公开(公告)号：US10396000B2

公开(公告)日：2019-08-27

申请号：US14789476

申请日：2015-07-01

申请人： International Business Machines Corporation ,  Globalfoundries, Inc.

发明人： Tenko Yamashita ,  Chun-Chen Yeh ,  Hui Zang

IPC分类号： H01L21/66 ,  H01L29/66 ,  H01L21/8234 ,  H01L27/088

摘要： Embodiments are directed to a method Embodiments are directed to a test structure of a fin-type field effect transistor (FinFET). The test structure includes a first conducting layer electrically coupled to a dummy gate of the FinFET, and a second conducting layer electrically coupled to a substrate of the FinFET. The test structure further includes a third conducting layer electrically coupled to the dummy gate of the FinFET, and a first region of the FinFET at least partially bound by the first conducting layer and the second conducting layer. The test structure further includes a second region of the FinFET at least partially bound by the second conducting layer and the third conducting layer, wherein the first region comprises a first dielectric having a first dimension, and wherein the second region comprises a second dielectric having a second dimension greater than the first dimension.

公开(公告)号：US10256304B2

公开(公告)日：2019-04-09

申请号：US15890880

申请日：2018-02-07

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION ,  GlobalFoundries, Inc. ,  STMicroelectronics, Inc.

发明人： Xiuyu Cai ,  Qing Liu ,  Kejia Wang ,  Ruilong Xie ,  Chun-Chen Yeh

IPC分类号： H01L29/78 ,  H01L29/10 ,  H01L29/41 ,  H01L29/66 ,  H01L21/306 ,  H01L29/20 ,  H01L29/417

摘要： A semiconductor device includes a fin patterned in a substrate; a gate disposed over and substantially perpendicular to the fin; a pair of epitaxial contacts including a III-V material over the fin and on opposing sides of the gate; and a channel region between the pair of epitaxial contacts under the gate including an undoped III-V material between doped III-V materials, the doped III-V materials including a dopant in an amount in a range from about 1e18 to about 1e20 atoms/cm3 and contacting the epitaxial contacts.

公开(公告)号：US10134840B2

公开(公告)日：2018-11-20

申请号：US14739543

申请日：2015-06-15

申请人： International Business Machines Corporation ,  Globalfoundries, Inc. ,  STMicroelectronics, Inc.

发明人： Chun-Chen Yeh ,  Xiuyu Cai ,  Qing Liu ,  Ruilong Xie

IPC分类号： H01L29/78 ,  H01L21/265 ,  H01L21/3065 ,  H01L29/06 ,  H01L29/66 ,  H01L21/02 ,  H01L21/306 ,  H01L29/08 ,  H01L29/423 ,  H01L29/786 ,  H01L29/10

摘要： Embodiments are directed to a method of fabricating a portion of a nanowire field effect transistor (FET). The method includes forming a sacrificial layer and a nanowire layer, removing a sidewall portion of the sacrificial layer and forming a diffusion block in a space that was occupied by the removed sidewall portion of the sacrificial layer. The method further includes forming a source region and a drain region such that the diffusion block is between the sacrificial layer and at least one of the source region and the drain region, and removing the sacrificial layer using a sacrificial layer removal process, wherein the diffusion block prevents the sacrificial layer removal process from also removing portions of at least one of the source region and the drain region.

公开(公告)号：US09935201B2

公开(公告)日：2018-04-03

申请号：US15396743

申请日：2017-01-02

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION ,  GlobalFoundries, Inc. ,  STMicroelectronics, Inc.

发明人： Xiuyu Cai ,  Qing Liu ,  Kejia Wang ,  Ruilong Xie ,  Chun-Chen Yeh

IPC分类号： H01L29/78 ,  H01L29/10 ,  H01L29/41 ,  H01L29/417 ,  H01L29/66 ,  H01L21/306

CPC分类号： H01L29/1033 ,  H01L21/30621 ,  H01L29/1054 ,  H01L29/20 ,  H01L29/41791 ,  H01L29/66522 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/66636 ,  H01L29/66795 ,  H01L29/785 ,  H01L29/7851

摘要： A semiconductor device includes a fin patterned in a substrate; a gate disposed over and substantially perpendicular to the fin; a pair of epitaxial contacts including a III-V material over the fin and on opposing sides of the gate; and a channel region between the pair of epitaxial contacts under the gate including an undoped III-V material between doped III-V materials, the doped III-V materials including a dopant in an amount in a range from about 1e18 to about 1e20 atoms/cm3 and contacting the epitaxial contacts.

