Resin composition, resist underlayer film, resist underlayer film-forming method and pattern-forming method
    2.
    发明授权
    Resin composition, resist underlayer film, resist underlayer film-forming method and pattern-forming method 有权
    树脂组合物,抗蚀剂下层膜,抗蚀剂下层膜形成方法和图案形成方法

    公开(公告)号:US09091922B2

    公开(公告)日:2015-07-28

    申请号:US13714406

    申请日:2012-12-14

    CPC classification number: G03F7/11 G03F7/091 H01L21/0276

    Abstract: A resin composition for forming a resist underlayer film includes a resin that includes an aromatic ring, and a crosslinking agent having a partial structure represented by a following formula (i). X represents an oxygen atom, a sulfur atom, *—COO— or —NRA—. R1 represents a hydrogen atom or a C1-30 monovalent hydrocarbon group. R2 represents a hydroxy group, a sulfanil group, a cyano group, a nitro group, a C1-30 monovalent hydrocarbon group, a C1-30 monovalent oxyhydrocarbon group or a C1-30 monovalent sulfanilhydrocarbon group. p is an integer of 1 to 3.

    Abstract translation: 用于形成抗蚀剂下层膜的树脂组合物包括具有芳环的树脂和具有由下式(i)表示的部分结构的交联剂。 X表示氧原子,硫原子,* -COO-或-NRA-。 R1表示氢原子或C1-30一价烃基。 R2表示羟基,磺胺基,氰基,硝基,C1-30一价烃基,C1-30一价羟基烃基或C1-30一价硫代烃基。 p为1〜3的整数。

    PATTERN-FORMING METHOD, AND COMPOSITION FOR FORMING RESIST UNDERLAYER FILM
    3.
    发明申请
    PATTERN-FORMING METHOD, AND COMPOSITION FOR FORMING RESIST UNDERLAYER FILM 审中-公开
    形成图案的方法以及用于形成电阻膜的组合物

    公开(公告)号:US20140371466A1

    公开(公告)日:2014-12-18

    申请号:US14477306

    申请日:2014-09-04

    Abstract: Providing a method for forming a pattern capable of forming a resist underlayer film that can be easily removed using an alkali liquid while maintaining etching resistance is objected to. Provided by the present invention is a method for forming a pattern, the method including: (1) forming a resist underlayer film on a substrate using a composition for forming a resist underlayer film containing a compound having an alkali-cleavable functional group; (2) forming a resist pattern on the resist underlayer film; (3) forming a pattern on the substrate by dry etching of the resist underlayer film and the substrate, using the resist pattern as a mask; and (4) removing the resist underlayer film with an alkali liquid.

    Abstract translation: 提供一种能够形成能够形成抗蚀剂下层膜的图案的方法,该方法能够在保持耐蚀刻性的同时使用碱液容易地除去。 本发明提供一种形成图案的方法,该方法包括:(1)使用含有具有可碱解官能团的化合物的形成抗蚀剂下层膜的组合物在基材上形成抗蚀剂下层膜; (2)在抗蚀剂下层膜上形成抗蚀剂图案; (3)使用抗蚀剂图案作为掩模,通过干蚀刻抗蚀剂下层膜和基板在基板上形成图案; 和(4)用碱液除去抗蚀剂下层膜。

    Pattern-forming method, and composition for forming resist underlayer film
    5.
    发明授权
    Pattern-forming method, and composition for forming resist underlayer film 有权
    图案形成方法和用于形成抗蚀剂下层膜的组合物

    公开(公告)号:US09046769B2

    公开(公告)日:2015-06-02

    申请号:US14477306

    申请日:2014-09-04

    Abstract: Providing a method for forming a pattern capable of forming a resist underlayer film that can be easily removed using an alkali liquid while maintaining etching resistance is objected to. Provided by the present invention is a method for forming a pattern, the method including: (1) forming a resist underlayer film on a substrate using a composition for forming a resist underlayer film containing a compound having an alkali-cleavable functional group; (2) forming a resist pattern on the resist underlayer film; (3) forming a pattern on the substrate by dry etching of the resist underlayer film and the substrate, using the resist pattern as a mask; and (4) removing the resist underlayer film with an alkali liquid.

    Abstract translation: 提供一种能够形成能够形成抗蚀剂下层膜的图案的方法,该方法能够在保持耐蚀刻性的同时使用碱液容易地除去。 本发明提供一种形成图案的方法,该方法包括:(1)使用含有具有可碱解官能团的化合物的形成抗蚀剂下层膜的组合物在基材上形成抗蚀剂下层膜; (2)在抗蚀剂下层膜上形成抗蚀剂图案; (3)使用抗蚀剂图案作为掩模,通过干蚀刻抗蚀剂下层膜和基板在基板上形成图案; 和(4)用碱液除去抗蚀剂下层膜。

    Method for forming pattern, and composition for forming resist underlayer film
    6.
    发明授权
    Method for forming pattern, and composition for forming resist underlayer film 有权
    形成图案的方法和用于形成抗蚀剂下层膜的组合物

    公开(公告)号:US09182671B2

    公开(公告)日:2015-11-10

    申请号:US13630340

    申请日:2012-09-28

    Abstract: A method for forming a pattern includes providing a resist underlayer film on a substrate using a first composition for forming a resist underlayer film. The first composition includes a polymer having a structural unit represented by a following formula (1). In the formula (1), Ar1 and Ar2 each independently represent a bivalent group represented by a following formula (2). A resist coating film is provided on the resist underlayer film using a resist composition. A resist pattern is formed using the resist coating film. A predetermined pattern is formed on the substrate by sequentially dry-etching the resist underlayer film and the substrate using the resist pattern as a mask.

    Abstract translation: 形成图案的方法包括使用第一组合物形成抗蚀剂下层膜,在基片上提供抗蚀剂下层膜。 第一组合物包括具有由下式(1)表示的结构单元的聚合物。 在式(1)中,Ar 1和Ar 2各自独立地表示由下式(2)表示的二价基团。 使用抗蚀剂组合物在抗蚀剂下层膜上设置抗蚀剂涂膜。 使用抗蚀剂涂膜形成抗蚀剂图案。 通过使用抗蚀剂图案作为掩模,依次干蚀刻抗蚀剂下层膜和基板,在基板上形成预定图案。

    COMPOSITION FOR FORMING RESIST UNDERLAYER FILM
    7.
    发明申请
    COMPOSITION FOR FORMING RESIST UNDERLAYER FILM 审中-公开
    用于形成电阻膜的组合物

    公开(公告)号:US20150197664A1

    公开(公告)日:2015-07-16

    申请号:US14669995

    申请日:2015-03-26

    Abstract: A composition for forming a resist underlayer film includes (A) a compound. The compound (A) includes a group represented by formula (1). R represents a monovalent organic group having 1 to 30 carbon atoms. The monovalent organic group represented by R does not include an oxygen atom at an end of the side adjacent the sulfur atom. * represents a bonding hand. The compound (A) preferably includes a ring which is an aromatic ring, a heteroaromatic ring, or a combination thereof. The bonding hand denoted by * in the group represented by the formula (1) is preferably linked directly or via an oxygen atom to the ring.

    Abstract translation: 用于形成抗蚀剂下层膜的组合物包括(A)化合物。 化合物(A)包括由式(1)表示的基团。 R表示碳原子数为1〜30的1价有机基团。 由R表示的一价有机基团不包括邻近硫原子的一端的氧原子。 *表示粘合手。 化合物(A)优选包括芳香环,杂芳环或其组合的环。 由式(1)表示的基团中由*表示的键合键优选直接或经由氧原子与环连接。

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