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公开(公告)号:US20180218959A1
公开(公告)日:2018-08-02
申请号:US15877538
申请日:2018-01-23
Applicant: JTEKT CORPORATION
Inventor: Naoki TANI
IPC: H01L23/36 , H01L29/423 , H05K1/02 , H01L23/488 , H01L23/538
CPC classification number: H01L23/36 , H01L23/488 , H01L23/5389 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/73 , H01L29/4238 , H01L2224/13013 , H01L2224/131 , H01L2224/14051 , H01L2224/14151 , H01L2224/14156 , H01L2224/14517 , H01L2224/16227 , H01L2224/16245 , H01L2224/29013 , H01L2224/291 , H01L2224/30051 , H01L2224/30151 , H01L2224/30156 , H01L2224/30517 , H01L2224/32014 , H01L2224/32245 , H01L2224/33051 , H01L2224/33181 , H01L2224/73253 , H01L2224/81801 , H01L2224/81825 , H01L2224/83801 , H01L2224/83825 , H01L2924/3511 , H02K9/22 , H02K11/33 , H05K1/0201 , H05K2201/10439 , H01L2924/014 , H01L2924/00012 , H01L2924/00014
Abstract: An electrode surface of a horizontal semiconductor chip and a substrate are joined together through a plurality of first joint portions including a plurality of joint portions at which a plurality of electrodes formed on the electrode surface are joined to the substrate. A no-electrode surface of the horizontal semiconductor chip and a heatsink are joined together through a second joint portion at which the no-electrode surface and the heatsink are joined together. In a plan view from a direction normal to a principal surface of the substrate, when a region inside the outline of the rough shape of an aggregate of the first joint portions is a first joint region and a region inside the outline of the second joint portion is a second joint region, the first joint region and the second joint region are the same in position, shape, and size.
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公开(公告)号:US20210277939A1
公开(公告)日:2021-09-09
申请号:US17188407
申请日:2021-03-01
Applicant: JTEKT CORPORATION
Inventor: Takahito HIEDA , Naoki TANI
Abstract: A rolling bearing device includes a rolling bearing that includes an outer ring having an inner peripheral surface on which a first raceway surface is provided, an inner ring having an outer peripheral surface on which a second raceway surface is provided, and rolling elements interposed between the first and the second raceway surfaces; a strain sensor configured to detect a strain of the rolling bearing; and a fixation portion configured to fix the strain sensor to a peripheral surface that includes at least one of an outer peripheral surface of the outer ring and an inner peripheral surface of the inner ring. The fixation portion fixes at least two locations in the strain sensor to the peripheral surface such that a detection region of the strain sensor and the peripheral surface are not fixed to each other, the at least two locations facing each other across the detection region.
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3.
公开(公告)号:US20130285513A1
公开(公告)日:2013-10-31
申请号:US13866179
申请日:2013-04-19
Applicant: JTEKT CORPORATION
Inventor: Naoki TANI , Shigeki NAGASE
CPC classification number: H05K7/209 , H02K11/0094 , H02K11/04 , H02K11/042 , H02K11/049 , H02K11/05 , H02K11/33 , H02K11/38 , H02K29/00 , H05K7/2039
Abstract: A control device for a motor unit includes: a housing including a bottom wall, a side wall and an accommodation space formed so as to be surrounded by the side wall; a heat sink including a first heat dissipation wall portion upright from the bottom wall in the accommodation space, the first heat dissipation wall portion upright having a first heat dissipation principal surface; a first board portion mounted on the first heat dissipation principal surface and having a first principal surface; and a circuit board including a power element mounted on the first principal surface.
Abstract translation: 一种用于电动机单元的控制装置包括:壳体,包括底壁,侧壁和形成为被侧壁包围的容纳空间; 所述散热器包括从所述容纳空间的所述底壁竖立的第一散热壁部,所述第一散热壁部直立件具有第一散热主面; 安装在第一散热主表面上并具有第一主表面的第一板部分; 以及包括安装在第一主表面上的功率元件的电路板。
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公开(公告)号:US20160352190A1
公开(公告)日:2016-12-01
申请号:US15157977
申请日:2016-05-18
Applicant: JTEKT CORPORATION
Inventor: Takahito HIEDA , Naoki TANI
IPC: H02K11/215 , H02K11/01
CPC classification number: H02K11/215 , G01D5/145 , G01D5/24433 , H02K11/00 , H02K11/01 , H02K11/33
Abstract: A rotation angle detection device detects a rotation angle of a motor having a shaft passing through a heat-dissipation plate. The rotation angle detection device includes: a permanent magnet attached to a base end of the shaft; a board that is disposed above the heat-dissipation plate and on which a drive circuit of the motor and a control circuit of the drive circuit are mounted; a magnetic sensor that is provided on the board so as to face the permanent magnet; and a magnetic shielding member that has a tubular shape and is disposed between the heat-dissipation plate and the board to surround the permanent magnet in plan view.
