公开(公告)号：US10179374B2

公开(公告)日：2019-01-15

申请号：US14765074

申请日：2014-02-04

Applicant: James Bovatsek ,  Rajesh Patel

Inventor： James Bovatsek ,  Rajesh Patel

IPC: C03B33/02 ,  B23K26/00 ,  B23K26/40 ,  B23K103/00

Abstract: The present application is directed to a method and apparatus for processing a transparent or semitransparent material with a laser beam resulting in deterministic separation of a single sheet of the material into two or more pieces.

公开(公告)号：US20050226287A1

公开(公告)日：2005-10-13

申请号：US10813269

申请日：2004-03-31

Applicant: Lawrence Shah ,  James Bovatsek ,  Alan Arai ,  Tadashi Yamamoto ,  Rajesh Patel ,  Donald Harter

Inventor： Lawrence Shah ,  James Bovatsek ,  Alan Arai ,  Tadashi Yamamoto ,  Rajesh Patel ,  Donald Harter

IPC: G01J11/00 ,  H01S3/00 ,  H01S3/067 ,  H01S3/10 ,  H01S3/102 ,  H01S3/109 ,  H01S3/13 ,  H01S3/16 ,  H01S3/23

CPC classification number: H01S3/10038 ,  G01J11/00 ,  H01S3/0014 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0064 ,  H01S3/0078 ,  H01S3/06754 ,  H01S3/10023 ,  H01S3/10061 ,  H01S3/102 ,  H01S3/1024 ,  H01S3/108 ,  H01S3/109 ,  H01S3/1305 ,  H01S3/1618

Abstract: A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

Abstract translation: 飞秒激光激光处理系统，具有飞秒激光，变频光学，光束操纵光学，目标运动控制，处理室，诊断系统和系统控制模块。 基于飞秒激光的激光加工系统允许在微加工中利用独特的热控制，并且该系统具有更大的输出光束稳定性，连续可变的重复率和独特的时间波束整形能力。

公开(公告)号：US20070051706A1

公开(公告)日：2007-03-08

申请号：US11517325

申请日：2006-09-08

Applicant: James Bovatsek ,  Alan Arai ,  Fumiyo Yoshino

Inventor： James Bovatsek ,  Alan Arai ,  Fumiyo Yoshino

IPC: B23K26/20

CPC classification number: B23K26/0057 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/244 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B28D5/0011 ,  B29C59/16 ,  B29C65/14 ,  B29C65/1616 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1658 ,  B29C65/1664 ,  B29C65/1674 ,  B29C65/1696 ,  B29C65/38 ,  B29C66/1122 ,  B29C66/30223 ,  B29C66/322 ,  B29C66/3282 ,  B29C66/41 ,  B29C66/43 ,  B29C66/71 ,  B29C66/73366 ,  B29C66/7352 ,  B29C66/73921 ,  B29C66/836 ,  B29C66/91641 ,  B29C66/919 ,  B29C66/934 ,  B29C66/939 ,  B29C66/944 ,  B29C66/949 ,  B29K2033/12 ,  B29K2069/00 ,  B29K2995/0026 ,  B81B1/00 ,  B81C1/00119 ,  C03B23/20 ,  C03B23/203 ,  C03B33/0222 ,  C03C23/0025 ,  Y10T428/13 ,  Y10T428/15 ,  Y10T428/24479 ,  Y10T428/24802 ,  B29C65/00

Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.

Abstract translation: 光学透明材料的超短脉冲激光加工方法。 用于划线透明材料的方法使用超短激光脉冲来产生多个划线特征，其中激光束通过该材料的单次通过，其中至少一个划线特征形成在材料表面下方。 这样可以以比传统技术更高的速度清洁透明材料。 稍微修改超短脉冲激光加工条件会产生次表面痕迹。 当正确布置时，这些标记在侧面照明下清晰可见，并且在没有侧面照明的情况下不清晰可见。 此外，用于焊接透明材料的方法使用超短激光脉冲通过局部加热产生粘结。 超短脉冲持续时间导致激光辐射的非线性吸收，并且激光器的高重复率导致材料内的脉冲 - 脉冲积累的热量。 激光聚焦在材料界面附近，在待焊接的区域产生高能量通量。 这可以最大限度地减少对其余材料的损坏，并能实现细焊缝。

公开(公告)号：US09138913B2

公开(公告)日：2015-09-22

申请号：US12397567

申请日：2009-03-04

Applicant: Alan Y. Arai ,  Gyu C. Cho ,  Jingzhou Xu ,  Fumiyo Yoshino ,  Haibin Zhang ,  James Bovatsek ,  Makoto Yoshida

