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13 条记录 (耗时 0.02 秒)

    Laser processing of conductive links
    1.
    发明授权
    Laser processing of conductive links 有权
    导电连接的激光加工

    公开(公告)号：US08106329B2

    公开(公告)日：2012-01-31

    申请号：US12121684

    申请日：2008-05-15

    申请人： Bo Gu ,  Joseph J. Griffiths ,  Joohan Lee

    发明人： Bo Gu ,  Joseph J. Griffiths ,  Joohan Lee

    IPC分类号： H01L21/268 ,  G02F1/01

    CPC分类号： B23K26/073 ,  B23K26/06 ,  B23K26/0624 ,  B23K26/36 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/12 ,  B23K2103/50 ,  H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A laser system for processing conductive link structures includes a seed laser generating a seed laser beam. The seed laser is sliced by a modulator into a user configurable series of pulses and the pulses are optically amplified and applied to a conductive link structure. Preferably, the bandwidth of the seed laser is less than 1 nm with an IR center frequency, and the frequency of the laser light of the pulses is doubled or quadrupled prior to application to the conductive structure. Preferably, the pulses are about 1-18 second pulsewidth and are separated by 100-400 ns.

    摘要翻译： 用于处理导电链路结构的激光系统包括产生种子激光束的种子激光器。 种子激光器由调制器切片成用户可配置的一系列脉冲，并且脉冲被光学放大并应用于导电连接结构。 优选地，种子激光器的带宽具有IR中心频率小于1nm，并且在施加到导电结构之前，脉冲的激光频率加倍或增加了四倍。 优选地，脉冲是大约1-18秒的脉冲宽度并且被隔开100-400ns。

    LASER PROCESSING WITH ORIENTED SUB-ARRAYS
    8.
    发明申请
    LASER PROCESSING WITH ORIENTED SUB-ARRAYS 审中-公开
    具有面向对象的子阵列的激光加工

    公开(公告)号：US20110297851A1

    公开(公告)日：2011-12-08

    申请号：US13153928

    申请日：2011-06-06

    申请人： William Lauer ,  Jonathan S. Ehrmann ,  Joseph J. Griffiths

    发明人： William Lauer ,  Jonathan S. Ehrmann ,  Joseph J. Griffiths

    IPC分类号： G21K5/00

    CPC分类号： B23K26/0676 ,  B23K26/0006 ,  B23K26/06 ,  B23K26/067 ,  B23K26/36 ,  B23K2103/56 ,  H01L21/02686 ,  H01L21/02691 ,  H01L23/525 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In a system for severing conductive links by laser irradiation to repair electronic devices, multiple laser beams are deflected at high-speed to target selected links for processing by positioning laser spots in a two dimensional pattern during relative motion of a substrate and a beam delivery system. As link targeting flexibility is increased, selection may be required from a large number of addressable link pairs. Various embodiments advantageously use beam deflection and beam splitting to improve memory repair processing rates.

    摘要翻译： 在用于通过激光照射来切断导电连接以修复电子设备的系统中，多个激光束在基板和光束传送系统的相对运动期间以高速偏转到目标所选择的链接以进行处理，其中定位激光斑点为二维图案 。 随着链路定向灵活性的增加，可能需要从大量可寻址链路对中进行选择。 各种实施例有利地使用光束偏转和光束分割来改善存储器修复处理速率。

    Laser processing of conductive links
    10.
    发明授权
    Laser processing of conductive links 有权
    导电连接的激光加工

    公开(公告)号：US08847110B2

    公开(公告)日：2014-09-30

    申请号：US13359879

    申请日：2012-01-27

    申请人： Bo Gu ,  Joseph J. Griffiths ,  Joohan Lee

    发明人： Bo Gu ,  Joseph J. Griffiths ,  Joohan Lee

    IPC分类号： B23K26/06 ,  B23K26/36 ,  B23K26/073 ,  B23K26/40 ,  H01L23/525

    CPC分类号： B23K26/073 ,  B23K26/06 ,  B23K26/0624 ,  B23K26/36 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/12 ,  B23K2103/50 ,  H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A laser system for processing conductive link structures includes a seed laser generating a seed laser beam. The seed laser is sliced by a modulator into a user configurable series of pulses and the pulses are optically amplified and applied to a conductive link structure. Preferably, the bandwidth of the seed laser is less than 1 nm with an IR center frequency, and the frequency of the laser light of the pulses is doubled or quadrupled prior to application to the conductive structure. Preferably, the pulses are about 1-18 nanosecond pulsewidth and are separated by 100-400 nanoseconds.

    摘要翻译： 用于处理导电链路结构的激光系统包括产生种子激光束的种子激光器。 种子激光器由调制器切片成用户可配置的一系列脉冲，并且脉冲被光学放大并应用于导电连接结构。 优选地，种子激光器的带宽具有IR中心频率小于1nm，并且在施加到导电结构之前，脉冲的激光频率加倍或增加了四倍。 优选地，脉冲为约1-18纳秒脉冲宽度，并分隔100-400纳秒。