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公开(公告)号：US09939331B2
公开(公告)日：2018-04-10
申请号：US14284198
申请日：2014-05-21
发明人： Jonathan Silvano de Sousa , Tobias Frischmuth , Peter Irsigler , Ulrich Schmid , Thomas Grille , Ursula Hedenig , Sylvicley Figueira da Silva
CPC分类号： G01K7/34 , B81B3/0021 , G01K1/024 , G01K13/002
摘要： Various embodiments disclosed herein include a capacitive thermometer including a deflectable membrane and a sense electrode. The deflectable membrane is configured to adjust a capacitive value based on a temperature of the deflectable membrane.
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公开(公告)号：US20170325025A1
公开(公告)日：2017-11-09
申请号：US15145862
申请日：2016-05-04
发明人： Manuel Dorfmeister , Michael Schneider , Manfred Kaltenbacher , Alfons Dehe , Ursula Hedenig , Thomas Grille , Ulrich Schmid
摘要： Aspects of a microelectromechanical device, an array of microelectromechanical devices, a method of manufacturing a microelectromechanical device, and a method of operating a microelectromechanical device, are discussed herein. The microelectromechanical device may include: a substrate; a diaphragm mechanically coupled to the substrate, the diaphragm comprising a stressed region to buckle the diaphragm into one of two geometrically stable positions; an actuator mechanically coupled to the diaphragm, the actuator comprising a piezoelectric layer over the diaphragm; a controller configured to provide an electrical control signal in response to a digital sound input; wherein the actuator is configured to receive the electrical control signal to exert a mechanical piezoelectric force on the diaphragm via the piezoelectric layer to move the diaphragm to create a sound wave.
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公开(公告)号：US20170268991A1
公开(公告)日：2017-09-21
申请号：US15617246
申请日：2017-06-08
CPC分类号： G01N21/27 , G01N21/0303 , G01N21/7703 , G01N2021/0382 , G01N2201/08
摘要： A sensor system having coupling structures is disclosed. The system includes an input coupling structure, an interaction region, and an output coupling structure. The input coupling structure is configured to receive emitted light at a selected coupling efficiency and may provide filtering of the emitted light for a selected wavelength. The interaction region is coupled to the input coupling structure and configured to interact the light from the input coupling structure with a specimen. The output coupling structure is coupled to the interaction region and configured to provide interacted light from the interaction region to the detector.
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公开(公告)号：US09941432B2
公开(公告)日：2018-04-10
申请号：US15167292
申请日：2016-05-27
发明人： Stefan Clara , Thomas Grille , Ursula Hedenig , Peter Irsigler , Bernhard Jakoby , Ventsislav M. Lavchiev , Thomas Ostermann , Thomas Popp
IPC分类号： H01L31/18 , H01L31/0352 , H01L33/06
CPC分类号： H01L31/035254 , H01L31/035209 , H01L31/035218 , H01L31/173 , H01L31/1812 , H01L31/1864 , H01L33/06 , H01L2933/0033
摘要： A semiconductor device comprises a plurality of quantum structures comprising predominantly germanium. The plurality of quantum structures are formed on a first semiconductor layer structure. The quantum structures of the plurality of quantum structures have a lateral dimension of less than 15 nm and an area density of at least 8×1011 quantum structures per cm2. The plurality of quantum structures are configured to emit light with a light emission maximum at a wavelength of between 2 μm and 10 μm or to absorb light with a light absorption maximum at a wavelength of between 2 μm and 10 μm.
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公开(公告)号：US20170158493A1
公开(公告)日：2017-06-08
申请号：US15440962
申请日：2017-02-23
发明人： Thomas Grille , Ursula Hedenig , Michael Roesner , Gudrun Stranzl , Martin Zgaga
CPC分类号： B81B7/0061 , B01D67/0034 , B81B2201/0257 , B81B2201/10 , B81C1/00904 , B81C2201/0132 , Y10T428/24273
摘要： A hole plate and a MEMS microphone arrangement are disclosed. In an embodiment a hole plate includes a substrate with a first main surface, a second main surface, and a lateral surface and a perforation structure formed within the substrate, the perforation structure having a plurality of through-holes through the substrate, wherein the through-holes and the lateral surface are a result of a simultaneous dry etching step.
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公开(公告)号：US09610543B2
公开(公告)日：2017-04-04
申请号：US14170187
申请日：2014-01-31
发明人： Thomas Grille , Ursula Hedenig , Michael Roesner , Gudrun Stranzl , Martin Zgaga
CPC分类号： B81B7/0061 , B01D67/0034 , B81B2201/0257 , B81B2201/10 , B81C1/00904 , B81C2201/0132 , Y10T428/24273
摘要： A method for structuring a substrate and a structured substrate are disclosed. In an embodiment a method includes providing a substrate with a first main surface and a second main surface, wherein the substrate is fixed to a carrier arrangement at the second main surface, performing a photolithography step at the first main surface of the substrate to mark a plurality of sites at the first main surface, the plurality of sites corresponding to future perforation structures and future kerf regions for a plurality of future individual semiconductor chips to be obtained from the substrate, and plasma etching the substrate at the plurality of sites until the carrier arrangement is reached, thus creating the perforation structures within the plurality of individual semiconductor chips and simultaneously separating the individual semiconductor chips along the kerf regions.