公开(公告)号：US09793171B2

公开(公告)日：2017-10-17

申请号：US15179620

申请日：2016-06-10

申请人： International Business Machines Corporation ,  GLOBALFOUNDRIES INC. ,  STMICROELECTRONICS, INC.

发明人： Qing Liu ,  Ruilong Xie ,  Chun-Chen Yeh ,  Xiuyu Cai ,  William J. Taylor

IPC分类号： H01L21/336 ,  H01L21/8234 ,  H01L29/417 ,  H01L29/78 ,  H01L29/66 ,  H01L21/84 ,  H01L27/12 ,  H01L21/285

CPC分类号： H01L21/823475 ,  H01L21/28518 ,  H01L21/823418 ,  H01L21/823431 ,  H01L21/845 ,  H01L27/1211 ,  H01L29/41791 ,  H01L29/66795 ,  H01L29/785

摘要： An integrated circuit transistor is formed on a substrate. A trench in the substrate is at least partially filled with a metal material to form a source (or drain) contact buried in the substrate. The substrate further includes a source (or drain) region in the substrate which is in electrical connection with the source (or drain) contact. The substrate further includes a channel region adjacent to the source (or drain) region. A gate dielectric is provided on top of the channel region and a gate electrode is provided on top of the gate dielectric. The substrate may be of the silicon on insulator (SOI) or bulk type. The buried source (or drain) contact makes electrical connection to a side of the source (or drain) region using a junction provided at a same level of the substrate as the source (or drain) and channel regions.

公开(公告)号：US09748351B2

公开(公告)日：2017-08-29

申请号：US15273777

申请日：2016-09-23

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION ,  GLOBALFOUNDRIES INC. ,  STMICROELECTRONICS, INC.

发明人： Qing Liu ,  Ruilong Xie ,  Chun-Chen Yeh

IPC分类号： H01L29/423 ,  H01L21/8234 ,  H01L27/088 ,  H01L29/49 ,  H01L29/66

CPC分类号： H01L29/42376 ,  H01L21/82345 ,  H01L21/823456 ,  H01L27/088 ,  H01L29/42372 ,  H01L29/495 ,  H01L29/4966 ,  H01L29/66545 ,  H01L29/66553 ,  H01L29/78

摘要： Dummy gates are removed from a pre-metal layer to produce a first opening (with a first length) and a second opening (with a second length longer than the first length). Work function metal for a metal gate electrode is provided in the first and second openings. Tungsten is deposited to fill the first opening and conformally line the second opening, thus leaving a third opening. The thickness of the tungsten layer substantially equals the length of the first opening. The third opening is filled with an insulating material. The tungsten is then recessed in both the first and second openings using a dry etch to substantially a same depth from a top surface of the pre-metal layer to complete the metal gate electrode. Openings left following the recess operation are then filled with a dielectric material forming a cap on the gate stack which includes the metal gate electrode.

公开(公告)号：US20170200807A1

公开(公告)日：2017-07-13

申请号：US15471733

申请日：2017-03-28

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION ,  GLOBALFOUNDRIES Inc. ,  STMicroelectronics, Inc.

发明人： Andrew M. Greene ,  Qing Liu ,  Ruilong Xie ,  Chun-Chen Yeh

IPC分类号： H01L29/66 ,  H01L21/306 ,  H01L29/06 ,  H01L21/762 ,  H01L29/78

CPC分类号： H01L29/66545 ,  H01L21/76224 ,  H01L21/823418 ,  H01L21/823431 ,  H01L21/823468 ,  H01L21/823475 ,  H01L21/823481 ,  H01L27/0886 ,  H01L29/0649 ,  H01L29/495 ,  H01L29/4966 ,  H01L29/4975 ,  H01L29/66515 ,  H01L29/66795 ,  H01L29/785

摘要： A semiconductor device that includes a first fin structure in a first portion of a substrate, and a second fin structure in a second portion of the substrate, wherein the first portion of the substrate is separated from the second portion of the substrate by at least one isolation region. A gate structure present extending from the first fin structure across the isolation region to the second fin structure. The gate structure including a first portion on the first fin structure including a first work function metal having at least one void, an isolation portion that is voidless present overlying the isolation region, and a second portion on the second fin structure including a second work function metal.

公开(公告)号：US20170110583A1

公开(公告)日：2017-04-20

申请号：US15396743

申请日：2017-01-02

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION ,  GlobalFoundries, Inc. ,  STMicroelectronics, Inc.

