摘要:
The invention relates to a method for making a handle wafer (20′) for microelectronic functional wafers, including at least one transparent window (22, 24) for viewing through the thickness of the handle wafer, this method including: a) the making of at least one cavity (21, 23) in said handle wafer, b) the formation of at least one viewing window in said cavity on an alignment or receiving surface.
摘要:
A handle wafer for microelectronic functional wafers, including at least one cavity through the thickness of the wafer, this cavity including a viewing window in solid or solidified material.
摘要:
A microcavity structure including: a first substrate, a cover attached to the first substrate such that a space formed between the cover and the first substrate forms the microcavity, at least one hole passing through the cover, and at least one closing flap of the hole placed inside the microcavity and including at least two portions of materials with different thermal expansion coefficients placed one against the other, at least one first end of the two portions being mechanically linked to the cover, at least a second end of the two portions being free, and at least a part of the closing flap being placed opposite the hole, the two portions being capable of closing or not the hole under the effect of a temperature variation.
摘要:
Microcavity structure comprising: a substrate, a cover attached to the substrate such that a space formed between the cover and the substrate forms the microcavity, at least one hole passing through the cover, and at least one closing flap for the hole placed inside the microcavity and comprising at least two portions of materials with different thermal expansion coefficients placed one against the other, one first end of said two portions being mechanically linked to the cover, a second end of said two portions being free, and at least a part of the closing flap being placed opposite the hole, said two portions being suitable for closing or not the hole under the effect of a variation of temperature.
摘要:
Process for making a device comprising at least the following steps: produce a getter structure comprising at least one portion of getter material permeable to gas covered by at least one protective layer hermetic to gas; hermetic encapsulation of the getter structure in a cavity; production of at least one local opening passing through the protective layer and forming an access to the portion of getter material permeable to gas.
摘要:
A process for manufacturing a structure equipped with at least one electrical contact, including forming on a substrate a first layer, forming on a front side of the first layer the structure equipped with at least one electrical contact, forming at least one hole though the substrate revealing a rear side of the first layer, and forming an electrical contact to the rear side in a cavity overhung by an edge of the at least one hole closest to the first layer, the edge allowing for electrical insulation of the electrical contact from the substrate.
摘要:
A method for forming a micro-optical or sub-micro-optical device is provided, including: forming a photolithographic mask on a transparent support, depositing a layer of a photosensitive material of negative polarity on the face, a so called front face, of the support which supports the mask, wherein the mask is disposed under the areas where the photosensitive material should be removed, insolating the layer of the photosensitive material through the rear face of the support, developing the photosensitive material in order to obtain walls of micron or submicron cavities, removing the mask areas located at the bottom of the cavities in order to obtain cavities without any mask material between the walls, introducing a fluid into the cavities of the device, and forming a closure layer on the walls in photosensitive material.
摘要:
A method for producing a micromechanical and/or nanomechanical device includes partial etching of at least one sacrificial layer arranged between a first layer and a substrate, forming at least one cavity in which is arranged at least one portion of the sacrificial layer in contact with the first layer and/or the substrate. The method also includes chemical transformation of at least one wall of the first layer and/or the substrate in the cavity, delimiting at least one stop in the first layer and/or the substrate at the level of the portion of the sacrificial layer. The portion of the sacrificial layer and the chemically transformed wall of the first layer and/or the substrate is also eliminated.
摘要:
A mechanical microstructure including a deformable first layer overhanging a second layer and defining a cavity set back from an external face of the deformable first layer and having an abutment stud projecting into the cavity, in which a wire is connected to a portion of an internal face of the deformable first layer. The portion of the first layer is opposite a bottom area of the cavity into which the abutment stud projects, but the abutment stud remains at a distance from the deformable first layer. A method of producing the mechanical microstructure is also disclosed.
摘要:
A getter structure including at least one portion of getter material at least one face of which is positioned against at least one portion of gas-permeable material such that said portion of getter material is able to achieve a gaseous absorption and/or adsorption at least by said face through at least said portion of gas-permeable material, and in which the portion of gas-permeable material includes one or more channels made at the level of a face of said portion of gas-permeable material which is in contact with the portion of getter material, where the portion of getter material is able to achieve a gaseous absorption, or a gaseous adsorption, or both a gaseous absorption and a gaseous adsorption, via the channel or channels.