Abstract translation: 旋转角度检测装置检测具有通过散热板的轴的电机的旋转角度。 旋转角度检测装置包括:安装在轴的基端的永磁体; 布置在散热板上方并安装有电动机的驱动电路和驱动电路的控制电路的板; 磁性传感器,其设置在所述板上以面对所述永磁体; 以及磁屏蔽构件,其具有管状并且设置在散热板和板之间以在平面图中围绕永磁体。
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公开(公告)号:US20160351469A1
公开(公告)日:2016-12-01
申请号:US15160155
申请日:2016-05-20
Applicant: JTEKT CORPORATION
Inventor: Takahito HIEDA , Motoo NAKAI , Nobuhiro UCHIDA , Naoki TANI
IPC: H01L23/367 , H01L27/06 , H01L29/20
CPC classification number: H01L23/3675 , H01L23/367 , H01L23/42 , H01L23/433 , H01L24/31 , H01L27/0629 , H01L29/2003 , H01L2224/131 , H01L2224/291 , H01L2224/73253 , H02M7/003 , H01L2924/014
Abstract: In a semiconductor device, a first to a sixth switching elements are joined to a second main surface of a substrate with their electrode surfaces facing the second main surface of the substrate. Non-electrode surfaces of the switching elements are provided with respective heat spreaders joined thereto. Each of the heat spreaders is constituted of a heat spreader main body and a pair of standing portions. The heat spreader main body is formed in a cuboid having rectangular flat surfaces that are elongated in one direction. The standing portions are standing on both edges of a surface of the heat spreader main body.
Abstract translation: 在半导体器件中,第一至第六开关元件与基板的第二主表面接合,其电极表面面向基板的第二主表面。 开关元件的非电极表面设置有与其连接的相应的散热器。 每个散热器由散热器主体和一对直立部构成。 散热器主体形成为具有在一个方向上延伸的矩形平坦表面的长方体。 站立部分站立在散热器主体的表面的两个边缘上。
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6.
公开(公告)号:US20140009012A1
公开(公告)日:2014-01-09
申请号:US13924918
申请日:2013-06-24
Applicant: JTEKT CORPORATION
Inventor: Naoki TANI
CPC classification number: H05K7/2039 , H02K7/116 , H02K9/00 , H02K11/21 , H02K11/225 , H02K11/33
Abstract: A control device of a motor unit includes a housing, and a circuit board that is housed in the housing. The circuit board includes a first substrate portion which is fixed to a side wall and in which heat dissipation components are fitted onto a first main surface, a second substrate portion in which a second main surface faces the first main surface of the first substrate portion, and heating elements are fitted onto the second main surface, and a first connecting portion that connects an end portion of the first substrate portion with an end portion of the second substrate portion. The heating elements and the heat dissipation components face each other.
Abstract translation: 电动机单元的控制装置包括壳体和容纳在壳体中的电路板。 电路板包括:第一基板部分,其固定到侧壁并且其中散热部件装配到第一主表面上;第二基板部分,其中第二主表面面对第一基板部分的第一主表面; 并且加热元件安装在第二主表面上,第一连接部分将第一基板部分的端部与第二基板部分的端部连接起来。 加热元件和散热部件彼此面对。
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公开(公告)号:US20170366073A1
公开(公告)日:2017-12-21
申请号:US15622263
申请日:2017-06-14
Applicant: JTEKT CORPORATION
Inventor: Takahito HIEDA , Kouya YOSHIDA , Naoki TANI
CPC classification number: H02K11/33 , H01L23/3675 , H02K9/22 , H02M7/003
Abstract: In a driving unit of an electromechanical motor unit, a semiconductor chip and a smoothing capacitor are joined to a second main surface of a substrate having a first main surface and the second main surface. The semiconductor chip includes a first end portion facing the second main surface, and a second end portion on the opposite side of the semiconductor chip from the first end portion. The smoothing capacitor includes a third end portion facing the second main surface, and a fourth end portion on the opposite side of the smoothing capacitor from the third end portion. The semiconductor chip is thermally connected to a bottom wall portion of a cover member, at a position closer to the second main surface than the fourth end portion is. The bottom wall portion is thermally connected to the motor housing via a sidewall portion of the cover member.
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公开(公告)号:US20170372990A1
公开(公告)日:2017-12-28
申请号:US15623943
申请日:2017-06-15
Applicant: JTEKT CORPORATION
Inventor: Naoki TANI
IPC: H01L23/498 , H01L23/00 , H01L23/522
CPC classification number: H01L23/49816 , H01L23/12 , H01L23/49827 , H01L23/49838 , H01L23/522 , H01L23/562 , H01L2224/16225 , H01L2224/73204 , H05K1/0271 , H05K2201/068 , H05K2201/09136 , H05K2201/10568 , H05K2201/2018
Abstract: A semiconductor device includes a semiconductor element, a circuit board, metal wires, and an expanding member. The circuit board has an upper surface and a lower surface opposite the upper surface. The metal wires arc formed on at least one of the upper surface and the lower surface. At least two connection terminals are formed in a terminal formation surface of the semiconductor element which is disposed so as to face the upper surface of the circuit board. The expanding member is fixed to the terminal formation surface of the semiconductor element, has a larger coefficient of linear thermal expansion than the semiconductor element, and has a size larger than the interval between adjacent two of the at least two connection terminals.
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