Inventor： Alan Y. Arai ,  Gyu C. Cho ,  Jingzhou Xu ,  Fumiyo Yoshino ,  Haibin Zhang ,  James Bovatsek ,  Makoto Yoshida

IPC: B23K26/00 ,  B64D47/06 ,  B41J2/435 ,  B29C35/08 ,  B28D5/00 ,  B23K26/06 ,  B23K26/40 ,  B29C65/00 ,  B29C65/16 ,  B29C65/38

CPC classification number: B23K26/0624 ,  B23K26/0676 ,  B23K26/083 ,  B23K26/0869 ,  B23K26/21 ,  B23K26/324 ,  B23K26/359 ,  B23K26/364 ,  B23K26/40 ,  B23K26/402 ,  B23K26/53 ,  B23K26/55 ,  B23K2103/50 ,  B23K2103/54 ,  B28D5/00 ,  B28D5/0011 ,  B29C65/1606 ,  B29C65/1612 ,  B29C65/1619 ,  B29C65/1629 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1654 ,  B29C65/1658 ,  B29C65/1687 ,  B29C65/38 ,  B29C66/1122 ,  B29C66/43 ,  B29C66/71 ,  B29C66/73161 ,  B29C66/73366 ,  B29C66/73921 ,  B29C66/836 ,  B29C66/952 ,  B29K2995/0026 ,  B41M5/26 ,  B41M5/262 ,  B41M5/267 ,  C03B23/006 ,  C03B33/102 ,  C03C23/0025 ,  H01L21/268 ,  H01L21/78 ,  B29K2069/00

Abstract: Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are presented, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create multiple scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces different types of sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination through either light scattering or light reflection and nearly invisible without illumination. Transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.

Abstract translation: 介绍了光学透明材料超短脉冲激光加工的方法，装置和系统，其中包括划线，标记，焊接和接合等应用。 例如，超短激光脉冲通过激光束穿过材料而产生多个刻划特征，其中至少一个刻划特征形成在材料表面下方。 稍微修改超短脉冲激光加工条件产生不同类型的子表面标记。 当正确布置时，这些标记通过光散射或光反射通过正确对准的照明而清晰可见，并且几乎不可见而不照射。 可以使用玻璃以外的透明材料。 用于焊接透明材料的方法使用超短激光脉冲通过局部加热产生粘结。 在透明材料处理的一些实施例中，多焦点光束发生器同时形成相对于透明材料沿深度方向间隔开的多个光束束，从而提高处理速度。

公开(公告)号：US08314359B2

公开(公告)日：2012-11-20

申请号：US12580762

申请日：2009-10-16

Applicant: James Bovatsek ,  Alan Y. Arai ,  Fumiyo Yoshino

Inventor： James Bovatsek ,  Alan Y. Arai ,  Fumiyo Yoshino

IPC: B23K26/24 ,  B23K26/32

CPC classification number: B23K26/0057 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/244 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B28D5/0011 ,  B29C59/16 ,  B29C65/14 ,  B29C65/1616 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1658 ,  B29C65/1664 ,  B29C65/1674 ,  B29C65/1696 ,  B29C65/38 ,  B29C66/1122 ,  B29C66/30223 ,  B29C66/322 ,  B29C66/3282 ,  B29C66/41 ,  B29C66/43 ,  B29C66/71 ,  B29C66/73366 ,  B29C66/7352 ,  B29C66/73921 ,  B29C66/836 ,  B29C66/91641 ,  B29C66/919 ,  B29C66/934 ,  B29C66/939 ,  B29C66/944 ,  B29C66/949 ,  B29K2033/12 ,  B29K2069/00 ,  B29K2995/0026 ,  B81B1/00 ,  B81C1/00119 ,  C03B23/20 ,  C03B23/203 ,  C03B33/0222 ,  C03C23/0025 ,  Y10T428/13 ,  Y10T428/15 ,  Y10T428/24479 ,  Y10T428/24802 ,  B29C65/00

Abstract: Methods and systems for ultrashort pulse laser processing of optically transparent materials are disclosed. At least one embodiment includes a method for welding materials with ultrashort laser pulses to create a bond through localized heating, at least one material being transparent at a laser wavelength. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating sufficiently high fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines. In various implementations the laser is focused near the sub-surface interface between two materials, generating high fluence at the region proximate to the laser focus with minimal modification to the surrounding region, including areas above and below the laser beam waist.

