Method for manufacturing vertical group III-nitride light emitting device
    1.
    发明申请
    Method for manufacturing vertical group III-nitride light emitting device 有权
    垂直III族氮化物发光器件的制造方法

    公开(公告)号:US20060234408A1

    公开(公告)日:2006-10-19

    申请号:US11401329

    申请日:2006-04-11

    IPC分类号: H01L21/00

    摘要: The invention provides a vertical group III-nitride light emitting device improved in external extraction efficiency and a method for manufacturing the same. The method includes forming an undoped GaN layer and an insulating layer on a basic substrate. Then, the insulating layer is selectively etched to form an insulating pattern, and an n-doped AlxGayIn(1-x-y)N layer, an active layer and a p-doped AlmGanIn(1-m-n)N layer are sequentially formed on the insulating pattern. A conductive substrate is formed on the p-doped AlmGanIn(1-m-n)N layer. The basic substrate, the undoped gaN layer and the insulating pattern are removed, and an n-electrode is formed on a part of the exposed surface of the n-doped AlxGayIn(1-x-y)N layer.

    摘要翻译: 本发明提供一种提高外部提取效率的垂直III族氮化物发光器件及其制造方法。 该方法包括在碱性衬底上形成未掺杂的GaN层和绝缘层。 然后,绝缘层被选择性地蚀刻以形成绝缘图案,并且n掺杂的Al x(1-xy) N层,有源层和p掺杂的Al N n N n层(1-mn)N层依次形成在绝缘层 模式。 导电衬底形成在p掺杂的Al(n-n)N层上。 去除基本衬底,未掺杂的GaN层和绝缘图案,并且在n掺杂的Al x Ga y y y的暴露表面的一部分上形成n电极, (1-xy)N层。

    Flip-chip type nitride semiconductor light emitting diode
    2.
    发明申请
    Flip-chip type nitride semiconductor light emitting diode 失效
    倒装型氮化物半导体发光二极管

    公开(公告)号:US20060192206A1

    公开(公告)日:2006-08-31

    申请号:US11150288

    申请日:2005-06-13

    IPC分类号: H01L33/00

    摘要: Disclosed herein is a flip-chip type nitride semiconductor light emitting diode. The light emitting diode comprises an n-type nitride semiconductor layer formed on a transparent substrate and having a substantially rectangular upper surface, an n-side electrode which comprises at least one bonding pad adjacent to at least one corner of the upper surface of the n-type nitride semiconductor layer, extended electrodes formed in a band from the bonding pad along four sides of the upper surface of the n-type nitride semiconductor layer and one or more fingers extended in a diagonal direction of the upper surface from the bonding pad and/or the extended electrodes, an active layer and a p-type nitride semiconductor layer sequentially stacked on a region of the n-type nitride semiconductor layer where the n-side electrode is not formed, and a highly reflective ohmic contact layer formed on the p-type nitride semiconductor layer.

    摘要翻译: 本文公开了倒装芯片型氮化物半导体发光二极管。 发光二极管包括形成在透明基板上并具有基本上矩形的上表面的n型氮化物半导体层,n侧电极包括与n的上表面的至少一个角相邻的至少一个焊盘 型氮化物半导体层,从接合焊盘沿着n型氮化物半导体层的上表面的四边形成的带状的延伸电极和从接合焊盘沿上表面的对角线方向延伸的一个或多个指状物, 或者在n型氮化物半导体层的未形成n侧电极的区域上依次堆叠的延伸电极,有源层和p型氮化物半导体层以及形成在该n型氮化物半导体层上的高反射欧姆接触层 p型氮化物半导体层。

    Vertical group III-nitride light emitting device and method for manufacturing the same
    3.
    发明申请
    Vertical group III-nitride light emitting device and method for manufacturing the same 审中-公开
    垂直III族氮化物发光器件及其制造方法

    公开(公告)号:US20060225644A1

    公开(公告)日:2006-10-12

    申请号:US11398713

    申请日:2006-04-06

    摘要: A vertical group III-nitride light emitting device and a manufacturing method thereof are provided. The light emitting device comprises: a conductive substrate; a p-type clad layer stacked on the conductive substrate; an active layer stacked on the p-type clad layer; an n-doped AlxGayIn1-x-yN layer stacked on the active layer; an undoped GaN layer stacked on the n-doped layer; and an n-electrode formed on the undoped GaN layer. The undoped GaN layer has a rough pattern formed on a top surface thereof.