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7.发明授权Method for manufacturing a plurality of microphone structures, microphone and mobile device 有权用于制造多个麦克风结构，麦克风和移动设备的方法公开(公告)号：US09439017B2
公开(公告)日：2016-09-06
申请号：US14176182
申请日：2014-02-10
发明人： Ursula Hedenig , Daniel Maurer , Thomas Grille , Peter Irsigler , Soenke Pirk , Andre Brockmeier
CPC分类号： H04R31/00 , H04R19/005 , H04R23/00 , H04R2201/003 , Y10T29/49
摘要： In various embodiments, a method for manufacturing microphone structures is provided. The method may include: Providing a substrate having a front side and a back side, the backside facing away from the front side, and having an inner area and an outer area laterally surrounding the inner area, with the inner area comprising a plurality of microphone areas each microphone are being provided for one microphone of the plurality of microphones; Forming a plurality of layers for the plurality of microphones in the microphone areas on the front side of the substrate; Forming a recess from the backside of the substrate with the recess laterally overlapping the entire inner area; Forming a plurality of cavities into a bottom of the recess with each cavity of the plurality of cavities being formed in one of the microphone areas; Processing the layers to form the plurality of microphone structures, wherein each microphone structure comprises at least one layer of the plurality of layers and one cavity; and Separating the plurality of microphone structures from each other.
摘要翻译： 在各种实施例中，提供了一种用于制造麦克风结构的方法。 该方法可以包括：提供具有前侧和后侧的衬底，背面背离前侧，并且具有横向包围内部区域的内部区域和外部区域，其中内部区域包括多个麦克风 每个麦克风正在为多个麦克风中的一个麦克风提供的区域; 在基板正面的麦克风区域中形成多个麦克风层; 从基板的背面形成凹部，其中凹部横向重叠整个内部区域; 在所述多个空腔的每个空腔形成在所述麦克风区域中的一个中，形成多个空腔到所述凹部的底部; 处理层以形成多个麦克风结构，其中每个麦克风结构包括多层中的至少一层和一个空腔; 并且将多个麦克风结构彼此分离。
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公开(公告)号：US20140335700A1
公开(公告)日：2014-11-13
申请号：US13892003
申请日：2013-05-10
发明人： Guenter Denifl , Markus Kahn , Helmut Schoenherr , Daniel Maurer , Thomas Grille , Joachim Hirschler , Ursula Hedenig , Roland Moennich , Matthias Kuenle
CPC分类号： H01L21/02115 , C23C16/26 , C23C16/56 , H01L21/02164 , H01L21/0217 , H01L21/022 , H01L21/02263 , H01L21/02274 , H01L21/02304 , H01L21/02362
摘要： Carbon layers with reduced hydrogen content may be deposited by plasma-enhanced chemical vapor deposition by selecting processing parameters accordingly. Such carbon layers may be subjected to high temperature processing without showing excessive shrinking.
摘要翻译： 通过选择相应的处理参数，可以通过等离子体增强化学气相沉积来沉积具有降低的氢含量的碳层。 这样的碳层可以经受高温处理而不会显着过度收缩。
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公开(公告)号：US10345227B2
公开(公告)日：2019-07-09
申请号：US15617246
申请日：2017-06-08
摘要： A sensor system having coupling structures is disclosed. The system includes an input coupling structure, an interaction region, and an output coupling structure. The input coupling structure is configured to receive emitted light at a selected coupling efficiency and may provide filtering of the emitted light for a selected wavelength. The interaction region is coupled to the input coupling structure and configured to interact the light from the input coupling structure with a specimen. The output coupling structure is coupled to the interaction region and configured to provide interacted light from the interaction region to the detector.
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公开(公告)号：US10081533B2
公开(公告)日：2018-09-25
申请号：US14448767
申请日：2014-07-31
发明人： Ulrich Schmid , Tobias Frischmuth , Peter Irsigler , Thomas Grille , Daniel Maurer , Ursula Hedenig , Markus Kahn , Günter Denifl
IPC分类号： B81B3/00 , B06B1/02 , B81C1/00 , H04R19/02 , H04R19/04 , H04R31/00 , H04R7/24 , H04R7/02 , H04R19/00
CPC分类号： B81B3/0021 , B06B1/02 , B81B3/007 , B81B2201/0257 , B81B2201/0264 , B81B2203/0109 , B81B2203/0118 , B81B2203/0127 , B81B2203/051 , B81C1/00142 , B81C1/0015 , B81C1/00158 , B81C1/00373 , B81C2201/0176 , B81C2201/0181 , B81C2201/019 , H04R7/02 , H04R7/24 , H04R19/005 , H04R19/02 , H04R19/04 , H04R31/00 , H04R31/003 , H04R2201/003 , H04R2307/023 , H04R2400/01 , H04R2499/11
摘要： A micromechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure has a functional region configured to deflect with respect to the substrate responsive to a force acting on the functional region. The functional structure includes a conductive base layer and a functional structure comprising a stiffening structure having a stiffening structure material arranged at the conductive base layer and only partially covering the conductive base layer at the functional region. The stiffening structure material includes a silicon material and at least a carbon material.
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