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    NORBORNENE-BASED POLYMER HAVING LOW DIELECTRIC CONSTANT AND LOW-LOSS PROPERTIES, AND INSULATING MATERIAL, PRINTED CIRCUIT BOARD AND FUNCTION ELEMENT USING THE SAME
    1.
    发明申请
    NORBORNENE-BASED POLYMER HAVING LOW DIELECTRIC CONSTANT AND LOW-LOSS PROPERTIES, AND INSULATING MATERIAL, PRINTED CIRCUIT BOARD AND FUNCTION ELEMENT USING THE SAME 审中-公开
    具有低介电常数和低损耗特性的NORBENNENE-based聚合物，绝缘材料，印刷电路板和使用其的功能元件

    公开(公告)号：US20100063226A1

    公开(公告)日：2010-03-11

    申请号：US12389086

    申请日：2009-02-19

    申请人： Jae-Choon Cho ,  Do-Yeung Yoon ,  Jun-Rok Oh ,  Hwa-Young Lee ,  Sung-Taek Lim ,  Andreas Greiner

    发明人： Jae-Choon Cho ,  Do-Yeung Yoon ,  Jun-Rok Oh ,  Hwa-Young Lee ,  Sung-Taek Lim ,  Andreas Greiner

    IPC分类号： C08F132/08 ,  C08F2/00

    CPC分类号： C08F132/08 ,  H05K1/032

    摘要： The present invention relates to a to a norbornene-based polymer having a low dielectric constant and low-loss properties, and an insulating material, a printed circuit board and a functional device using the same. More particularly, it relates to a norbornene-based polymer expressed by the following formula (1): wherein, at least one of R1 to R4 is independently substituted or unsubstituted linear C4-C31 arylalkyl or substituted or unsubstituted branched C4-C31 arylalkyl; the rest of R1 to R4 are each and independently H, substituted or unsubstituted linear C1-C3 alkyl, or substituted or unsubstituted branched C1-C3 alkyl; and n is an integer of 250 to 400.

    摘要翻译： 本发明涉及具有低介电常数和低损耗特性的降冰片烯类聚合物，以及绝缘材料，印刷电路板以及使用其的功能元件。 更具体地，涉及由下式（1）表示的降冰片烯系聚合物：其中，R 1〜R 4中的至少一个为独立的取代或未取代的直链C 4 -C 31芳烷基或取代或未取代的支链C 4 -C 31芳烷基; R 1至R 4的其余部分各自独立地为H，取代或未取代的直链C 1 -C 3烷基或取代或未取代的支链C 1 -C 3烷基; n为250〜400的整数。

    Method for manufacturing printed circuit board
    5.
    发明申请
    Method for manufacturing printed circuit board 审中-公开
    印刷电路板制造方法

    公开(公告)号：US20080034581A1

    公开(公告)日：2008-02-14

    申请号：US11889328

    申请日：2007-08-10

    申请人： Seung-Hyun Ra ,  Choon-Keun Lee ,  Sang-Moon Kee ,  Jae-Choon Cho

    发明人： Seung-Hyun Ra ,  Choon-Keun Lee ,  Sang-Moon Kee ,  Jae-Choon Cho

    IPC分类号： H05K3/00

    CPC分类号： H05K3/0014 ,  H05K1/0269 ,  H05K3/005 ,  H05K3/0097 ,  H05K3/107 ,  H05K2201/09063 ,  H05K2201/09918 ,  H05K2203/0108 ,  H05K2203/1536 ,  H05K2203/166 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49155

    摘要： A method for manufacturing a printed circuit board is disclosed. With a method for manufacturing a printed circuit board which includes loading an insulation substrate in which an align mark is formed, loading an imprinting mold in which a first align hole is perforated in correspondence with the align mark, aligning the insulation substrate and the imprinting mold by perceiving the align mark through the first align hole, and compressing the imprinting mold and the insulation substrate together such that the intaglio pattern is formed in correspondence with the raised pattern, it is possible is to use an existing optical system for an imprinting process in aligning an opaque imprinting mold and an insulation substrate, without installing expensive alignment instruments, and to manufacture several insulation substrates having circuit patterns by sequentially loading and aligning several imprinting molds and insulation substrates and compressing simultaneously.

    摘要翻译： 公开了一种印刷电路板的制造方法。 一种印刷电路板的制造方法，其特征在于，包括对形成有对准标记的绝缘基板进行加载的工序，对与所述对准标记对应的第一对准孔加载压印模具，对准所述绝缘基板和所述压印模具 通过感知通过第一对准孔的对准标记，并且将压印模和绝缘衬底压缩在一起，使得与凸起图案对应地形成凹版图案，可以使用现有的光学系统进行印刷过程 对准不透明的压印模具和绝缘基板，而不需要安装昂贵的对准仪器，并且通过依次加载和对准多个压印模具和绝缘基板并同时压缩来制造具有电路图案的多个绝缘基板。

    Method for manufacturing printed circuit board using imprinting
    7.
    发明申请
    Method for manufacturing printed circuit board using imprinting 有权
    使用印记制造印刷电路板的方法

