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    Combinatorial Process System
    1.
    发明申请
    Combinatorial Process System 审中-公开
    组合过程系统

    公开(公告)号：US20150093898A1

    公开(公告)日：2015-04-02

    申请号：US14562952

    申请日：2014-12-08

    Applicant: Intermolecular, Inc.

    Inventor： Rick Endo ,  Jeremy Cheng ,  Indranil De ,  James Tsung ,  Kurt Weiner ,  Maosheng Zhao

    IPC: H01L21/3205

    CPC classification number: H01L21/32051 ,  B01J19/0046 ,  B01J2219/0043 ,  B01J2219/00536 ,  B01J2219/00596 ,  B01J2219/00659 ,  B01J2219/00745 ,  B01J2219/00756 ,  C23C14/042 ,  C23C14/50 ,  C23C14/548 ,  C23C16/45544 ,  H01L21/67005 ,  H01L21/6719

    Abstract: A combinatorial processing chamber is provided. The combinatorial processing chamber is configured to isolate a radial portion of a rotatable substrate support, which in turn is configured to support a substrate. The chamber includes a plurality of clusters process heads in one embodiment. An insert having a base plate disposed between the substrate support and the process heads defines a confinement region for a deposition process in one embodiment. The base plate has an opening to enable access of the deposition material to the substrate. Through rotation of the substrate and movement of the opening, multiple regions of the substrate are accessible for performing combinatorial processing on a single substrate.

    Abstract translation: 提供组合处理室。 组合处理室被配置为隔离可旋转的衬底支撑件的径向部分，该可旋转衬底支撑件又被配置为支撑衬底。 在一个实施例中，腔室包括多个聚集过程头。 在一个实施例中，具有设置在基板支撑件和工艺头之间的基板的插入件限定了用于沉积工艺的约束区域。 基板具有能够将沉积材料接近基板的开口。 通过基板的旋转和开口的移动，基板的多个区域是可访问的，以在单个基板上执行组合处理。

    Modular Flow Cell and Adjustment System
    2.
    发明申请
    Modular Flow Cell and Adjustment System 审中-公开
    模块化流通池和调整系统

    公开(公告)号：US20150235875A1

    公开(公告)日：2015-08-20

    申请号：US14701861

    申请日：2015-05-01

    Applicant: Intermolecular, Inc.

    Inventor： Kurt Weiner ,  Aaron Francis ,  Ken Williams

    IPC: H01L21/67 ,  B01J19/00 ,  H01L21/687

    CPC classification number: H01L21/6715 ,  B01J19/0046 ,  B01J2219/00351 ,  B01J2219/00481 ,  B01J2219/00585 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/6719 ,  H01L21/68778

    Abstract: A combinatorial processing system having modular dispense heads is provided. The modular dispense heads are disposed on a rail system enabling an adjustable pitch of the modular dispense heads for the combinatorial processing. The modular dispense heads are configured so that sections of the modular dispense heads are detachable in order to accommodate various processes through a first section without having to completely disconnect and re-connect facilities to a second section.

    Abstract translation: 提供了具有模块化分配头的组合处理系统。 模块化分配头设置在轨道系统上，使得用于组合处理的模块化分配头的可调节距。 模块化分配头被配置为使得模块化分配头的部分可拆卸以便通过第一部分适应各种过程，而不必完全断开并将设备重新连接到第二部分。

    Shadow Mask for Patterned Deposition on Substrates
    4.
    发明申请
    Shadow Mask for Patterned Deposition on Substrates 审中-公开
    阴影掩模用于图案沉积在底物上

    公开(公告)号：US20150031148A1

    公开(公告)日：2015-01-29

    申请号：US14505256

    申请日：2014-10-02

    Applicant: Intermolecular, Inc.

    Inventor： Indranil De ,  Kurt Weiner

    IPC: H01L21/02 ,  H01L21/66

    CPC classification number: H01L21/02266 ,  B05C21/00 ,  B05C21/005 ,  C23C14/04 ,  C23C14/042 ,  H01L22/10

    Abstract: A method for performing a physical vapor deposition (PVD) on a substrate is disclosed, comprising placing a substrate on a susceptor disposed below one or more PVD guns and below a plasma shield assembly having a bellows and a shadow mask coupled to a bottom side of the bellows, lowering the bellows toward the substrate to place the shadow mask in contact with the substrate; and depositing a material on an isolated region on the substrate through the shadow mask. In one implementation, the shadow mask may include a plate having openings in the shape of individual dies on the substrate, and a layer having openings in the shape of features patterned on the substrate, wherein the layer is coupled to a bottom surface of the plate by an epoxy.