发明人： Xiuyu Cai ,  Qing Liu ,  Kejia Wang ,  Ruilong Xie ,  Chun-Chen Yeh

IPC分类号： H01L29/78 ,  H01L29/417 ,  H01L29/10

CPC分类号： H01L29/1033 ,  H01L21/30621 ,  H01L29/1054 ,  H01L29/20 ,  H01L29/41791 ,  H01L29/66522 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/66636 ,  H01L29/66795 ,  H01L29/785 ,  H01L29/7851

摘要： A semiconductor device includes a fin patterned in a substrate; a gate disposed over and substantially perpendicular to the fin; a pair of epitaxial contacts including a III-V material over the fin and on opposing sides of the gate; and a channel region between the pair of epitaxial contacts under the gate comprising an undoped III-V material between doped III-V materials, the doped III-V materials including a dopant in an amount in a range from about le18 to about le20 atoms/cm3 and contacting the epitaxial contacts.

公开(公告)号：US20170033221A1

公开(公告)日：2017-02-02

申请号：US14812425

申请日：2015-07-29

申请人： International Business Machines Corporation ,  GlobalFoundries, Inc. ,  STMicroelectronics, Inc.

发明人： Xiuyu Cai ,  Qing Liu ,  Kejia Wang ,  Ruilong Xie ,  Chun-Chen Yeh

IPC分类号： H01L29/78 ,  H01L29/08 ,  H01L29/10 ,  H01L29/66 ,  H01L21/306

CPC分类号： H01L29/1033 ,  H01L21/30621 ,  H01L29/1054 ,  H01L29/20 ,  H01L29/41791 ,  H01L29/66522 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/66636 ,  H01L29/66795 ,  H01L29/785 ,  H01L29/7851

摘要： A semiconductor device includes a fin patterned in a substrate; a gate disposed over and substantially perpendicular to the fin; a pair of epitaxial contacts including a III-V material over the fin and on opposing sides of the gate; and a channel region between the pair of epitaxial contacts under the gate including an undoped III-V material between doped III-V materials, the doped III-V materials including a dopant in an amount in a range from about 1e18 to about 1e20 atoms/cm3 and contacting the epitaxial contacts.

摘要翻译： 半导体器件包括在衬底中图案化的鳍; 设置在所述翅片上并基本上垂直于所述翅片的门; 一对外延触点，包括在鳍的上方和栅极的相对侧上的III-V材料; 以及在栅极下方的一对外延触点之间的沟道区，包括在掺杂III-V材料之间的未掺杂的III-V材料，掺杂的III-V材料包括量为约1e18至约1e20原子/ 并与外延触点接触。

公开(公告)号：US09559018B2

公开(公告)日：2017-01-31

申请号：US15252315

申请日：2016-08-31

申请人： International Business Machines Corporation ,  GLOBALFOUNDRIES, Inc. ,  STMICROELECTRONICS, INC.

发明人： Xiuyu Cai ,  Qing Liu ,  Ruilong Xie ,  Chun-Chen Yeh

IPC分类号： H01L27/12 ,  H01L21/84 ,  H01L29/78

CPC分类号： H01L21/845 ,  H01L27/1211 ,  H01L29/7849

摘要： Fabricating a semiconductor device includes providing a strained semiconductor material (SSM) layer disposed on a dielectric layer, forming a first plurality of fins on the SSOI structure, at least one fin of the first plurality of fins is in a nFET region and at least one fin is in a pFET region, etching portions of the dielectric layer under portions of the SSM layer of the at least one fin in the pFET region, filling areas cleared by the etching, forming a second plurality of fins from the at least one fin in the nFET region such that each fin comprises a portion of the SSM layer disposed on the dielectric layer, and forming a third plurality of fins from the at least one fin in the pFET region such that each fin comprises a portion of the SSM layer disposed on a flowable oxide.

摘要翻译： 制造半导体器件包括提供设置在电介质层上的应变半导体材料（SSM）层，在SSOI结构上形成第一多个鳍片，第一组多个鳍片中的至少一个鳍片在nFET区域中，并且至少一个 鳍状物在pFET区域中，在pFET区域中的至少一个鳍片的SSM层的部分之下蚀刻介电层的部分，通过蚀刻清除的填充区域，从至少一个鳍片形成第二多个鳍片 所述nFET区域使得每个鳍片包括设置在所述电介质层上的所述SSM层的一部分，以及从所述pFET区域中的所述至少一个翅片形成第三多个翅片，使得每个翅片包括设置在所述SSM层上的部分 可流动的氧化物。