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1.发明授权Methods and systems for thermal-based laser processing a multi-material device 有权用于热基激光加工多材料装置的方法和系统公开(公告)号：US07394476B2
公开(公告)日：2008-07-01
申请号：US11415547
申请日：2006-05-02
申请人： James J. Cordingley , Jonathan S. Ehrmann , Joseph J. Griffiths , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
发明人： James J. Cordingley , Jonathan S. Ehrmann , Joseph J. Griffiths , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
CPC分类号： B23K26/0736 , B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/10 , B23K26/16 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/50 , H01L21/485 , H01L21/76888 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
摘要翻译： 提供一种用于局部处理形成在基板上的预定微结构而不引起基板或其上形成在基板上的其它结构的电学或物理特性的不期望的变化的方法和系统。 该方法包括基于与预定微结构，衬底和其它结构的激光脉冲相互作用的模型来提供信息。 基于该信息确定至少一个脉冲的至少一个特性。 生成包括至少一个脉冲的脉冲激光束。 该方法还包括将具有至少一个确定特性的至少一个脉冲照射到预定微结构上的点中。 所述至少一个脉冲的至少一个确定的特征和其它特征足以在不引起不期望的变化的情况下局部地处理预定的微结构。
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2.发明授权Laser-based method and system for removing one or more target link structures 有权用于去除一个或多个目标链路结构的基于激光的方法和系统公开(公告)号：US08253066B2
公开(公告)日：2012-08-28
申请号：US12950969
申请日：2010-11-19
申请人： Bo Gu , Donald V. Smart , James J. Cordingley , Joohan Lee , Donald J. Svetkoff , Shepard D. Johnson , Jonathan S. Ehrmann
发明人： Bo Gu , Donald V. Smart , James J. Cordingley , Joohan Lee , Donald J. Svetkoff , Shepard D. Johnson , Jonathan S. Ehrmann
IPC分类号： H01S3/10
CPC分类号： B23K26/0626 , B23K26/04 , B23K26/0624 , B23K26/0736 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/50 , H01L21/485 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.
摘要翻译： 设置用于去除在衬底上制造的电路的一个或多个目标链路结构的基于激光的方法和系统包括产生具有小于衬底的吸收边缘的预定波长的脉冲激光输出。 激光输出包括脉冲持续时间在约10皮秒至小于1纳秒范围内的至少一个脉冲，脉冲持续时间在热激光器处理范围内。 该方法还包括将激光输出传送和聚焦到目标链路结构上。 聚焦的激光输出在目标链路结构内的位置处具有足够的功率密度，以减少目标链路结构的反射率，并将聚焦的激光输出有效地耦合到目标链路结构中以去除目标链路结构而不损坏基板。
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3.发明申请LASER-BASED METHOD AND SYSTEM FOR REMOVING ONE OR MORE TARGET LINK STRUCTURES 有权基于激光的方法和系统，用于删除一个或多个目标链结构公开(公告)号：US20110062127A1
公开(公告)日：2011-03-17
申请号：US12950969
申请日：2010-11-19
申请人： Bo Gu , Donald V. Smart , James J. Cordingley , Joohan Lee , Donald J. Svetkoff , Shepard D. Johnson , Jonathan S. Ehrmann
发明人： Bo Gu , Donald V. Smart , James J. Cordingley , Joohan Lee , Donald J. Svetkoff , Shepard D. Johnson , Jonathan S. Ehrmann
IPC分类号： B23K26/40
CPC分类号： B23K26/0626 , B23K26/04 , B23K26/0624 , B23K26/0736 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/50 , H01L21/485 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.
