公开(公告)号：US20070017818A1

公开(公告)日：2007-01-25

申请号：US11185591

申请日：2005-07-19

申请人： Ismail Emesh ,  Bulent Basol

发明人： Ismail Emesh ,  Bulent Basol

IPC分类号： B23H5/00

CPC分类号： B23H5/08 ,  C25D3/02 ,  H01L21/32125 ,  H01L21/7684

摘要： A system and method for electropolishing a conductive surface of a wafer using an electrolyte comprising an electrically resistive agent that modulates the conductivity of the electrolyte. The electrically resistive agent is a urea or a urea derivative. The electrolyte may also include a chelating agent a pH adjusting agent, and/or a surface film forming agent. The system includes a wafer carrier configured to hold the wafer, a polishing pad, and an electrode in proximity to the polishing pad. The wafer carrier may be configured to rotate or laterally move the wafer on the polishing surface of the polishing pad.

摘要翻译： 一种使用电解质电解抛光晶片的导电表面的系统和方法，所述电解质包括调节电解质的导电性的电阻剂。 电阻剂是脲或脲衍生物。 电解质还可以包括螯合剂，pH调节剂和/或表面成膜剂。 该系统包括被配置为将晶片，抛光垫和电极保持在抛光垫附近的晶片载体。 晶片载体可以被配置为在抛光垫的抛光表面上旋转或横向移动晶片。

公开(公告)号：US20070293040A1

公开(公告)日：2007-12-20

申请号：US11742302

申请日：2007-04-30

申请人： Ismail Emesh ,  Chantal Arena ,  Bulent Basol

发明人： Ismail Emesh ,  Chantal Arena ,  Bulent Basol

IPC分类号： H01L21/4763

CPC分类号： H01L21/76898 ,  H01L21/288

摘要： A method of filling a conductive material in a three dimensional integration feature formed on a surface of a wafer is disclosed. The feature is optionally lined with dielectric and/or adhesion/barrier layers and then filled with a liquid mixture containing conductive precursor, such as a solution with dissolved ruthenium precursor or a dispersion or suspension with conductive particles (e.g., gold, silver, copper), and the substrate is rotated while the mixture is on its surface. Then, the liquid carrier is dried from the feature, leaving a conductive layer in the feature. These two steps are optionally repeated until the feature is filled up with the conductor. Then, the conductor is annealed in the feature, thereby forming a dense conductive plug in the feature.

摘要翻译： 公开了一种在晶片表面形成的三维积分特征中填充导电材料的方法。 该特征可选地衬有介电和/或粘附/阻挡层，然后填充含有导电前体的液体混合物，例如具有溶解的钌前体的溶液或具有导电颗粒（例如金，银，铜）的分散体或悬浮液， 并且当混合物在其表面上时基板旋转。 然后，从特征中干燥液体载体，在该特征中留下导电层。 可选地重复这两个步骤，直到特征被导体填满。 然后，导体在特征中退火，从而在该特征中形成致密的导电插塞。

公开(公告)号：US20070111523A1

公开(公告)日：2007-05-17

申请号：US11283112

申请日：2005-11-17

申请人： Ismail Emesh ,  Bulent Basol

发明人： Ismail Emesh ,  Bulent Basol

IPC分类号： H01L21/44

CPC分类号： H01L21/32115 ,  H01L21/02074 ,  H01L21/32125 ,  H01L21/67028 ,  H01L21/67051

摘要： A method of conditioning an electropolished conductive layer of a substrate is disclosed, the conductive layer having impurities thereon. The conductive layer may be formed on a thin conductive film or barrier layer that coats one or more cavities formed on the substrate surface. The method comprises applying a first process solution onto the electropolished conductive layer to dissolve a portion thereof, and then applying a second process solution onto the conductive layer. The second process solution is preferably configured to charge and move the impurities away from the conductive layer. The substrate surface can then be rinsed to remove the first and second process solutions and the impurities.

摘要翻译： 公开了一种调节基底的电抛光导电层的方法，该导电层上具有杂质。 导电层可以形成在涂覆在衬底表面上形成的一个或多个空腔的薄导电膜或阻挡层上。 该方法包括将第一工艺溶液施加到电抛光导电层上以溶解其一部分，然后将第二工艺溶液施加到导电层上。 第二工艺溶液优选构造成使杂质从导电层充电并移动。 然后可以将衬底表面漂洗以除去第一和第二工艺溶液和杂质。

公开(公告)号：US07572354B2

公开(公告)日：2009-08-11

申请号：US11445594

申请日：2006-06-01

申请人： Cyprian Emeka Uzoh ,  Homayoun Talieh ,  Bulent Basol ,  Douglas W. Young

发明人： Cyprian Emeka Uzoh ,  Homayoun Talieh ,  Bulent Basol ,  Douglas W. Young

IPC分类号： C25B9/00 ,  C25D7/00

CPC分类号： B24B37/20 ,  B24B37/046 ,  B24B37/24 ,  B24B37/26 ,  C25D5/06 ,  C25D17/001 ,  C25D17/14 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/76877