Abstract translation: 公开了用于光学透明材料的超短脉冲激光加工的方法和系统。 至少一个实施例包括用超短激光脉冲焊接材料以通过局部加热产生结合的方法，至少一种材料在激光波长下是透明的。 超短脉冲持续时间导致激光辐射的非线性吸收，并且激光器的高重复率导致材料内的脉冲 - 脉冲积累的热量。 激光聚焦在材料的界面附近，在待焊接的区域产生足够高的注量。 这可以最大限度地减少对其余材料的损坏，并能实现细焊缝。 在各种实施方案中，激光聚焦在两个材料之间的子表面界面附近，在靠近激光焦点的区域处产生高注量，对周围区域（包括激光束腰部上方和下方的区域）进行最小修改。

公开(公告)号：US20100025387A1

公开(公告)日：2010-02-04

申请号：US12397567

申请日：2009-03-04

Applicant: Alan Y. Arai ,  Gyu C. Cho ,  Jingzhou Xu ,  Fumiyo Yoshino ,  Haibin Zhang ,  James Bovatsek ,  Makoto Yoshida

Inventor： Alan Y. Arai ,  Gyu C. Cho ,  Jingzhou Xu ,  Fumiyo Yoshino ,  Haibin Zhang ,  James Bovatsek ,  Makoto Yoshida

IPC: B23K26/06 ,  B23K26/00 ,  B23K26/38

CPC classification number: B23K26/0624 ,  B23K26/0676 ,  B23K26/083 ,  B23K26/0869 ,  B23K26/21 ,  B23K26/324 ,  B23K26/359 ,  B23K26/364 ,  B23K26/40 ,  B23K26/402 ,  B23K26/53 ,  B23K26/55 ,  B23K2103/50 ,  B23K2103/54 ,  B28D5/00 ,  B28D5/0011 ,  B29C65/1606 ,  B29C65/1612 ,  B29C65/1619 ,  B29C65/1629 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1654 ,  B29C65/1658 ,  B29C65/1687 ,  B29C65/38 ,  B29C66/1122 ,  B29C66/43 ,  B29C66/71 ,  B29C66/73161 ,  B29C66/73366 ,  B29C66/73921 ,  B29C66/836 ,  B29C66/952 ,  B29K2995/0026 ,  B41M5/26 ,  B41M5/262 ,  B41M5/267 ,  C03B23/006 ,  C03B33/102 ,  C03C23/0025 ,  H01L21/268 ,  H01L21/78 ,  B29K2069/00

Abstract: Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.

Abstract translation: 公开了用于光学透明材料的超短脉冲激光加工的方法，装置和系统，例如在划线，标记，焊接和接合中的应用。 例如，超短激光脉冲通过激光束穿过材料产生一次划线特征，其中至少一个划线特征形成在材料表面下方。 稍微修改超短脉冲激光加工条件会产生次表面痕迹。 正确布置时，这些标记在正确对齐的照明下清晰可见。 还可以通过激光参数的控制来形成反射标记。 可以使用玻璃以外的透明材料。 用于焊接透明材料的方法使用超短激光脉冲通过局部加热产生粘结。 在透明材料处理的一些实施例中，多焦点光束发生器同时形成相对于透明材料沿深度方向间隔开的多个光束束，从而提高处理速度。

公开(公告)号：US07626138B2

公开(公告)日：2009-12-01

申请号：US11517325

申请日：2006-09-08

Applicant: James Bovatsek ,  Alan Y. Arai ,  Fumiyo Yoshino

Inventor： James Bovatsek ,  Alan Y. Arai ,  Fumiyo Yoshino

IPC: B23K26/00

CPC classification number: B23K26/0057 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/244 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B28D5/0011 ,  B29C59/16 ,  B29C65/14 ,  B29C65/1616 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1658 ,  B29C65/1664 ,  B29C65/1674 ,  B29C65/1696 ,  B29C65/38 ,  B29C66/1122 ,  B29C66/30223 ,  B29C66/322 ,  B29C66/3282 ,  B29C66/41 ,  B29C66/43 ,  B29C66/71 ,  B29C66/73366 ,  B29C66/7352 ,  B29C66/73921 ,  B29C66/836 ,  B29C66/91641 ,  B29C66/919 ,  B29C66/934 ,  B29C66/939 ,  B29C66/944 ,  B29C66/949 ,  B29K2033/12 ,  B29K2069/00 ,  B29K2995/0026 ,  B81B1/00 ,  B81C1/00119 ,  C03B23/20 ,  C03B23/203 ,  C03B33/0222 ,  C03C23/0025 ,  Y10T428/13 ,  Y10T428/15 ,  Y10T428/24479 ,  Y10T428/24802 ,  B29C65/00

Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.