摘要翻译： 设置用于去除在衬底上制造的电路的一个或多个目标链路结构的基于激光的方法和系统包括产生具有小于衬底的吸收边缘的预定波长的脉冲激光输出。 激光输出包括脉冲持续时间在约10皮秒至小于1纳秒范围内的至少一个脉冲，脉冲持续时间在热激光器处理范围内。 该方法还包括将激光输出传送和聚焦到目标链路结构上。 聚焦的激光输出在目标链路结构内的位置处具有足够的功率密度，以减少目标链路结构的反射率，并将聚焦的激光输出有效地耦合到目标链路结构中以去除目标链路结构而不损坏基板。
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4.发明申请METHODS AND SYSTEMS FOR THERMA-BASED LASER PROCESSING A MULTI-MATERIAL DEVICE 有权用于基于激光加工的多种材料的方法和系统公开(公告)号：US20080284837A1
公开(公告)日：2008-11-20
申请号：US12165853
申请日：2008-07-01
申请人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
发明人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
CPC分类号： B23K26/0736 , B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/10 , B23K26/16 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/50 , H01L21/485 , H01L21/76888 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
摘要翻译： 提供一种用于局部处理形成在基板上的预定微结构而不引起基板或其上形成在基板上的其它结构的电学或物理特性的不期望的变化的方法和系统。 该方法包括基于与预定微结构，衬底和其它结构的激光脉冲相互作用的模型来提供信息。 基于该信息确定至少一个脉冲的至少一个特性。 生成包括至少一个脉冲的脉冲激光束。 该方法还包括将具有至少一个确定特性的至少一个脉冲照射到预定微结构上的点中。 所述至少一个脉冲的至少一个确定的特征和其它特征足以在不引起不期望的变化的情况下局部地处理预定的微结构。
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5.发明授权Laser-based method and system for removing one or more target link structures 有权用于去除一个或多个目标链路结构的基于激光的方法和系统公开(公告)号：US07838794B2
公开(公告)日：2010-11-23
申请号：US11700386
申请日：2007-01-31
申请人： Bo Gu , Donald V. Smart , James J. Cordingley , Joohan Lee , Donald J. Svetkoff , Shepard D. Johnson , Jonathan S. Ehrmann
发明人： Bo Gu , Donald V. Smart , James J. Cordingley , Joohan Lee , Donald J. Svetkoff , Shepard D. Johnson , Jonathan S. Ehrmann
CPC分类号： B23K26/0626 , B23K26/04 , B23K26/0624 , B23K26/0736 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/50 , H01L21/485 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.
摘要翻译： 设置用于去除在衬底上制造的电路的一个或多个目标链路结构的基于激光的方法和系统包括产生具有小于衬底的吸收边缘的预定波长的脉冲激光输出。 激光输出包括脉冲持续时间在约10皮秒至小于1纳秒范围内的至少一个脉冲，脉冲持续时间在热激光器处理范围内。 该方法还包括将激光输出传送和聚焦到目标链路结构上。 聚焦的激光输出在目标链路结构内的位置处具有足够的功率密度，以减少目标链路结构的反射率，并将聚焦的激光输出有效地耦合到目标链路结构中以去除目标链路结构而不损坏基板。
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6.发明授权公开(公告)号：US07723642B2
公开(公告)日：2010-05-25
申请号：US10683086
申请日：2003-10-10
申请人： Bo Gu , Donald V. Smart , James J. Cordingley , Joohan Lee , Donald J. Svetkoff , Shepard D. Johnson , Jonathan S. Ehrmann
发明人： Bo Gu , Donald V. Smart , James J. Cordingley , Joohan Lee , Donald J. Svetkoff , Shepard D. Johnson , Jonathan S. Ehrmann
CPC分类号： H01L23/5258 , B23K26/04 , B23K26/0624 , B23K26/0736 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/50 , H01L21/485 , H01L21/76894 , H01L22/12 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.