    Abstract translation: 公开了一种用于在基板上进行物理气相沉积（PVD）的方法，包括将基板放置在设置在一个或多个PVD枪下方的基座上并且在等离子体屏蔽组件的下方，该等离子体屏蔽组件具有耦合到底部的波纹管和荫罩 波纹管，将波纹管朝向基板降低以使荫罩与基板接触; 以及通过所述荫罩将材料沉积在所述衬底上的隔离区域上。 在一个实施方案中，荫罩可以包括具有在基板上的各个模具形状的开口的板，以及具有在基板上图案化的特征形状的开口的层，其中该层耦合到板的底表面 通过环氧树脂。

    Shadow mask for patterned deposition on substrates
    5.
    发明授权
    Shadow mask for patterned deposition on substrates 有权
    阴影掩模用于图案沉积在基底上

    公开(公告)号：US08881677B2

    公开(公告)日：2014-11-11

    申请号：US13707910

    申请日：2012-12-07

    Applicant: Intermolecular, Inc.

    Inventor： Indranil De ,  Kurt Weiner

    IPC: B05C21/00 ,  B05C11/00 ,  C23C14/04

    CPC classification number: H01L21/02266 ,  B05C21/00 ,  B05C21/005 ,  C23C14/04 ,  C23C14/042 ,  H01L22/10

    Abstract: A method for performing a physical vapor deposition (PVD) on a substrate is disclosed, comprising placing a substrate on a susceptor disposed below one or more PVD guns and below a plasma shield assembly having a bellows and a shadow mask coupled to a bottom side of the bellows, lowering the bellows toward the substrate to place the shadow mask in contact with the substrate; and depositing a material on an isolated region on the substrate through the shadow mask. In one implementation, the shadow mask may include a plate having openings in the shape of individual dies on the substrate, and a layer having openings in the shape of features patterned on the substrate, wherein the layer is coupled to a bottom surface of the plate by an epoxy.

    Abstract translation: 公开了一种用于在基板上进行物理气相沉积（PVD）的方法，包括将基板放置在设置在一个或多个PVD枪下方的基座上并且在等离子体屏蔽组件的下方，该等离子体屏蔽组件具有耦合到底部的波纹管和荫罩 波纹管，将波纹管朝向基板降低以使荫罩与基板接触; 以及通过所述荫罩将材料沉积在所述衬底上的隔离区域上。 在一个实施方案中，荫罩可以包括具有在基板上的各个模具的形状的开口的板，以及具有在基板上图案化的特征形状的开口的层，其中该层耦合到板的底表面 通过环氧树脂。

    Shadow Mask for Patterned Deposition on Substrates
    6.
    发明申请
    Shadow Mask for Patterned Deposition on Substrates 审中-公开

    公开(公告)号：US20130092081A1

    公开(公告)日：2013-04-18

    申请号：US13707910

    申请日：2012-12-07

    Applicant: INTERMOLECULAR, INC.

    Inventor： Indranil De ,  Kurt Weiner

    IPC: B05C21/00

    CPC classification number: H01L21/02266 ,  B05C21/00 ,  B05C21/005 ,  C23C14/04 ,  C23C14/042 ,  H01L22/10

    Abstract: A method for performing a physical vapor deposition (PVD) on a substrate is disclosed, comprising placing a substrate on a susceptor disposed below one or more PVD guns and below a plasma shield assembly having a bellows and a shadow mask coupled to a bottom side of the bellows, lowering the bellows toward the substrate to place the shadow mask in contact with the substrate; and depositing a material on an isolated region on the substrate through the shadow mask. In one implementation, the shadow mask may include a plate having openings in the shape of individual dies on the substrate, and a layer having openings in the shape of features patterned on the substrate, wherein the layer is coupled to a bottom surface of the plate by an epoxy.

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