摘要:
A dielectric ceramic containing Bi, Zn, and Sr as constituent elements. A resin-ceramic composite material containing a mixture of the dielectric ceramic powder and an organic polymer resin. An antenna and an electrical part using the composite material, and a manufacturing method thereof.
摘要:
A small antenna comprises an antenna conductor, and a dielectric chip formed at surroundings of the antenna conductor by a plurality of resin moldings.
摘要:
An antenna apparatus comprises a substrate, a chip antenna mounted on the substrate, and a ground pattern disposed on the substrate, at least a portion on the side of a power supply terminal of an antenna conductor in the chip antenna being overlapped with the ground pattern.
摘要:
A chip antenna comprises an antenna conductor, and a dielectric chip which stacks on a portion of the antenna conductor, in which a conductor exposed portion of the antenna conductor which is not overlapped on the dielectric chip is bent along the surface of the dielectric chip.
摘要:
The present invention provides a planer acoustic transducer including a vibrating diaphragm including a spiral voice coil provided on both surfaces or on one surface of an insulating base film; and a permanent magnet corresponding to the voice coil, wherein, in the vibrating diaphragm, the spiral voice coil is formed by applying a wire conductor, in a coil pattern, onto a sheet-like substrate having an adhesive layer on at least one surface thereof. Alternatively, at least a portion of the vibrating diaphragm, which portion corresponds to the loop of a first or second vibration mode, is reinforced with a rigidity-imparting member; the substrate of the vibrating diaphragm is formed of a resin foam; or the voice coil is formed three-dimensionally.
摘要:
This invention provides a planar acoustic converting apparatus including a support having a flat plate portion, a diaphragm which has an insulating base film having a liquid crystalline polymer film and being opposed to the flat plate portion of the support and at least one spiral coil provided on one major surface or both major surfaces of the insulating base film, at least one permanent magnet supported by the support and opposing a magnetic pole to the diaphragm, and a holding portion provided to the support and holding the diaphragm such that the diaphragm can vibrate and is positioned apart from the at least one permanent magnet.
摘要:
The present invention provides a planer acoustic transducer including a vibrating diaphragm including a spiral voice coil provided on both surfaces or on one surface of an insulating base film; and a permanent magnet corresponding to the voice coil, wherein, in the vibrating diaphragm, the spiral voice coil is formed by applying a wire conductor, in a coil pattern, onto a sheet-like substrate having an adhesive layer on at least one surface thereof. Alternatively, at least a portion of the vibrating diaphragm, which portion corresponds to the loop of a first or second vibration mode, is reinforced with a rigidity-imparting member; the substrate of the vibrating diaphragm is formed of a resin foam; or the voice coil is formed three-dimensionally.
摘要:
An antenna device includes a dielectric chip fitted to an aperture formed in an exterior casing of a terminal unit and having an outer surface thereof cooperating with an outer surface to form part of an outer surface of the terminal unit, and an antenna conductor embedded into the dielectric chip and disposed at a vertical position sufficiently far from a grounding conductor of a printed circuit board in the exterior casing.
摘要:
A multilayer circuit board formed by integrally laminating a plurality of printed wiring boards in a multilayer structure so as to provide air gaps therebetween. An insulating layer is formed on each of both surfaces of a metal core substrate having through-hole forming apertures and a printed wiring layer is formed on the each insulating layer. Metal projections integrally formed on the metal core substrate serve as bonding electrodes between the adjacent wiring boards in the multilayer structure. The width of the air gap provided between the adjacent wiring boards is determined by the height of the metal projections.
摘要:
An injection molding resin-type printed wiring board having an electric circuit pattern layer formed integrally on the surface thereof and having reduced warpage. In the printed circuit board, the injection molding resin includes a thermoplastic resin composition essentially comprising polyethylene terephthalate and containing a flaky inorganic reinforcing material. The inorganic reinforcing material comprises single-substance fine mica flakes or a mixture of fine mica flakes and short glass fibers.