摘要翻译： 基于激光的去除在衬底上制造的电路的目标链路结构的方法包括以小于衬底的吸收边缘的预定波长产生脉冲激光输出。 激光输出包括脉冲持续时间在约10皮秒至小于1纳秒范围内的至少一个脉冲，脉冲持续时间在热激光器处理范围内。 该方法还包括将激光输出传送和聚焦到目标链路结构上。 聚焦的激光输出在目标结构内的位置处具有足够的功率密度，以减小目标结构的反射率，并将聚焦的激光输出有效地耦合到目标结构中以去除连接而不损坏基板。
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7.发明授权Methods and systems for thermal-based laser processing a multi-material device 有权用于热基激光加工多材料装置的方法和系统公开(公告)号：US08809734B2
公开(公告)日：2014-08-19
申请号：US13541320
申请日：2012-07-03
申请人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
发明人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
IPC分类号： H01L21/00 , B23K26/067 , B23K26/08
CPC分类号： B23K26/0736 , B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/10 , B23K26/16 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/50 , H01L21/485 , H01L21/76888 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
摘要翻译： 提供一种用于局部处理形成在基板上的预定微结构而不引起基板或其上形成在基板上的其它结构的电学或物理特性的不期望的变化的方法和系统。 该方法包括基于与预定微结构，衬底和其它结构的激光脉冲相互作用的模型来提供信息。 基于该信息确定至少一个脉冲的至少一个特性。 生成包括至少一个脉冲的脉冲激光束。 该方法还包括将具有至少一个确定特性的至少一个脉冲照射到预定微结构上的点中。 所述至少一个脉冲的至少一个确定的特征和其它特征足以在不引起不期望的变化的情况下局部地处理预定的微结构。
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8.发明申请METHODS AND SYSTEMS FOR THERMAL-BASED LASER PROCESSING A MULTI-MATERIAL DEVICE 有权用于基于热的激光加工多物质装置的方法和系统公开(公告)号：US20120276754A1
公开(公告)日：2012-11-01
申请号：US13541320
申请日：2012-07-03
申请人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
发明人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
IPC分类号： H01L21/263 , B23K26/00
CPC分类号： B23K26/0736 , B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/10 , B23K26/16 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/50 , H01L21/485 , H01L21/76888 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
摘要翻译： 提供一种用于局部处理形成在基板上的预定微结构而不引起基板或其上形成在基板上的其它结构的电学或物理特性的不期望的变化的方法和系统。 该方法包括基于与预定微结构，衬底和其它结构的激光脉冲相互作用的模型来提供信息。 基于该信息确定至少一个脉冲的至少一个特性。 生成包括至少一个脉冲的脉冲激光束。 该方法还包括将具有至少一个确定特性的至少一个脉冲照射到预定微结构上的点中。 所述至少一个脉冲的至少一个确定的特征和其它特征足以在不引起不期望的变化的情况下局部地处理预定的微结构。
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9.发明授权Methods and systems for thermal-based laser processing a multi-material device 有权用于热基激光加工多材料装置的方法和系统公开(公告)号：US08217304B2
公开(公告)日：2012-07-10
申请号：US10107890
申请日：2002-03-27
申请人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
发明人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
IPC分类号： B23K26/08 , B23K26/067 , H01L21/00
CPC分类号： B23K26/0736 , B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/10 , B23K26/16 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/50 , H01L21/485 , H01L21/76888 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
摘要翻译： 提供一种用于局部处理形成在基板上的预定微结构而不引起基板或其上形成在基板上的其它结构的电学或物理特性的不期望的变化的方法和系统。 该方法包括基于与预定微结构，衬底和其它结构的激光脉冲相互作用的模型来提供信息。 基于该信息确定至少一个脉冲的至少一个特性。 生成包括至少一个脉冲的脉冲激光束。 该方法还包括将具有至少一个确定特性的至少一个脉冲照射到预定微结构上的点中。 所述至少一个脉冲的至少一个确定的特征和其它特征足以在不引起不期望的变化的情况下局部地处理预定的微结构。
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公开(公告)号：US07955905B2
公开(公告)日：2011-06-07
申请号：US11643023
申请日：2006-12-20
申请人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
发明人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
CPC分类号： B23K26/0736 , B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/10 , B23K26/16 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/50 , H01L21/485 , H01L21/76888 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
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