公开(公告)号：US20170033088A1

公开(公告)日：2017-02-02

申请号：US15234425

申请日：2016-08-11

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Ron Zhang ,  Daniel Buckminster ,  Guilian Gao

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L21/304 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/52 ,  H01L21/565 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: An apparatus relates generally to an integrated circuit package. In such an apparatus, a package substrate has a first plurality of via structures extending from a lower surface of the package substrate to an upper surface of the package substrate. An die has a second plurality of via structures extending to a lower surface of the die. The lower surface of the die faces the upper surface of the package substrate in the integrated circuit package. The package substrate does not include a redistribution layer. The die and the package substrate are coupled to one another.

Abstract translation: 装置一般涉及集成电路封装。 在这种装置中，封装衬底具有从封装衬底的下表面延伸到封装衬底的上表面的第一多个通孔结构。 模具具有延伸到模具的下表面的第二多个通孔结构。 模具的下表面在集成电路封装中面向封装衬底的上表面。 封装基板不包括再分布层。 管芯和封装衬底彼此耦合。

公开(公告)号：US09991231B2

公开(公告)日：2018-06-05

申请号：US15234425

申请日：2016-08-11

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Ron Zhang ,  Daniel Buckminster ,  Guilian Gao

IPC: H01L21/48 ,  H01L25/065 ,  H01L21/52 ,  H01L21/78 ,  H01L23/48 ,  H01L23/498 ,  H01L23/00 ,  H01L21/768 ,  H01L21/304 ,  H01L21/56 ,  H01L23/31 ,  H01L25/00 ,  H01L23/13

CPC classification number: H01L25/0657 ,  H01L21/304 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/52 ,  H01L21/565 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: An apparatus relates generally to an integrated circuit package. In such an apparatus, a package substrate has a first plurality of via structures extending from a lower surface of the package substrate to an upper surface of the package substrate. An die has a second plurality of via structures extending to a lower surface of the die. The lower surface of the die faces the upper surface of the package substrate in the integrated circuit package. The package substrate does not include a redistribution layer. The die and the package substrate are coupled to one another.

公开(公告)号：US09418924B2

公开(公告)日：2016-08-16

申请号：US14220912

申请日：2014-03-20

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Ron Zhang ,  Daniel Buckminster ,  Guilian Gao

IPC: H01L21/30 ,  H01L23/498 ,  H01L21/52 ,  H01L21/78 ,  H01L23/48 ,  H01L23/00 ,  H01L25/065 ,  H01L21/768 ,  H01L21/304 ,  H01L23/13

CPC classification number: H01L25/0657 ,  H01L21/304 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/52 ,  H01L21/565 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: An apparatus relates generally to an integrated circuit package. In such an apparatus, a package substrate has a first plurality of via structures extending from a lower surface of the package substrate to an upper surface of the package substrate. An die has a second plurality of via structures extending to a lower surface of the die. The lower surface of the die faces the upper surface of the package substrate in the integrated circuit package. The package substrate does not include a redistribution layer. The die and the package substrate are coupled to one another.

Abstract translation: 装置一般涉及集成电路封装。 在这种装置中，封装衬底具有从封装衬底的下表面延伸到封装衬底的上表面的第一多个通孔结构。 模具具有延伸到模具的下表面的第二多个通孔结构。 模具的下表面在集成电路封装中面向封装衬底的上表面。 封装基板不包括再分布层。 管芯和封装衬底彼此耦合。