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1.发明申请Method of Assembling a Member on a Support by Sintering a Mass of Conductive Powder 有权通过烧结大量导电粉末来组装支撑件上的部件的方法公开(公告)号：US20100176098A1
公开(公告)日：2010-07-15
申请号：US12598359
申请日：2008-04-23
CPC分类号： H01L24/75 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/29294 , H01L2224/29339 , H01L2224/32225 , H01L2224/75 , H01L2224/75745 , H01L2224/83047 , H01L2224/83192 , H01L2224/83203 , H01L2224/83208 , H01L2224/8384 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01061 , H01L2924/01079 , H01L2924/014 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： In this method, the conductive powder mass is placed on the support, and then the member is placed on the mass and a compression force is applied, urging the member against the mass and the support before heating the mass. The magnitude is increased from an initial value to a first predefined value for agglomerating the mass, which value is less than a plastic deformation threshold of the powder mass. Then, the magnitude is maintained at the first predefined value throughout a predetermined duration for agglomerating the powder mass. Finally, the magnitude is increased from the first value to a second predefined value less than a critical threshold for damaging the member but greater than a minimum threshold for sintering the mass at the predetermined temperature, the second predefined value being greater than the first predefined value.
摘要翻译： 在该方法中，将导电粉体放置在支撑体上，然后将构件放置在质量块上并施加压力，在加热物料之前将构件推向质量块和支撑体。 大小从初始值增加到第一预定值，用于使质量聚集，该值小于粉末质量的塑性变形阈值。 然后，在整个预定的持续时间内将大小保持在第一预定值，以使粉末团聚。 最后，将大小从第一值增加到小于临界阈值的第二预定值，该临界阈值损坏该构件但大于在预定温度下烧结质量的最小阈值，第二预定义值大于第一预定义值 。
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2.发明申请Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other 审中-公开通过添加材料将构件接合到支撑件的方法，以及用于布置两个元件的装置公开(公告)号：US20100089879A1
公开(公告)日：2010-04-15
申请号：US12310907
申请日：2007-09-11
CPC分类号： B23K1/20 , B23K1/0056 , B23K3/08 , B23K26/20 , B23K37/0408 , B23K2101/40 , H01L24/75 , H01L2924/12042 , H05K3/341 , H05K3/3478 , H05K3/3484 , H05K2203/0195 , H05K2203/0278 , H05K2203/0415 , H05K2203/082 , H05K2203/107 , H05K2203/163 , Y02P70/613 , H01L2924/00
摘要： A method having a step of heating a mass forming a braze. Before the heating step, the method includes steps of arranging the mass and the member on the support. In particular, it includes a step of positioning the mass on the support and a step of applying a first compressive force on the mass so as to compress said mass against the support, the intensity of the first force increasing up to a predetermined first value chosen so as to flatten the mass. Next, the method includes a step of positioning the member on the flattened mass and a step of applying a second compressive force to the member so as to compress said member against the flattened mass and the support, the intensity of the second force increasing up to a second predefined value, the second predefined value being lower than the first predefined value.
摘要翻译： 一种具有加热形成钎焊的质量的步骤的方法。 在加热步骤之前，该方法包括将质量块和构件布置在支撑件上的步骤。 特别地，其包括将质量定位在支撑件上的步骤以及在质量块上施加第一压缩力以将所述质量压靠支撑件的步骤，第一力的强度增加到预定的第一值 以平坦化质量。 接下来，该方法包括将构件定位在平坦体上的步骤以及向构件施加第二压缩力以将压缩构件压靠在平坦体和支撑体上的步骤，第二力的强度增加到 第二预定义值，所述第二预定义值低于所述第一预定义值。
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3.发明授权Method of assembling a member on a support by sintering a mass of conductive powder 有权通过烧结大量导电粉末将构件组装在支撑体上的方法公开(公告)号：US08444913B2
公开(公告)日：2013-05-21
申请号：US12598359
申请日：2008-04-23
CPC分类号： H01L24/75 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/29294 , H01L2224/29339 , H01L2224/32225 , H01L2224/75 , H01L2224/75745 , H01L2224/83047 , H01L2224/83192 , H01L2224/83203 , H01L2224/83208 , H01L2224/8384 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01061 , H01L2924/01079 , H01L2924/014 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： In this method, the conductive powder mass is placed on the support, and then the member is placed on the mass and a compression force is applied, urging the member against the mass and the support before heating the mass. The magnitude is increased from an initial value to a first predefined value for agglomerating the mass, which value is less than a plastic deformation threshold of the powder mass. Then, the magnitude is maintained at the first predefined value throughout a predetermined duration for agglomerating the powder mass. Finally, the magnitude is increased from the first value to a second predefined value less than a critical threshold for damaging the member but greater than a minimum threshold for sintering the mass at the predetermined temperature, the second predefined value being greater than the first predefined value.
