的不同耐火基材，在基板上形成多个无气泡玻璃层，在每个半导体芯片上沉积多个平面金属化图案 沉积玻璃层，选择性地沉积用于各种导电图案之间的电互连的垂直螺柱，以及将多个集成电路芯片接合到玻璃封装的上表面。