摘要： The present invention relates to methods and apparatus for plating a conductive material on a semiconductor substrate by rotating pad or blade type objects in close proximity to the substrate, thereby eliminating/reducing dishing and voids. This is achieved by providing pad or blade type objects mounted on cylindrical anodes or rollers and applying the conductive material to the substrate using the electrolyte solution disposed on or through the pads, or on the blades. In one embodiment of the invention, the pad or blade type objects are mounted on the cylindrical anodes and rotated about a first axis while the workpiece may be stationary or rotate about a second axis, and metal from the electrolyte solution is deposited on the workpiece when a potential difference is applied between the workpiece and the anode. In another embodiment of the present invention, the plating apparatus includes an anode plate spaced apart from the cathode workpiece. Upon application of power to the anode plate and the cathode workpiece, the electrolyte solution disposed in the plating apparatus is used to deposit the conductive material on the workpiece surface using cylindrical rollers having the pad or blade type objects.

摘要翻译： 本发明涉及通过旋转靠近基板的垫片或刀片型物体来在半导体衬底上镀覆导电材料的方法和装置，从而消除/减少凹陷和空隙。 这通过提供安装在圆柱形阳极或辊子上的垫片或刀片型物体，并使用设置在垫片上或穿过垫片上的电解质溶液将导电材料施加到衬底来实现。 在本发明的一个实施例中，衬垫或刀片型物体安装在圆柱形阳极上并围绕第一轴线旋转，同时工件可以是静止的或围绕第二轴线旋转，并且来自电解质溶液的金属沉积在工件上， 在工件和阳极之间施加电位差。 在本发明的另一实施例中，电镀装置包括与阴极工件间隔开的阳极板。 在向阳极板和阴极工件施加电力时，使用设置在电镀装置中的电解液将导电材料沉积在工件表面上，使用具有焊盘或刀片型物体的圆柱形辊。

公开(公告)号：US20080023336A1

公开(公告)日：2008-01-31

申请号：US11829052

申请日：2007-07-26

申请人： Bulent Basol

发明人： Bulent Basol

IPC分类号： C25D5/10

CPC分类号： H01L31/0322 ,  H01L31/0323 ,  Y02E10/541

摘要： The present invention includes methods and apparatus therefrom for preparing thin films of doped semiconductors for radiation detector and photovoltaic applications, and particularly method and apparatus that increase dopants of alkali metals in Group IBIIIAVIA layers. In a particular aspect, the present invention includes a method of preparing a doped Group IBIIIAVIA absorber layer for a solar cell, with the absorber layer being formed by reaction, with a Group VIA material, of a metallic stack with a plurality of layers, in which each layer contains a concentration of an alkali metal selected from the group of Na, K and Li.

摘要翻译： 本发明包括用于制备用于辐射检测器和光伏应用的掺杂半导体的薄膜的方法和装置，以及特别是增加IBIIIAVIA组中碱金属的掺杂剂的方法和装置。 在一个具体方面，本发明包括一种制备用于太阳能电池的掺杂IBIIIAVIA族吸收层的方法，其中吸收层通过与VIA族材料反应而形成具有多层的金属叠层 其各层含有选自Na，K和Li族的碱金属的浓度。

公开(公告)号：US20070181443A1

公开(公告)日：2007-08-09

申请号：US11347669

申请日：2006-02-03

申请人： Bulent Basol ,  Jeffrey Bogart

发明人： Bulent Basol ,  Jeffrey Bogart

IPC分类号： B23H7/00

CPC分类号： B23H5/08 ,  B24B37/04 ,  B24B57/02 ,  C25D7/12 ,  C25D17/14 ,  C25F7/00

摘要： An electrode assembly includes a distribution plate having a plurality of grooves that communicate with openings in an overlying polishing pad layer. The grooves include end openings that allow for draining of process solution, both during processing and subsequent cleaning/rinsing of the pad. Drainage occurs continually during processing, cleaning and rinsing, and so is constricted through the end openings relative to the grooves, to prevent wastage. The end openings are sufficiently large, however, to substantially completely drain fluids from the grooves between steps without delaying robotic motions.

摘要翻译： 电极组件包括分配板，该分配板具有与上覆的抛光垫层中的开口连通的多个凹槽。 凹槽包括允许在处理过程中和随后的垫的清洗/漂洗过程中排出工艺溶液的端部开口。 在加工，清洁和冲洗期间，排水不断发生，并且相对于凹槽通过端部开口收缩，以防止浪费。 然而，端部开口足够大，从而基本上完全排出在步骤之间的槽中的流体，而不会延迟机器人运动。

公开(公告)号：US20070141818A1

公开(公告)日：2007-06-21

申请号：US11313249

申请日：2005-12-19

申请人： Bulent Basol

发明人： Bulent Basol

IPC分类号： H01L21/20

CPC分类号： H01L21/76843 ,  C25D5/04 ,  C25D5/10 ,  C25D17/001 ,  C25D17/005 ,  H01L21/2885 ,  H01L21/76846 ,  H01L21/76873 ,  H01L21/76877 ,  H01L2221/1089

摘要： Methods of forming conductive layers over a substrate include contacting a barrier layer with an electrical contact and establishing a relative motion between the electrical contact and the barrier layer for a predetermined period of time, thereby electrodepositing conductive material from a process solution onto the barrier layer. The methods may be repeated to form an other conductive layer over the barrier layer.