Abstract translation: 光学透明材料的超短脉冲激光加工方法。 用于划线透明材料的方法使用超短激光脉冲来产生多个划线特征，其中激光束通过该材料的单次通过，其中至少一个划线特征形成在材料表面下方。 这样可以以比传统技术更高的速度清洁透明材料。 稍微修改超短脉冲激光加工条件会产生次表面痕迹。 当正确布置时，这些标记在侧面照明下清晰可见，并且在没有侧面照明的情况下不清晰可见。 此外，用于焊接透明材料的方法使用超短激光脉冲通过局部加热产生粘结。 超短脉冲持续时间导致激光辐射的非线性吸收，并且激光器的高重复率导致材料内的脉冲 - 脉冲积累的热量。 激光聚焦在材料界面附近，在待焊接的区域产生高能量通量。 这可以最大限度地减少对其余材料的损坏，并能实现细焊缝。

公开(公告)号：US08530786B2

公开(公告)日：2013-09-10

申请号：US12571598

申请日：2009-10-01

Applicant: James Bovatsek ,  Alan Y. Arai ,  Fumiyo Yoshino

Inventor： James Bovatsek ,  Alan Y. Arai ,  Fumiyo Yoshino

IPC: B23K26/00

CPC classification number: B23K26/0057 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/244 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B28D5/0011 ,  B29C59/16 ,  B29C65/14 ,  B29C65/1616 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1658 ,  B29C65/1664 ,  B29C65/1674 ,  B29C65/1696 ,  B29C65/38 ,  B29C66/1122 ,  B29C66/30223 ,  B29C66/322 ,  B29C66/3282 ,  B29C66/41 ,  B29C66/43 ,  B29C66/71 ,  B29C66/73366 ,  B29C66/7352 ,  B29C66/73921 ,  B29C66/836 ,  B29C66/91641 ,  B29C66/919 ,  B29C66/934 ,  B29C66/939 ,  B29C66/944 ,  B29C66/949 ,  B29K2033/12 ,  B29K2069/00 ,  B29K2995/0026 ,  B81B1/00 ,  B81C1/00119 ,  C03B23/20 ,  C03B23/203 ,  C03B33/0222 ,  C03C23/0025 ,  Y10T428/13 ,  Y10T428/15 ,  Y10T428/24479 ,  Y10T428/24802 ,  B29C65/00

Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.

公开(公告)号：US08389891B2

公开(公告)日：2013-03-05

申请号：US12580739

申请日：2009-10-16

Applicant: James Bovatsek ,  Alan Y. Arai ,  Fumiyo Yoshino

Inventor： James Bovatsek ,  Alan Y. Arai ,  Fumiyo Yoshino

IPC: B23K26/38 ,  B23K26/40

CPC classification number: B23K26/0057 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/244 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B28D5/0011 ,  B29C59/16 ,  B29C65/14 ,  B29C65/1616 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1658 ,  B29C65/1664 ,  B29C65/1674 ,  B29C65/1696 ,  B29C65/38 ,  B29C66/1122 ,  B29C66/30223 ,  B29C66/322 ,  B29C66/3282 ,  B29C66/41 ,  B29C66/43 ,  B29C66/71 ,  B29C66/73366 ,  B29C66/7352 ,  B29C66/73921 ,  B29C66/836 ,  B29C66/91641 ,  B29C66/919 ,  B29C66/934 ,  B29C66/939 ,  B29C66/944 ,  B29C66/949 ,  B29K2033/12 ,  B29K2069/00 ,  B29K2995/0026 ,  B81B1/00 ,  B81C1/00119 ,  C03B23/20 ,  C03B23/203 ,  C03B33/0222 ,  C03C23/0025 ,  Y10T428/13 ,  Y10T428/15 ,  Y10T428/24479 ,  Y10T428/24802 ,  B29C65/00

Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.

公开(公告)号：US20060207976A1

公开(公告)日：2006-09-21

申请号：US11336383

申请日：2006-01-20

Applicant: James Bovatsek ,  Alan Arai ,  Lawrence Shah ,  Fumiyo Yoshino

Inventor： James Bovatsek ,  Alan Arai ,  Lawrence Shah ,  Fumiyo Yoshino

IPC: B23K26/38 ,  B23K26/06

CPC classification number: B23K26/0624 ,  B23K26/0006 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/172 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  C03B33/0222 ,  H01S3/0057

Abstract: Various embodiments of a system described herein relate to micromachining materials using ultrashort visible laser pulses. The ultrashort laser pulses may be green and have a wavelength between about 500 to 550 nanometers in some embodiments. Additionally, the pulses may have a pulse duration of less than one picosecond in certain embodiments.

Abstract translation: 本文描述的系统的各种实施例涉及使用超短可见激光脉冲的微加工材料。 在一些实施例中，超短激光脉冲可以是绿色的并且具有在约500至550纳米之间的波长。 另外，在某些实施例中，脉冲可以具有小于1皮秒的脉冲持续时间。