    摘要翻译: 提供了垂直III族氮化物发光器件及其制造方法。 发光器件包括:导电衬底; 层叠在导电性基板上的p型覆层; 堆叠在p型覆盖层上的有源层; 层叠在有源层上的n掺杂的Al x Ga y In 1 N x N y N n层; 堆叠在n掺杂层上的未掺杂的GaN层; 以及形成在未掺杂的GaN层上的n电极。 未掺杂的GaN层在其顶表面上形成粗糙图案。

    Nitride semiconductor light emitting device and method of manufacturing the same
    4.
    发明申请
    Nitride semiconductor light emitting device and method of manufacturing the same 审中-公开
    氮化物半导体发光器件及其制造方法

    公开(公告)号:US20060249736A1

    公开(公告)日:2006-11-09

    申请号:US11414371

    申请日:2006-05-01

    IPC分类号: H01L33/00

    摘要: The present invention relates to a nitride semiconductor light emitting device. The nitride semiconductor light emitting device includes an n-type electrode; an n-type nitride semiconductor layer that is formed to come in contact with the n-type electrode; an active layer that is formed on the n-type nitride semiconductor layer; a p-type nitride semiconductor layer that is formed on the active layer; an undoped GaN layer that is formed on the p-type nitride semiconductor layer; an AlGaN layer that is formed on the undoped GaN layer so as to provide a two-dimensional electron gas layer to the interface with the undoped GaN layer; a reflecting layer that is formed on the AlGaN layer; a barrier that is formed so as to surround the reflecting layer; and a p-type electrode that is formed on the barrier.

    摘要翻译: 本发明涉及一种氮化物半导体发光器件。 氮化物半导体发光器件包括n型电极; 形成为与n型电极接触的n型氮化物半导体层; 形成在n型氮化物半导体层上的有源层; 形成在有源层上的p型氮化物半导体层; 在p型氮化物半导体层上形成的未掺杂的GaN层; AlGaN层,形成在未掺杂的GaN层上,以便在与未掺杂的GaN层的界面上提供二维电子气层; 形成在AlGaN层上的反射层; 形成为围绕反射层的障碍物; 以及形成在屏障上的p型电极。

    Nitride semiconductor light emitting diode and method of manufacturing the same
    5.
    发明申请
    Nitride semiconductor light emitting diode and method of manufacturing the same 审中-公开
    氮化物半导体发光二极管及其制造方法

    公开(公告)号:US20060033113A1

    公开(公告)日:2006-02-16

    申请号:US11064968

    申请日:2005-02-25

    IPC分类号: H01L33/00

    摘要: The present invention provides a flip chip-type nitride semiconductor light emitting diode. The nitride semiconductor light emitting diode comprises a light transmittance substrate, an n-type nitride semiconductor layer, an active layer, a p-type nitride semiconductor layer and a mesh-type DBR reflecting layer. The mesh-type DBR reflecting layer has a plurality of open regions. The mesh-type DBR reflecting layer is composed of first and second nitride layers having different Al content. The first and second nitride layers are alternately stacked several times to form the mesh-type DBR reflecting layer. An ohmic contact layer is formed on the mesh-type DBR reflecting layer and on the p-type nitride semiconductor layer.

