Chemical Vapor Deposition System
    1.
    发明申请
    Chemical Vapor Deposition System 审中-公开
    化学气相沉积系统

    公开(公告)号:US20140127887A1

    公开(公告)日:2014-05-08

    申请号:US13837994

    申请日:2013-03-15

    Abstract: Chemical vapor deposition (CVD) systems for forming layers on a substrate are disclosed. Embodiments of the system comprise at least two processing chambers that may be linked in a cluster tool. A first processing chamber provides a chamber having a controlled environmental temperature and pressure and containing a first environment for performing CVD on a substrate, and a second environment for contacting the substrate with a plasma; a substrate transport system capable of positioning a substrate for sequential processing in each environment, and a gas control system capable of maintaining isolation. A second processing chamber provides a CVD system. Methods of forming layers on a substrate comprise forming one or more layers in each processing chamber. The systems and methods are suitable for preparing Group III-V, Group II-VI or Group IV thin film devices.

    Abstract translation: 公开了用于在衬底上形成层的化学气相沉积(CVD)系统。 该系统的实施例包括至少两个可以在集群工具中链接的处理室。 第一处理室提供具有受控的环境温度和压力的室,并且包含用于在衬底上进行CVD的第一环境和用于使衬底与等离子体接触的第二环境; 能够在每个环境中定位用于顺序处理的基板的基板输送系统,以及能够保持隔离的气体控制系统。 第二处理室提供CVD系统。 在衬底上形成层的方法包括在每个处理室中形成一个或多个层。 该系统和方法适用于制备III-V族,II-VI族或IV族薄膜器件。

    Chemical Vapor Deposition System
    2.
    发明申请

    公开(公告)号:US20140124788A1

    公开(公告)日:2014-05-08

    申请号:US13670269

    申请日:2012-11-06

    Abstract: Chemical vapor deposition (CVD) systems for forming layers on a substrate are disclosed. Embodiments of the system comprise at least two processing chambers that may be linked in a cluster tool. A first processing chamber provides a chamber having a controlled environmental temperature and pressure and containing a first environment for performing CVD on a substrate, and a second environment for contacting the substrate with a plasma; a substrate transport system capable of positioning a substrate for sequential processing in each environment, and a gas control system capable of maintaining isolation. A second processing chamber provides a CVD system. Methods of forming layers on a substrate comprise forming one or more layers in each processing chamber. The systems and methods are suitable for preparing Group III-V, Group II-VI or Group IV thin film devices.

    Low temperature migration enhanced Si-Ge epitaxy with plasma assisted surface activation
    3.
    发明申请
    Low temperature migration enhanced Si-Ge epitaxy with plasma assisted surface activation 审中-公开
    低温迁移增强Si-Ge外延与等离子体辅助表面活化

    公开(公告)号:US20140299056A1

    公开(公告)日:2014-10-09

    申请号:US14308846

    申请日:2014-06-19

    Abstract: Epitaxial films are grown by alternately exposed to precursor dosing regions, inert gas plasma regions, hydrogen-containing plasma regions, chlorine-containing plasma and metrology regions, or regions where an atomic hydrogen source is located. Alternately, laser irradiation techniques may be substituted for the plasma energy in some of the processing regions. The film growth process can be implemented at substrate temperatures between about 25 C and about 600 C, together with optional exposures to laser irradiation to cause the surface of the film to melt or to experience a near-melt condition.

    Abstract translation: 外延膜通过交替地暴露于前体给料区域,惰性气体等离子体区域,含氢等离子体区域,含氯等离子体和计量区域或原子氢源所在的区域而生长。 或者,激光照射技术可以替代一些处理区域中的等离子体能量。 膜生长过程可以在约25℃至约600℃之间的衬底温度下进行,以及可选地暴露于激光照射以使膜的表面熔化或经历近熔融状态。

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