公开(公告)号：US20150060932A1

公开(公告)日：2015-03-05

申请号：US14329235

申请日：2014-07-11

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Meng-Chi HUANG ,  Wen-Hua ZHANG ,  Tune-Hune KAO ,  Min-Chieh CHOU ,  Chih-Yu KO

IPC: H01L33/64 ,  H01L25/075 ,  H01L33/56

CPC classification number: H01L33/648 ,  H01L25/0753 ,  H01L33/56 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A liquid-filled packaging structure of a heating component includes a main body, at least one heating component and a channel. The main body includes an accommodating space, a first opening connecting with the accommodating space and a second opening connecting with the accommodating space. The heating component is disposed in the accommodating space. The two opposite ends of the channel connect with the first opening and the second opening, respectively, so as to form a circulation loop. The accommodating space and the channel are filled with a liquid.

Abstract translation: 加热部件的液体填充包装结构包括主体，至少一个加热部件和通道。 主体包括容纳空间，与容纳空间连接的第一开口和与容纳空间连接的第二开口。 加热部件设置在容纳空间中。 通道的两个相对端分别与第一开口和第二开口连接，以形成循环回路。 容纳空间和通道充满液体。

公开(公告)号：US20240164069A1

公开(公告)日：2024-05-16

申请号：US18086062

申请日：2022-12-21

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yue-Zhen HUANG ,  Meng-Chi HUANG ,  Tune-Hune KAO ,  Min-Chieh CHOU ,  Jie-Chi CHEN

IPC: H05K7/20 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K7/209 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/10166

Abstract: A ceramic substrate structure includes a ceramic board, a first conductive layer, a second conductive layer and a heat dissipation layer. The ceramic board has a first surface and a second surface opposite to each other. Each of the first surface and the second surface is a single surface extending continuously. The first conductive layer is mounted on the first surface of the ceramic board. The second conductive layer is mounted on the first surface of the ceramic board. The second conductive layer is adjacent to the first conductive layer and have different thicknesses. The heat dissipation layer is mounted on the second surface of the ceramic board. The heat dissipation layer includes a first heat dissipation portion corresponding to the first conductive layer and a second heat dissipation portion corresponding to the second conductive layer, and the second heat dissipation portion has a patterned region.

公开(公告)号：US20170029953A1

公开(公告)日：2017-02-02

申请号：US15290668

申请日：2016-10-11

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Tune-Hune KAO ,  Meng-Chi HUANG ,  Min-Chieh Chou

IPC: C23C18/16 ,  H05K1/03 ,  C09D5/24 ,  H05K3/18 ,  H05K3/46 ,  H05K1/02 ,  H05K3/10

CPC classification number: C23C18/1651 ,  C09D5/24 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/165 ,  H05K1/0296 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4661 ,  H05K3/4676 ,  H05K2201/0209

Abstract: A metal circuit structure is provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and includes a first metal circuit pattern. The first metal circuit layer is disposed on the first circuit pattern and is electrically insulated from the substrate. The composition of the first trigger layer includes an insulating gel and a plurality of trigger particles. The trigger particles are at least one of organometallic particles, a chelation and a semiconductor material having an energy gap greater than or equal to 3 eV. The trigger particles are disposed in the insulating gel, such that the dielectric constant of the first trigger layer after curing is between 2 and 6.5.

Abstract translation: 提供了金属电路结构。 金属电路结构包括基板，第一触发层和第一金属电路层。 第一触发层设置在基板上并且包括第一金属电路图案。 第一金属电路层设置在第一电路图案上并与基板电绝缘。 第一触发层的组成包括绝缘凝胶和多个触发颗粒。 触发颗粒是有机金属颗粒，螯合剂和能隙大于或等于3eV的半导体材料中的至少一种。 触发颗粒设置在绝缘凝胶中，使得固化后的第一触发层的介电常数在2和6.5之间。

公开(公告)号：US20130241590A1

公开(公告)日：2013-09-19

申请号：US13887091

申请日：2013-05-03

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Min-Chieh CHOU ,  Tune-Hune KAO ,  Jen-Hui TSAI

IPC: G01R31/28 ,  G01R1/073

CPC classification number: G01R31/2886 ,  G01R1/06744 ,  G01R1/06761 ,  G01R1/073 ,  G01R3/00

Abstract: A method for forming a conductive film structure is provided, which includes: providing an insulating substrate having a surface; forming a plurality of trenches in the surface of the insulating substrate, wherein the trenches are extended substantially parallel to each other; disposing the insulating substrate into a plating solution and plating conducting layers within the trenches to form a plurality of micro-wires; and stacking a plurality of the insulating substrates or winding or folding the insulating substrate along an axis substantially parallel to an extended direction of the micro-wires to form a conducting lump.

Abstract translation: 提供一种形成导电膜结构的方法，其包括：提供具有表面的绝缘基板; 在所述绝缘基板的表面中形成多个沟槽，其中所述沟槽基本上彼此平行地延伸; 将所述绝缘基板设置在电镀液中，并对所述沟槽内的导电层进行电镀以形成多根微线; 并且堆叠多个绝缘基板或者沿着基本上平行于微线的延伸方向的轴线缠绕或折叠绝缘基板以形成导电块。

公开(公告)号：US20150122533A1

公开(公告)日：2015-05-07

申请号：US14323248

申请日：2014-07-03

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Tune-Hune KAO ,  Meng-Chi HUANG ,  Min-Chieh CHOU

IPC: H05K1/09 ,  C23C18/16 ,  H05K3/18 ,  C09D5/24

CPC classification number: C23C18/1651 ,  C09D5/24 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/165 ,  H05K1/0296 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4661 ,  H05K3/4676 ,  H05K2201/0209

Abstract: A metal circuit structure, a method for forming a metal circuit and a liquid trigger material for forming a metal circuit are provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and includes a first metal circuit pattern. The first metal circuit layer is disposed on the first circuit pattern and is electrically insulated from the substrate. The composition of the first trigger layer includes an insulating gel and a plurality of trigger particles. The trigger particles are at least one of organometallic particles, a chelation and a semiconductor material having an energy gap greater than or equal to 3 eV. The trigger particles are disposed in the insulating gel, such that the dielectric constant of the first trigger layer after curing is between 2 and 6.5.

Abstract translation: 提供金属电路结构，形成金属电路的方法和用于形成金属电路的液体触发材料。 金属电路结构包括基板，第一触发层和第一金属电路层。 第一触发层设置在基板上并且包括第一金属电路图案。 第一金属电路层设置在第一电路图案上并与基板电绝缘。 第一触发层的组成包括绝缘凝胶和多个触发颗粒。 触发颗粒是有机金属颗粒，螯合剂和能隙大于或等于3eV的半导体材料中的至少一种。 触发颗粒设置在绝缘凝胶中，使得固化后的第一触发层的介电常数在2和6.5之间。