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公开(公告)号：US10937941B2
公开(公告)日：2021-03-02
申请号：US16045080
申请日：2018-07-25
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： David W. Abraham , Jerry M. Chow , Jay M. Gambetta , John A. Smolin
Abstract: A system for adjusting qubit frequency includes a qubit device having a Josephson junction and a shunt capacitor coupled to electrodes of the Josephson junction. A cantilevered conductor is separated from the shunt capacitor by a spacing. An adjustment mechanism is configured to deflect the cantilevered conductor to tune a qubit frequency for the qubit device.
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公开(公告)号：US10833016B2
公开(公告)日：2020-11-10
申请号：US16215913
申请日：2018-12-11
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： David W. Abraham , John M. Cotte
IPC: H01L21/28 , H01L21/32 , H01L21/76 , H01L23/48 , H01L23/532 , H01L21/02 , H01L21/288 , H01L21/3205 , H01L21/3213 , H01L21/768 , H01L25/065 , H01L25/00 , H01L23/00
Abstract: A semiconductor structure and methods of forming the semiconductor structure generally includes providing a thermocompression bonded superconducting metal layer sandwiched between a first silicon substrate and a second silicon substrate. The second substrate includes a plurality of through silicon vias to the thermocompression bonded superconducting metal layer. A second superconducting metal is electroplated into the through silicon vias using the thermocompression bonded superconducting metal layer as a bottom electrode during the electroplating process, wherein the filling is from the bottom upwards.
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公开(公告)号：US20200035585A1
公开(公告)日：2020-01-30
申请号：US15813760
申请日：2017-11-15
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： David W. Abraham , John M. Cotte
IPC: H01L23/488
Abstract: A semiconductor structure and methods for the creation of solder bumps configured to carry a signal and solder bumps configured for ground planes and/or mechanical connections as well as methods for increasing reliability of a chip package generally include formation of multiple sized bump bonds on under bump metallization patterns and/or pads of the same dimension. The signal carrying solder bumps are larger in terms of diameter and bump height than solder bumps configured for ground plane and/or mechanical connections.
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公开(公告)号：US20190131509A1
公开(公告)日：2019-05-02
申请号：US16233873
申请日：2018-12-27
Applicant: International Business Machines Corporation
Inventor： David W. Abraham , John M. Cotte , Mary B. Rothwell
Abstract: A device has a first stack of thin films, the first stack of thin films having a first opposing surface and a first connection surface, wherein the first connection surface contacts a first superconducting region; a second stack of thin films, the second stack of thin films having a second opposing surface and a second connection surface, wherein the second connection surface contacts a second superconducting region; and a superconducting bump bond electrically connecting the first and second opposing surfaces, the superconducting bump bond maintaining a low ohmic electrical contact between the first and second opposing surfaces at temperatures below 100 degrees Kelvin, wherein at least one of the first or second superconducting regions comprise material with a melting point of at least 700 degrees Celsius.
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公开(公告)号：US20190013251A1
公开(公告)日：2019-01-10
申请号：US15645104
申请日：2017-07-10
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： David W. Abraham , John M. Cotte
Abstract: Semiconductor devices and electronics packaging methods include integrated circuit chips having redundant signal bond pads along with signal bond pads connected to the same signal port for non-destructive testing of the integrated circuit chips prior to packaging. Electrical testing is made via the redundant signal bond after which qualified integrated circuit chips can be attached to a pristine and bumped final interposer or printed circuit board to provide increased reliability to the assembled electronic package.
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Patent Agency Ranking
6.发明授权公开(公告)号：US09948050B2
公开(公告)日：2018-04-17
申请号：US14698079
申请日：2015-04-28
Applicant: International Business Machines Corporation
Inventor： David W. Abraham , Antonio D. Corcoles Gonzalez , James R. Rozen
CPC classification number: H01R43/00 , H01P1/045 , H01P1/202 , H01R13/7197 , H01R24/40 , H01R24/42 , H01R43/16 , Y10T29/49204 , Y10T29/4921
Abstract: A microwave connector is provided. The microwave connector includes an outer conductor, an inner conductor disposed within the outer conductor and dielectric materials interposed between the outer conductor and the inner conductor, the dielectric materials including a non-dissipative dielectric material and a dissipative dielectric material.
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公开(公告)号：US09935252B2
公开(公告)日：2018-04-03
申请号：US15263940
申请日：2016-09-13
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： David W. Abraham , Jerry M. Chow , Jay M. Gambetta , John A. Smolin
CPC classification number: H01L39/10 , G06N99/002 , H01L39/025 , H01L39/045 , H01L39/223 , H01L39/2493 , H01L41/094 , H03K3/38
Abstract: A system for adjusting qubit frequency includes a qubit device having a Josephson junction and a shunt capacitor coupled to electrodes of the Josephson junction. A cantilevered conductor is separated from the shunt capacitor by a spacing. An adjustment mechanism is configured to deflect the cantilevered conductor to tune a qubit frequency for the qubit device.
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公开(公告)号：US20180069289A1
公开(公告)日：2018-03-08
申请号：US15811089
申请日：2017-11-13
Applicant: International Business Machines Corporation
Inventor： David W. Abraham , Antonio D. Corcoles Gonzalez , James R. Rozen
CPC classification number: H01P11/007 , B29C39/10 , H01P1/202 , H01P3/06 , H01P11/005 , Y10T29/49018
Abstract: A filter is provided and includes potting material formed into a body defining a through-hole. The body includes first and second opposing faces and a sidewall extending between the first and second opposing faces. The sidewall is formed to define first and second openings at opposite ends of the through-hole, first angles at an interface between the sidewall and the first face and second angles, which complement the first angles, at an interface between the sidewall and the second face.
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公开(公告)号：US09847568B2
公开(公告)日：2017-12-19
申请号：US14748501
申请日：2015-06-24
Applicant: International Business Machines Corporation
Inventor： David W. Abraham , Antonio D. Corcoles Gonzalez , James R. Rozen
CPC classification number: H01P11/007 , B29C39/10 , H01P1/202 , H01P3/06 , H01P11/005 , Y10T29/49018
Abstract: A filter is provided and includes potting material formed into a body defining a through-hole. The body includes first and second opposing faces and a sidewall extending between the first and second opposing faces. The sidewall is formed to define first and second openings at opposite ends of the through-hole, first angles at an interface between the sidewall and the first face and second angles, which complement the first angles, at an interface between the sidewall and the second face.
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公开(公告)号：US09531055B2
公开(公告)日：2016-12-27
申请号：US14610476
申请日：2015-01-30
Applicant: International Business Machines Corporation
Inventor： David W. Abraham , Jerry M. Chow , Antonio D. Corcoles Gonzalez , George A. Keefe , Mary E. Rothwell , James R. Rozen , Matthias Steffen
IPC: H01L29/06 , H01L29/08 , H01L31/0256 , H01L39/22 , H01P7/08 , H01L39/24 , H01P11/00 , H01P3/02 , B82Y10/00 , H01L39/14 , H01P3/00
CPC classification number: H01P7/086 , B82Y10/00 , G06N99/002 , H01L39/045 , H01L39/14 , H01L39/223 , H01L39/2406 , H01P3/003 , H01P3/026 , H01P11/003
Abstract: A coplanar waveguide device includes a coplanar waveguide structure disposed on a substrate, at least one qubit coupled to the coplanar waveguide structure and an add-on chip having a metallized trench, and disposed over the substrate.
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