摘要翻译： 在该方法中，将导电粉体放置在支撑体上，然后将构件放置在质量块上并施加压力，在加热物料之前将构件推向质量块和支撑体。 大小从初始值增加到第一预定值，用于使质量聚集，该值小于粉末质量的塑性变形阈值。 然后，在整个预定的持续时间内将大小保持在第一预定值，以使粉末团聚。 最后，将大小从第一值增加到小于临界阈值的第二预定值，该临界阈值损坏该构件但大于在预定温度下烧结质量的最小阈值，第二预定义值大于第一预定义值 。
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公开(公告)号：US08916963B2
公开(公告)日：2014-12-23
申请号：US13498919
申请日：2010-10-07
申请人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hervé Lorin , Patrick Dubus
发明人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hervé Lorin , Patrick Dubus
IPC分类号： H01L23/34 , H05K3/30 , H05K7/00 , H01L23/498 , H01L23/00 , H01L23/36 , H01L25/18 , H01L25/07 , H05K1/14 , H01L23/10 , H05K3/00
CPC分类号： H05K1/144 , H01L23/10 , H01L23/36 , H01L23/49833 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/72 , H01L24/73 , H01L25/074 , H01L25/18 , H01L2224/0231 , H01L2224/0233 , H01L2224/02335 , H01L2224/0401 , H01L2224/13099 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/732 , H01L2924/00014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H05K3/0061 , H05K2201/042 , H05K2201/1053 , Y10T29/4913 , H01L2224/13 , H01L2224/72 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention relates to a power module (10), preferably for a vehicle, in particular an electric vehicle, characterized in that said module includes two vertically adjacent semiconducting chips (12, 14), each chip having a first surface (20, 22) to be connected to a heat sink substrate (24, 26), and a second surface (28, 30) separate from the first and on which at least one electronic component (38a-44b) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.
摘要翻译： 本发明涉及一种优选用于车辆，特别是电动车辆的功率模块（10），其特征在于，所述模块包括两个垂直相邻的半导体芯片（12,14），每个芯片具有第一表面（20,22） 连接到散热器基板（24,26），以及与第一表面分开并且在其上布置至少一个电子部件（38a-44b）的第二表面（28,30），该模块被布置成使得 芯片的第二表面彼此相对布置。
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公开(公告)号：US08958209B2
公开(公告)日：2015-02-17
申请号：US13499378
申请日：2010-10-07
申请人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hérve Lorin
发明人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hérve Lorin
CPC分类号： H05K1/0206 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L2224/4846 , H01L2224/48472 , H05K1/056 , H05K1/09 , H05K3/0061 , H05K2201/0323 , H05K2201/10166 , Y10T29/49155
摘要： Said electronic power module (10) includes: a stack (14) comprising a metal layer forming an electric circuit (26) and intended for supporting an electronic power component (18) such as a semiconductor; a metal body forming a heat drain (20); and a dielectric material layer (22) forming an electric insulator and inserted between the electric circuit (26) and the heat drain (20). The stack (14) includes a composite material body (24) having a carbon-charged metal matrix. The carbon charge is between 20 and 60 volume percent. Said composite body (24) is inserted between an area of the electric circuit (26) and the electric insulator (22), said area being intended for supporting the electronic power component (18).