    公开(公告)号：US20080008824A1

    公开(公告)日：2008-01-10

    申请号：US11819720

    申请日：2007-06-28

    申请人： Jae-Choon Cho ,  Myeong-Ho Hong ,  Senug-Hyun Ra ,  Hyuk-Soo Lee ,  Jeong-Bok Kwak ,  Jung-Woo Lee ,  Choon-Keun Lee ,  Sang-Moon Lee

    发明人： Jae-Choon Cho ,  Myeong-Ho Hong ,  Senug-Hyun Ra ,  Hyuk-Soo Lee ,  Jeong-Bok Kwak ,  Jung-Woo Lee ,  Choon-Keun Lee ,  Sang-Moon Lee

    IPC分类号： H05K3/46

    CPC分类号： H05K1/09 ,  H05K3/0014 ,  H05K3/107 ,  H05K2201/0329 ,  H05K2203/0108 ,  H05K2203/0796

    摘要： The present invention relates to a method for manufacturing a printed circuit board, more particularly to a method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board according to certain aspects of the invention as set forth above, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by a new technique of forming conductive polymer wiring using imprinting.

    摘要翻译： 本发明涉及一种印刷电路板的制造方法，更具体地说，涉及一种印刷电路板的制造方法，其中使用压印法在基板上选择性地标记导电聚合物聚合的氧化剂，并且导电的单体 聚合物以选定的图案填充并聚合，以提供导电聚合物布线图案。 根据如上所述的根据本发明的某些方面的印刷电路板的制造方法，印刷电路板可以被给予更细的布线宽度，以允许高度集成的高效印刷电路板。 因此，可以通过使用压印形成导电聚合物布线的新技术，制造适用于工业，文书和家用电子电子产品的印刷电路板（PCB）或柔性印刷电路板（FPCB）。

    Method for manufacturing printed circuit board
    10.
    发明申请
    Method for manufacturing printed circuit board 审中-公开
    印刷电路板制造方法

    公开(公告)号：US20080012168A1

    公开(公告)日：2008-01-17

    申请号：US11826007

    申请日：2007-07-11

    申请人： Senug-Hyun Ra ,  Myeong-Ho Hong ,  Hyuk-Soo Lee ,  Choon-Keun Lee ,  Sang-Moon Lee ,  Jae-Choon Cho ,  Jung-Woo Lee ,  Jeong-Bok Kwak

    发明人： Senug-Hyun Ra ,  Myeong-Ho Hong ,  Hyuk-Soo Lee ,  Choon-Keun Lee ,  Sang-Moon Lee ,  Jae-Choon Cho ,  Jung-Woo Lee ,  Jeong-Bok Kwak

    IPC分类号： B29C43/20

    CPC分类号： B29C43/021 ,  B29C33/303 ,  B29C2043/025 ,  H05K3/0014 ,  H05K3/005 ,  H05K3/107 ,  H05K2203/0108 ,  H05K2203/167

    摘要： A method for manufacturing printed circuit board is disclosed. With a method for manufacturing a printed circuit board which includes: (a) stacking an insulation substrate, in which a first align hole is perforated, onto a support plate, to one side of which a guide pin is joined, such that the guide pin is inserted into the first align hole, where the first align hole is formed in correspondence with the guide pin, (b) stacking an imprinting mold, in which a second align hole is perforated, onto the support plate, such that the guide pin is inserted into the second hole formed in correspondence with the guide pin, and (c) stacking and pressing a pressing plate onto the support plate, and compressing the insulation substrate and the imprinting mold together, where an intaglio pattern is formed in a surface of the insulation substrate facing the imprinting mold, in correspondence with a circuit pattern, and a raised pattern is formed in a surface of the imprinting mold facing the insulation substrate, in correspondence with the circuit pattern, the installation of expensive aligning equipment is unnecessary in aligning an imprinting mold and an insulation substrate, and it is possible to form the intaglio patterns by imprinting on several insulation substrates at the same time by collectively stacking the several imprinting molds and the insulation substrates and compressing, and to prevent defects caused by the expansion and contraction of the insulation substrate which occur during the forming of the intaglio patterns.

    摘要翻译： 公开了印刷电路板的制造方法。 一种用于制造印刷电路板的方法，包括：（a）将其中穿过第一对准孔的绝缘基板堆叠在支撑板上，导向销的一侧被连接到导向销 插入到第一对准孔中，其中第一对准孔对应于引导销形成，（b）将其中穿过第二对准孔的压印模具堆叠到支撑板上，使得引导销 插入到与引导销对应形成的第二孔中，（c）将压板堆叠并按压到支撑板上，并将绝缘基板和压印模压在一起，在该表面上形成凹版图案 绝缘基板面对压印模具，与电路图形对应，并且凸起图案形成在压印模具的面对绝缘基板的表面中，与电路图案对应， 在对准压印模具和绝缘基板时不需要安装昂贵的对准设备，并且可以通过将多个压印模具和绝缘基板共同堆叠同时压印在几个绝缘基板上来形成凹版图案， 并且防止在形成凹版图案期间发生的绝缘基板的膨胀和收缩引起的缺陷。