摘要翻译： 在衬底上形成导电层的方法包括使阻挡层与电接触接触，并且在电接触和阻挡层之间建立预定时间段的相对运动，从而将导电材料从工艺溶液电沉积到阻挡层上。 可以重复这些方法以在阻挡层上形成另一导电层。

公开(公告)号：US20070131563A1

公开(公告)日：2007-06-14

申请号：US11564242

申请日：2006-11-28

申请人： Jeffrey Bogart ,  Bulent Basol

发明人： Jeffrey Bogart ,  Bulent Basol

IPC分类号： B23H3/00

CPC分类号： B23H5/08 ,  C25D5/06 ,  C25D17/001 ,  C25D17/06 ,  C25D17/14 ,  H01L21/2885 ,  H01L21/7684 ,  H01L21/76877

摘要： An electrochemical mechanical process for electroplating or electropolishing a conductive surface of a wafer is provided. The conductive surface of the wafer is touched by a polishing surface of a compressible pad while a process solution flows through the pad and a potential difference is maintained between the conductive surface and an electrode. The pressure between the polishing surface and a central region of the conductive surface is increased by applying a shaping process to either the conductive surface or the pad.

摘要翻译： 提供了用于电镀或电抛光晶片的导电表面的电化学机械工艺。 当处理液流过焊盘时，晶片的导电表面被可压缩焊盘的抛光表面接触，并且在导电表面和电极之间保持电位差。 抛光表面和导电表面的中心区域之间的压力通过对导电表面或焊盘施加成型工艺而增加。

公开(公告)号：US20070111367A1

公开(公告)日：2007-05-17

申请号：US11549590

申请日：2006-10-13

申请人： Bulent Basol

发明人： Bulent Basol

IPC分类号： H01L21/00 ,  C23C16/00

CPC分类号： C23C16/305 ,  C23C16/54 ,  H01L31/0322 ,  H01L31/03928 ,  Y02E10/541

摘要： The present invention relates to method and apparatus for preparing thin films of semiconductor films for radiation detector and photovoltaic applications. In one aspect, the present invention includes a series of chambers between the inlet and the outlet, with each chamber having a gap that allows a substrate to pass therethrough and which is temperature controlled, thereby allowing each chamber to maintain a different temperature, and the substrate to be annealed based upon a predetermined temperature profile by efficiently moving through the series of chambers. In another aspect, each of the chambers opens and closes, and creates a seal when in the closed position during which time annealing takes place within the gap of the chamber. In a further aspect, the present invention provides a method of forming a Group IBIIIAVIA compound layer on a surface of a flexible roll.

摘要翻译： 本发明涉及用于制备用于辐射检测器和光伏应用的半导体膜的薄膜的方法和装置。 在一个方面，本发明包括在入口和出口之间的一系列室，每个室具有允许基板通过并且被温度控制的间隙，从而允许每个室保持不同的温度，并且 基于通过有效地移动通过该系列室的预定温度分布来退火的基板。 在另一方面，每个室都打开和关闭，并且当处于关闭位置时产生密封，在该位置期间在室的间隙内进行退火。 另一方面，本发明提供了在柔性卷的表面上形成IBIIIAVIA族化合物层的方法。

公开(公告)号：US20060252254A1

公开(公告)日：2006-11-09

申请号：US11351838

申请日：2006-02-09

申请人： Bulent Basol

发明人： Bulent Basol

IPC分类号： H01L21/4763

CPC分类号： H01L21/2885 ,  H01L21/76877 ,  H01L21/76898

摘要： Relatively large openings or features in integrated circuit metallization or packaging vias are filled by two plating or electrodeposition processes in sequence. The first electrodeposition process conformally lines the large, high aspect ratio features to define an inner cavity. The second electrodeposition process uses a different solution to bottom-up fill the inner cavity left by the first electrodeposition process. Conformality is typically induced by use of levelers during the first electrodeposition, while accelerators and suppressors may be used to promote bottom-up fill during the second electrodeposition, although either process may employ any of the three additives.

摘要翻译： 集成电路金属化或封装通孔中的相对较大的开口或特征依次由两个电镀或电沉积工艺填充。 第一电沉积工艺一致地排列了大的高纵横比特征以限定内腔。 第二个电沉积过程使用不同的解决方案来自底向上填充第一次电沉积过程留下的内腔。 通常在第一次电沉积期间通过使用矫直机诱导一致性，而在第二次电沉积期间可以使用促进剂和抑制剂来促进自底向上填充，尽管任一方法都可以使用三种添加剂中的任何一种。