摘要翻译： 所述电子功率模块（10）包括：堆叠（14），包括形成电路（26）的金属层并且用于支撑诸如半导体的电子功率部件（18）; 形成散热器（20）的金属体; 以及形成电绝缘体并插入在电路（26）和散热器（20）之间的电介质材料层（22）。 叠层（14）包括具有带碳金属基体的复合材料体（24）。 碳电荷为20至60体积％。 所述复合体（24）插入在电路（26）的区域和电绝缘体（22）之间，所述区域用于支撑电子功率部件（18）。
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公开(公告)号：US20120268895A1
公开(公告)日：2012-10-25
申请号：US13499378
申请日：2010-10-07
申请人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hervé Lorin
发明人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hervé Lorin
CPC分类号： H05K1/0206 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L2224/4846 , H01L2224/48472 , H05K1/056 , H05K1/09 , H05K3/0061 , H05K2201/0323 , H05K2201/10166 , Y10T29/49155
摘要： Said electronic power module (10) includes: a stack (14) comprising a metal layer forming an electric circuit (26) and intended for supporting an electronic power component (18) such as a semiconductor; a metal body forming a heat drain (20); and a dielectric material layer (22) forming an electric insulator and inserted between the electric circuit (26) and the heat drain (20). The stack (14) includes a composite material body (24) having a carbon-charged metal matrix. The carbon charge is between 20 and 60 volume percent. Said composite body (24) is inserted between an area of the electric circuit (26) and the electric insulator (22), said area being intended for supporting the electronic power component (18).
摘要翻译： 所述电子功率模块（10）包括：堆叠（14），包括形成电路（26）的金属层并且用于支撑诸如半导体的电子功率部件（18）; 形成散热器（20）的金属体; 以及形成电绝缘体并插入在电路（26）和散热器（20）之间的电介质材料层（22）。 叠层（14）包括具有带碳金属基体的复合材料体（24）。 碳电荷为20至60体积％。 所述复合体（24）插入在电路（26）的区域和电绝缘体（22）之间，所述区域用于支撑电子功率部件（18）。
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公开(公告)号：US09167703B2
公开(公告)日：2015-10-20
申请号：US12576542
申请日：2009-10-09
CPC分类号： H05K3/34 , B23K1/0056 , B23K3/0607 , B23K2101/36 , H01L24/75 , H01L2924/12042 , H05K3/341 , H05K3/3494 , H05K2201/10969 , H05K2203/0195 , H05K2203/0415 , H05K2203/107 , H05K2203/163 , Y02P70/613 , Y10T29/49144 , Y10T29/53174 , Y10T29/53178 , H01L2924/00
摘要： In this method, a vertical stack is formed on an axis coinciding substantially with the gravity direction and comprising, from top to bottom: the element; the mass in a solid state; and the substrate. The mass is then heated so as to cause it to pass into a liquid state enabling it to spread on the substrate. More particularly, after the stack has been formed, the element is left free to move vertically, and during heating, variation in the vertical position of the element is measured.
摘要翻译： 在该方法中，垂直堆叠形成在与重力方向基本重合的轴上，并且包括从顶部到底部的元件; 质量处于固体状态; 和基板。 然后将该质量加热以使其进入液态，使其能够在基底上扩散。 更具体地说，在堆叠已经形成之后，元件可以自由地垂直移动，并且在加热期间，测量元件的垂直位置的变化。
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公开(公告)号：US20120235290A1
公开(公告)日：2012-09-20
申请号：US13498919
申请日：2010-10-07
申请人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hervé Lorin , Patrick Dubus
发明人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hervé Lorin , Patrick Dubus
IPC分类号： H01L23/488 , H01L21/50
CPC分类号： H05K1/144 , H01L23/10 , H01L23/36 , H01L23/49833 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/72 , H01L24/73 , H01L25/074 , H01L25/18 , H01L2224/0231 , H01L2224/0233 , H01L2224/02335 , H01L2224/0401 , H01L2224/13099 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/732 , H01L2924/00014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H05K3/0061 , H05K2201/042 , H05K2201/1053 , Y10T29/4913 , H01L2224/13 , H01L2224/72 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention relates to a power module (10), preferably for a vehicle, in particular an electric vehicle, characterised in that said module includes two vertically adjacent semiconducting chips (12, 14), each chip having a first surface (20, 22) to be connected to a heat sink substrate (24, 26), and a second surface (28, 30) separate from the first and on which at least one electronic component (38a-44b) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.
摘要翻译： 本发明涉及一种优选用于车辆，特别是电动车辆的功率模块（10），其特征在于，所述模块包括两个垂直相邻的半导体芯片（12,14），每个芯片具有第一表面（20,22） 连接到散热器基板（24,26），以及与第一表面分开并且在其上布置至少一个电子部件（38a-44b）的第二表面（28,30），该模块被布置成使得 芯片的第二表面彼此相对布置。
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