    摘要翻译: 本发明提供一种倒装芯片型氮化物半导体发光二极管。 氮化物半导体发光二极管包括透光性基板,n型氮化物半导体层,有源层,p型氮化物半导体层和网状DBR反射层。 网状DBR反射层具有多个开放区域。 网状DBR反射层由具有不同Al含量的第一和第二氮化物层组成。 第一和第二氮化物层交替堆叠几次以形成网状DBR反射层。 在网状DBR反射层和p型氮化物半导体层上形成欧姆接触层。

    Refrigerator
    6.
    发明申请
    Refrigerator 审中-公开
    冰箱

    公开(公告)号:US20060070395A1

    公开(公告)日:2006-04-06

    申请号:US11143458

    申请日:2005-06-03

    申请人: Jae Lee Jae Lee June Min

    发明人: Jae Lee Jae Lee June Min

    IPC分类号: F25D17/04 F25D17/06

    摘要: A refrigerator capable of adjusting a discharge position and a quantity of cold air discharged into the refrigerator. The refrigerator includes an inner panel installed at a rear surface of a storage chamber and having cold air outlets for forming a cooling channel. The refrigerator also includes a variable duct installed at one of the cold air outlets such that the variable duct can move back and forth to vary a length of the cooling channel, and a plurality of cold air distribution holes formed in the variable duct.

    摘要翻译: 一种能够调节排出位置的冰箱以及排入冰箱的冷气的量。 冰箱包括安装在存储室的后表面的内板,并具有用于形成冷却通道的冷气出口。 冰箱还包括安装在一个冷气出口处的可变管道,使得可变管道可前后移动以改变冷却通道的长度,以及形成在可变管道中的多个冷气分配孔。

    ICE TRAY ASSEMBLY AND REFRIGERATOR HAVING THE SAME
    9.
    发明申请
    ICE TRAY ASSEMBLY AND REFRIGERATOR HAVING THE SAME 审中-公开
    冰箱组件和具有相同功能的冰箱

    公开(公告)号:US20080006048A1

    公开(公告)日:2008-01-10

    申请号:US11770526

    申请日:2007-06-28

    IPC分类号: F25C1/22

    摘要: An ice tray assembly and a refrigerator having the same are disclosed. The ice tray assembly includes an outer case on which a water container is mounted, and an inner case detachably mounted in the outer case to include ice trays which are supplied with water from the water container. The ice tray assembly includes the inner case which is detachable therefrom, thereby facilitating washing. Further, the ice trays can be supplied with water at once without water leakage and ice cubes made in the ice trays can be separated from the ice trays at once.

    摘要翻译: 公开了一种冰盘组件及其制造商。 冰盘组件包括安装有水容器的外壳和可拆卸地安装在外壳中的内壳,以包括从水容器供应水的冰盘。 冰盘组件包括可拆卸的内壳,从而便于洗涤。 此外,冰盘可以一次供水,没有漏水,冰盘中制成的冰块可以与冰盘一次分离。

    Circuit and method for sensing open-circuit lamp of a backlight unit and display device with circuit for sensing open-circuit lamp of backlight unit
    10.
    发明申请
    Circuit and method for sensing open-circuit lamp of a backlight unit and display device with circuit for sensing open-circuit lamp of backlight unit 有权
    用于感测背光单元的开路灯和用于感测背光单元的开路灯的显示装置的电路和方法

    公开(公告)号:US20080001556A1

    公开(公告)日:2008-01-03

    申请号:US11898312

    申请日:2007-09-11

    IPC分类号: H05B41/36

    CPC分类号: H05B41/2855 H05B37/03

    摘要: A circuit for sensing an open-circuit lamp is provided. The circuit includes a reference voltage output unit, a voltage sensor, and a comparator. The reference voltage output unit provides a reference voltage. The voltage sensor detects a sensed voltage corresponding to a status of a lamp. The status of the lamp includes an open-circuit status and a closed-circuit status. The comparator compares the sensed voltage with the reference voltage and outputs a result indicating the status of the lamp.

    摘要翻译: 提供了用于感测开路灯的电路。 电路包括参考电压输出单元,电压传感器和比较器。 参考电压输出单元提供参考电压。 电压传感器检测对应于灯状态的感测电压。 灯的状态包括开路状态和闭路状态。 比较器将检测到的电压与参考电压进行比较,并输出指示灯状态的结果。