公开(公告)号：US20200220249A1

公开(公告)日：2020-07-09

申请号：US16638567

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Omer Asaf ,  Nir Weisman ,  Naftali Landsberg ,  Eyal Goldberger ,  Pablo Herrero ,  Harry G. Skinner

IPC: H01Q1/22 ,  H01Q21/06 ,  H01Q9/04 ,  H01Q1/24 ,  H01Q1/52

Abstract: Apparatuses and systems for millimeter-wave antennas are described. An apparatus comprises a board assembly, and a first and second antenna disposed within the board assembly. A third antenna can comprise a semiconductor antenna attached to the board assembly. A parasitic layer can be gap-coupled to the first and second antenna. The first and second antenna can include a rectangular patch antenna and an annular ring antenna. Other aspects are described.

公开(公告)号：US20180375538A1

公开(公告)日：2018-12-27

申请号：US16119207

申请日：2018-08-31

Applicant: Intel Corporation

Inventor： Andrei Panioukov ,  Pablo Herrero

IPC: H04B1/04 ,  H03H7/40 ,  H04B17/10

Abstract: An apparatus for providing a control signal for a variable impedance matching circuit comprises a control module configured to generate a control signal for adjusting an impedance of a variable impedance matching circuit coupled to an antenna module. The control module is configured to generate the control signal based on a sensor signal received from a sensor circuit located in proximity to the antenna module. The sensor signal comprises information related to a power of an electromagnetic signal radiated by the antenna module.

公开(公告)号：US11211688B2

公开(公告)日：2021-12-28

申请号：US16638567

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Omer Asaf ,  Nir Weisman ,  Naftali Landsberg ,  Eyal Goldberger ,  Pablo Herrero ,  Harry G. Skinner

IPC: H01Q1/22 ,  H01Q21/06 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q9/04

Abstract: Apparatuses and systems for millimeter-wave antennas are described. An apparatus comprises a board assembly, and a first and second antenna disposed within the board assembly. A third antenna can comprise a semiconductor antenna attached to the board assembly. A parasitic layer can be gap-coupled to the first and second antenna. The first and second antenna can include a rectangular patch antenna and an annular ring antenna. Other aspects are described.

公开(公告)号：US10319688B2

公开(公告)日：2019-06-11

申请号：US14361625

申请日：2013-12-09

Applicant: INTEL CORPORATION

Inventor： Andreas Wolter ,  Saravana Maruthamuthu ,  Mikael Knudsen ,  Thorsten Meyer ,  Georg Seidemann ,  Pablo Herrero ,  Pauli Jaervinen

IPC: H01Q1/38 ,  H01L23/66 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H01L21/48 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L25/065 ,  H01Q1/50 ,  H01Q1/52 ,  H01L23/29

Abstract: An antenna is described on ceramics that may be used for a packaged die. In one example, a package has a die, a ceramic substrate over the die, an antenna attached to the ceramic substrate, and conductive leads electrically connecting the antenna to the die.

公开(公告)号：US20160240492A1

公开(公告)日：2016-08-18

申请号：US14361625

申请日：2013-12-09

Applicant: INTEL CORPORATION

Inventor： Andreas Wolter ,  Saravana Maruthamuthu ,  Mikael Knudsen ,  Meyer Thorsten ,  Georg Seidemann ,  Pablo Herrero ,  Pauli Jaervinen

IPC: H01L23/66 ,  H01Q1/50 ,  H01Q1/52 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31 ,  H01L23/552 ,  H01L25/065 ,  H01L23/00 ,  H01Q1/38 ,  H01L23/48

CPC classification number: H01L23/66 ,  H01L21/4846 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01Q1/38 ,  H01Q1/50 ,  H01Q1/526 ,  H01L2924/00

Abstract: An antenna is described on ceramics that may be used for a packaged die. In one example, a package has a die, a ceramic substrate over the die, an antenna attached to the ceramic substrate, and conductive leads electrically connecting the antenna to the die.

Abstract translation: 在可用于封装模具的陶瓷上描述天线。 在一个示例中，封装具有管芯，管芯上的陶瓷衬底，附着到陶瓷衬底的天线以及将天线电连接到管芯的导电引线。

公开(公告)号：US20160182096A1

公开(公告)日：2016-06-23

申请号：US14865514

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Andrei Panioukov ,  Pablo Herrero

IPC: H04B1/04 ,  H01Q1/50

CPC classification number: H04B1/0458 ,  H03H7/40 ,  H04B17/102

Abstract: An apparatus for providing a control signal for a variable impedance matching circuit comprises a control module configured to generate a control signal for adjusting an impedance of a variable impedance matching circuit coupled to an antenna module. The control module is configured to generate the control signal based on a sensor signal received from a sensor circuit located in proximity to the antenna module. The sensor signal comprises information related to a power of an electromagnetic signal radiated by the antenna module.

Abstract translation: 用于提供可变阻抗匹配电路的控制信号的装置包括：控制模块，被配置为产生用于调整耦合到天线模块的可变阻抗匹配电路的阻抗的控制信号。 控制模块被配置为基于从位于天线模块附近的传感器电路接收的传感器信号来生成控制信号。 传感器信号包括与由天线模块辐射的电磁信号的功率有关的信息。